Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
FPGA |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
85 °C (185 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQCC-J68 |
3 |
4.572 mm |
24.2316 mm |
No |
Also Operates at 5 V supply |
80 MHz |
24.2316 mm |
|||||||||||||
Microchip Technology |
FPGA |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Chip Carrier |
3 V |
1.27 mm |
85 °C (185 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
3 |
4.572 mm |
24.2316 mm |
No |
Also Operates at 5 V supply |
e0 |
80 MHz |
20 s |
225 °C (437 °F) |
24.2316 mm |
|||||||||||
Microchip Technology |
FPGA |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Chip Carrier |
3 V |
1.27 mm |
70 °C (158 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
4.572 mm |
24.2316 mm |
No |
Also Operates at 5 V supply |
e0 |
80 MHz |
24.2316 mm |
||||||||||||||
Microsemi |
FPGA |
Military |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Chip Carrier |
3 V |
1.27 mm |
125 °C (257 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
3 |
4.572 mm |
24.2316 mm |
No |
Also Operates at 5 V supply |
e0 |
80 MHz |
24.2316 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Military |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
125 °C (257 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQCC-J68 |
3 |
4.572 mm |
24.2316 mm |
No |
Also Operates at 5 V supply |
e3 |
80 MHz |
24.2316 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
684 |
CMOS |
14000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
85 °C (185 °F) |
2.5 ns |
684 CLBS, 14000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e3 |
117 MHz |
30 s |
245 °C (473 °F) |
29.3116 mm |
|||||||||
|
Microchip Technology |
FPGA |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
70 °C (158 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J68 |
3 |
4.572 mm |
24.2316 mm |
No |
Also Operates at 5 V supply |
e3 |
80 MHz |
24.2316 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
684 |
Yes |
5.5 V |
CMOS |
104 |
5 |
3.3,3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
3 |
29.21 mm |
No |
104 |
29.21 mm |
|||||||||||||||
|
Microchip Technology |
FPGA |
Military |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
684 |
CMOS |
14000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
125 °C (257 °F) |
2.5 ns |
684 CLBS, 14000 Gates |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e3 |
117 MHz |
29.3116 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
684 |
CMOS |
14000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
70 °C (158 °F) |
2.5 ns |
684 CLBS, 14000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e3 |
117 MHz |
29.3116 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Automotive |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
684 |
CMOS |
14000 |
5 |
Tube |
Chip Carrier |
4.75 V |
1.27 mm |
125 °C (257 °F) |
2 ns |
684 CLBS, 14000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Can also be operated at 5.0 V supply |
e3 |
174 MHz |
29.3116 mm |
|||||||||||
Microsemi |
FPGA |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
684 |
CMOS |
14000 |
3.3 |
Chip Carrier |
3 V |
1.27 mm |
70 °C (158 °F) |
2.5 ns |
684 CLBS, 14000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e0 |
117 MHz |
20 s |
225 °C (437 °F) |
29.3116 mm |
|||||||||||
Microchip Technology |
FPGA |
Automotive |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
684 |
Yes |
5.25 V |
336 |
CMOS |
104 |
14000 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
125 °C (257 °F) |
2 ns |
336 CLBS, 14000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Can also be operated at 3 V supply |
e0 |
174 MHz |
104 |
29.3116 mm |
|||||||
Microsemi |
FPGA |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
684 |
Yes |
3.6 V |
684 |
CMOS |
14000 |
3.3 |
Chip Carrier |
3 V |
1.27 mm |
85 °C (185 °F) |
2.5 ns |
684 CLBS, 14000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e0 |
117 MHz |
20 s |
225 °C (437 °F) |
29.3116 mm |
||||||||||
Microsemi |
FPGA |
Military |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
684 |
CMOS |
14000 |
3.3 |
Chip Carrier |
3 V |
1.27 mm |
125 °C (257 °F) |
2.5 ns |
684 CLBS, 14000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e0 |
117 MHz |
29.3116 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1232 |
CMOS |
24000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
85 °C (185 °F) |
2.8 ns |
1232 CLBS, 24000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e3 |
94 MHz |
30 s |
245 °C (473 °F) |
29.3116 mm |
|||||||||
Xilinx |
FPGA |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
320 |
Yes |
5.5 V |
320 |
CMOS |
70 |
5000 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
