| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
FPGA |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
3.6 V |
144 |
CMOS |
96 |
2000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
70 °C (158 °F) |
2.7 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 2000-3000 |
e0 |
270 MHz |
30 s |
96 |
225 °C (437 °F) |
20 mm |
|||||
|
|
Xilinx |
FPGA |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
9152 |
Yes |
AEC-Q100 |
102 |
1.2,2.5/3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
No |
e3 |
62.5 MHz |
102 |
||||||||||||||||||||
|
|
Xilinx |
FPGA |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
784 |
13000 |
3.3 |
Flatpack, Fine Pitch |
3 V |
.5 mm |
784 CLBS, 13000 Gates |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
|||||||||||||||||||
|
|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
2.625 V |
3456 |
661111 |
2.5 |
Flatpack |
2.375 V |
.65 mm |
0.8 ns |
3456 CLBS, 661111 Gates |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e3 |
250 MHz |
20 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
3 V |
.65 mm |
1.3 ns |
784 CLBS, 13000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 20000 Logic gates |
e0 |
200 MHz |
30 s |
224 |
225 °C (437 °F) |
28 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
80 |
1500 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.1 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Max usable 2000 Logic gates |
e0 |
135 MHz |
30 s |
80 |
240 °C (464 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack |
.65 mm |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
28 mm |
||||||||||||||||||||||||||||
|
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1296 |
CMOS |
22000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1 ns |
1296 CLBS, 22000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can also use 65000 gates |
e3 |
263 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
|
|
Xilinx |
FPGA |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1936 |
CMOS |
33000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
1.1 ns |
1936 CLBS, 33000 Gates |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Can also use 100000 gates |
e3 |
227 MHz |
32 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
15552 |
Yes |
2.625 V |
3456 |
CMOS |
166 |
661111 |
2.5 |
1.2/3.6,2.5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
0.7 ns |
3456 CLBS, 661111 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
294 MHz |
30 s |
166 |
225 °C (437 °F) |
32 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
20 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
2.625 V |
4704 |
888439 |
2.5 |
Flatpack |
2.375 V |
.65 mm |
85 °C (185 °F) |
0.6 ns |
4704 CLBS, 888439 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e0 |
333 MHz |
20 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
2304 |
Yes |
3.6 V |
2304 |
CMOS |
384 |
40000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.5 ns |
2304 CLBS, 40000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Max usable 62000 Logic gates |
e0 |
179 MHz |
30 s |
384 |
225 °C (437 °F) |
32 mm |
||||||||
|
|
Xilinx |
FPGA |
Automotive |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.26 V |
192 |
AEC-Q100 |
124 |
50000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
125 °C (257 °F) |
192 CLBS, 50000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
125 MHz |
30 s |
124 |
260 °C (500 °F) |
14 mm |
||||||
|
|
Xilinx |
FPGA |
Other |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1024 |
CMOS |
18000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1 ns |
1024 CLBS, 18000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
263 MHz |
32 mm |
|||||||||||||
|
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
576 |
CMOS |
10000 |
5 |
Flatpack, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates 30000 |
e3 |
166 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
|
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
196 CLBS, 6000 Gates |
Quad |
S-PQFP-G176 |
1.6 mm |
24 mm |
No |
Typical gates = 6000-10000 |
24 mm |
|||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1862 |
Yes |
3.6 V |
784 |
CMOS |
193 |
13000 |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Can also use 40000 gates |
e0 |
263 MHz |
30 s |
193 |
225 °C (437 °F) |
32 mm |
|||||
|
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
3888 |
Yes |
1.89 V |
864 |
CMOS |
265 |
52000 |
1.8 |
1.2/3.6,1.8 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.47 ns |
864 CLBS, 52000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates = 150000 |
e3 |
357 MHz |
30 s |
265 |
245 °C (473 °F) |
28 mm |
||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
3136 |
CMOS |
55000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
1 ns |
3136 CLBS, 55000 Gates |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
263 MHz |
28 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.25 V |
64 |
CMOS |
2000 |
5 |
Flatpack |
4.75 V |
.65 mm |
70 °C (158 °F) |
9 ns |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.1496 mm |
14 mm |
No |
MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C |
70 MHz |
20 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
1600 |
Yes |
3.6 V |
1600 |
CMOS |
320 |
27000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.5 ns |
1600 CLBS, 27000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Max usable 44000 Logic gates |
e0 |
179 MHz |
30 s |
320 |
225 °C (437 °F) |
28 mm |
|||||
|
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
3.6 V |
64 |
CMOS |
1000 |
3.3 |
Flatpack |
3 V |
.65 mm |
85 °C (185 °F) |
1.2 ns |
64 CLBS, 1000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 1600 Logic gates |