5.1 ns |
320 CLBS, 5000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Max usable 6000 Logic gates |
e0 |
113 MHz |
30 s |
70 |
225 °C (437 °F) |
29.3116 mm |
||||||||
|
Microsemi |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
295 |
CMOS |
1200 |
5 |
Chip Carrier |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4.5 ns |
295 CLBS, 1200 Gates |
-40 °C (-40 °F) |
Tin |
Quad |
S-PQCC-J44 |
3 |
4.445 mm |
16.51 mm |
No |
MAX 34 I/OS |
e3 |
16.51 mm |
|||||||||||||
Microsemi |
FPGA |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1232 |
CMOS |
24000 |
3.3 |
Chip Carrier |
3 V |
1.27 mm |
70 °C (158 °F) |
4 ns |
1232 CLBS, 24000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e0 |
56 MHz |
29.3116 mm |
|||||||||||||
Xilinx |
FPGA |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
64 |
Yes |
5.5 V |
64 |
CMOS |
58 |
2000 |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
64 CLBS, 2000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQCC-J68 |
1 |
4.699 mm |
24.2316 mm |
No |
MAX 58 I/OS; 256 flip-flops |
50 MHz |
58 |
24.2316 mm |
||||||||||
Rochester Electronics |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
2000 |
5 |
Chip Carrier |
4.75 V |
1.27 mm |
70 °C (158 °F) |
3.3 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.318 mm |
16.5862 mm |
No |
MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700 |
230 MHz |
16.5862 mm |
||||||||||||||||
Rochester Electronics |
FPGA |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
2000 |
5 |
Chip Carrier |
4.75 V |
1.27 mm |
70 °C (158 °F) |
3.3 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J68 |
1 |
4.445 mm |
24.2316 mm |
No |
MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700 |
230 MHz |
24.2316 mm |
|||||||||||||||
Rochester Electronics |
FPGA |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
2000 |
5 |
Chip Carrier |
4.75 V |
1.27 mm |
70 °C (158 °F) |
3.3 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J84 |
4.699 mm |
29.3116 mm |
No |
MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700 |
230 MHz |
29.3116 mm |
||||||||||||||||
Rochester Electronics |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
2000 |
5 |
Chip Carrier |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4.1 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.318 mm |
16.5862 mm |
No |
MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700 |
190 MHz |
16.5862 mm |
||||||||||||||||
|
Microchip Technology |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
70 °C (158 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Also Operates at 5 V supply |
e3 |
80 MHz |
16.5862 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
85 °C (185 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Also Operates at 5 V supply |
e3 |
80 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
|||||||||
|
Microchip Technology |
FPGA |
Military |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
125 °C (257 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Also Operates at 5 V supply |
e3 |
80 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
|||||||||
Xilinx |
FPGA |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
58 |
2000 |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
70 °C (158 °F) |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
S-PQCC-J68 |
1 |
4.699 mm |
24.2316 mm |
No |
MAX 58 I/OS; 256 flip-flops |
50 MHz |
58 |
24.2316 mm |
||||||||||
Microsemi |
FPGA |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1232 |
CMOS |
24000 |
3.3 |
Chip Carrier |
3 V |
1.27 mm |
70 °C (158 °F) |
2.8 ns |
1232 CLBS, 24000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e0 |
94 MHz |
29.3116 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1232 |
CMOS |
24000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
70 °C (158 °F) |
2.8 ns |
1232 CLBS, 24000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e3 |
94 MHz |
29.3116 mm |
|||||||||||
Xilinx |
FPGA |
Other |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
74 |
1000 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
85 °C (185 °F) |
10 ns |
100 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
174 flip-flops; typical gates = 1000-1500 |
e0 |
70 MHz |
30 s |
74 |
225 °C (437 °F) |
29.3116 mm |
|||||
Xilinx |
FPGA |
Other |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
324 |
Yes |
5.25 V |
324 |
CMOS |
196 |
10000 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
85 °C (185 °F) |
5.6 ns |
324 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
MAX available 16000 Logic gates |
e0 |
83 MHz |
30 s |
196 |
225 °C (437 °F) |
29.3116 mm |
|||||
Xilinx |
FPGA |
Other |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
74 |
1500 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
85 °C (185 °F) |
5.1 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Max usable 2000 Logic gates |
e0 |
113 MHz |
30 s |
74 |
225 °C (437 °F) |
29.3116 mm |
|||||
Xilinx |
FPGA |
Other |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
238 |
Yes |
5.25 V |
100 |
CMOS |
61 |
2500 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
85 °C (185 °F) |
6 ns |
100 CLBS, 2500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
360 flip-flops; typical gates = 2500-3000 |
e0 |
90.9 MHz |
30 s |
61 |
225 °C (437 °F) |
29.3116 mm |
|||||
Lucent Technologies |
FPGA |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
58 |
1500 |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
9 ns |
100 CLBS, 1500 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
No |
Typical gates = 1500-2000 |
e0 |
70 MHz |
58 |
|||||||||||
Xilinx |
FPGA |
Other |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
58 |
600 |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
85 °C (185 °F) |
10 ns |
64 CLBS, 600 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
1 |
4.445 mm |
24.2316 mm |
No |
122 flip-flops; typical gates = 600-1000 |
e0 |
70 MHz |
58 |
24.2316 mm |
|||||||
Xilinx |
FPGA |
Other |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
58 |
1000 |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Field Programmable Gate Arrays |
4.75 V |
1.27 mm |
85 °C (185 °F) |
5.1 ns |
64 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J68 |
3 |
5.08 mm |
24.2316 mm |
No |
Max usable 1500 Logic gates |
e0 |
113 MHz |
30 s |
58 |
225 °C (437 °F) |
24.2316 mm |
|||||
Xilinx |
FPGA |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
58 |
1500 |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
5.1 ns |
100 CLBS, 1500 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
3 |
5.08 mm |
24.2316 mm |
No |
Max usable 2000 Logic gates |
e0 |
113 MHz |
58 |
24.2316 mm |
|||||||
Xilinx |
FPGA |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
74 |
1500 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
5.1 ns |
100 CLBS, 1500 Gates |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Max usable 2000 Logic gates |
e0 |
113 MHz |
30 s |
74 |
225 °C (437 °F) |
29.3116 mm |
|||||
Xilinx |
FPGA |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
64 |
Yes |
5.5 V |
64 |
CMOS |
84 |
2000 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
3 ns |
64 CLBS, 2000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Typical gates = 2000-3000 |
e0 |
83 MHz |
30 s |
84 |
225 °C (437 °F) |
29.3116 mm |
||||||||
|
Microchip Technology |
FPGA |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
295 |
CMOS |
3000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
85 °C (185 °F) |
2.7 ns |
295 CLBS, 3000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQCC-J68 |
3 |
4.572 mm |
24.2316 mm |
No |
Also Operates at 5 V supply |
80 MHz |
24.2316 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
70 °C (158 °F) |
3.7 ns |
547 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Also Operates at 5 V supply |
e3 |
48 MHz |
16.5862 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
547 |
CMOS |
6000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
85 °C (185 °F) |
2.7 ns |
547 CLBS, 6000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e3 |
80 MHz |
30 s |
245 °C (473 °F) |
29.3116 mm |
|||||||||
|
Microchip Technology |
FPGA |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
1866 |
Yes |
3.6 V |
1890 |
CMOS |
176 |
36000 |
3.3 |
Tube |
3.3,3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
3 V |
1.27 mm |
70 °C (158 °F) |
2.5 ns |
1890 CLBS, 36000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e3 |
176 |
29.3116 mm |
||||||
|
Microchip Technology |
FPGA |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1890 |
CMOS |
36000 |
3.3 |
Tube |
Chip Carrier |
3 V |
1.27 mm |
85 °C (185 °F) |
2.5 ns |
1890 CLBS, 36000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
No |
Also Operates at 5 V supply |
e3 |
91.8 MHz |
30 s |
245 °C (473 °F) |
29.3116 mm |
|||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Field Programmable Gate Arrays |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-J68 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
295 |
Yes |
5.5 V |
295 |
CMOS |
57 |
1200 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Field Programmable Gate Arrays |
4.5 V |
1.27 mm |
85 °C (185 °F) |
17.82 ns |
295 CLBS, 1200 Gates |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
MAX 34 I/OS; 130 flip-flops |
100 MHz |
57 |
16.5862 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.