e3 |
217 MHz |
30 s |
245 °C (473 °F) |
20 mm |
||||||||||
|
Xilinx |
FPGA |
Gull Wing |
240 |
HLFQFP |
Square |
Plastic/Epoxy |
1296 |
Yes |
CMOS |
288 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
No |
e0 |
294 MHz |
30 s |
288 |
225 °C (437 °F) |
||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
1024 |
CMOS |
18000 |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
4.5 V |
.5 mm |
1024 CLBS, 18000 Gates |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
28 mm |
||||||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
32 mm |
|||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Metal |
576 |
Yes |
5.5 V |
576 |
CMOS |
192 |
10000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
85 °C (185 °F) |
6 ns |
576 CLBS, 10000 Gates |
-40 °C (-40 °F) |
Quad |
S-MQFP-G208 |
1 |
3.68 mm |
27.64 mm |
No |
1536 flip-flops; typical gates = 10000-13000 |
90.9 MHz |
192 |
27.64 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
15552 |
Yes |
2.625 V |
3456 |
CMOS |
166 |
661111 |
2.5 |
1.2/3.6,2.5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.7 ns |
3456 CLBS, 661111 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
294 MHz |
30 s |
166 |
225 °C (437 °F) |
32 mm |
||||||
|
Xilinx |
FPGA |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
2.625 V |
384 |
CMOS |
166 |
57906 |
2.5 |
1.2/3.6,2.5 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
0.6 ns |
384 CLBS, 57906 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
333 MHz |
30 s |
166 |
225 °C (437 °F) |
32 mm |
|||||||||
|
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
28 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
10000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
576 CLBS, 10000 Gates |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
20 mm |
||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
3078 |
Yes |
3.6 V |
1296 |
CMOS |
193 |
22000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
1296 CLBS, 22000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Max usable 36000 Logic gates |
e0 |
217 MHz |
30 s |
193 |
225 °C (437 °F) |
32 mm |
|||||
|
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
3000 |
3.3 |
Flatpack |
3 V |
.65 mm |
85 °C (185 °F) |
1.3 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 5000 Logic gates |
e3 |
200 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
100 |
Yes |
CMOS |
80 |
5 |
5 V |
Flatpack |
QFP100,.7X.9,32 |
Field Programmable Gate Arrays |
.8 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
No |
e0 |
30 s |
80 |
225 °C (437 °F) |
||||||||||||||||
|
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
2304 |
CMOS |
40000 |
3.3 |
Flatpack, Heat Sink/Slug |
3 V |
.65 mm |
85 °C (185 °F) |
1 ns |
2304 CLBS, 40000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
e3 |
263 MHz |
28 mm |
||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
14 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
5.25 V |
576 |
CMOS |
196 |
10000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates 30000 |
e0 |
166 MHz |
30 s |
196 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
466 |
Yes |
3.6 V |
196 |
CMOS |
112 |
3000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 5000 Logic gates |
e0 |
217 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack |
.65 mm |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
28 mm |
|||||||||||||||||||||||||||
|
|
Xilinx |
FPGA |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
576 |
CMOS |
10000 |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
4.5 V |
.5 mm |
1.6 ns |
576 CLBS, 10000 Gates |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Max usable 13000 Logic gates |
e3 |
125 MHz |
32 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
608 |
Yes |
5.5 V |
256 |
CMOS |
128 |
5000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
85 °C (185 °F) |
6 ns |
256 CLBS, 5000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
3.92 mm |
28 mm |
No |
768 flip-flops; typical gates = 5000-6000 |
e0 |
90.9 MHz |
30 s |
128 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
28 mm |
|||||||||||||||||||||||||||
|
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
28 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
5.25 V |
144 |
CMOS |
82 |
2000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.1 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Typical gates = 2000-3000 |
e0 |
188 MHz |
30 s |
82 |
240 °C (464 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
FQFP |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
80 |
2000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
70 °C (158 °F) |
2.7 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.75 mm |
14 mm |
No |
MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700 |
e0 |
270 MHz |
30 s |
80 |
225 °C (437 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
FQFP |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
80 |
2000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
70 °C (158 °F) |
3.3 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.75 mm |
14 mm |
No |
MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700 |
e0 |
230 MHz |
30 s |
80 |
225 °C (437 °F) |
14 mm |
|||||
|
|
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Typical gates = 6000-10000 |
e3 |
14 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
240 |
HLFQFP |
Square |
Plastic/Epoxy |
1024 |
Yes |
3.47 V |
1024 |
CMOS |
256 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
3.14 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
No |
e0 |
256 |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.