1020 Field Programmable Gate Arrays (FPGA) 356

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
HC20K1500FC33	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	51840	Yes			CMOS	808		1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3			No	e0			808	220 °C (428 °F)
EP1SGX40FF1020I5N	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e1					33 mm
EP1SGX25FF1020I6ES	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm					Tin Lead	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e0					33 mm
EP1S25F1020C6ES	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020				No	e0
EP1SGX25FF1020I6	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	607	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)		2852 CLBS	-65 °C (-85 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0		20 s	607	220 °C (428 °F)	33 mm
EP1SGX25DF1020I7ES	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm					Tin Lead	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e0					33 mm
EP1SGX40FF1020C7N	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e1					33 mm
EP1S80F1020I6	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy	79040	Yes	1.575 V		CMOS	1238	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm					Tin Lead	Bottom	S-PBGA-B1020	3			No	e0			1238	220 °C (428 °F)
EP1S80F1020C5ES	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020				No	e0
EP1S60F1020I6	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy	57120	Yes	1.575 V		CMOS	1018	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm					Tin Lead	Bottom	S-PBGA-B1020	3			No	e0		20 s	1018	220 °C (428 °F)
EP1SGX10DF1020C7N	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e1					33 mm
EP1S40F1020C7N	Altera	FPGA	Commercial Extended	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	818	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,31X31,50	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		4697 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e1		40 s	818	245 °C (473 °F)	33 mm
HC20K1000FC33	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	38400	Yes			CMOS	708		1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3			No	e0			708	220 °C (428 °F)
EP1SGX25CF1020I5ES	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm					Tin Lead	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e0					33 mm
EP1SGX10DF1020I7ES	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm					Tin Lead	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e0					33 mm
EP2S90F1020C4	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	90960	Yes	1.25 V	36384	CMOS	758	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	36384 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0	717 MHz	20 s	750	220 °C (428 °F)	33 mm
EP1SGX25CF1020I7N	Altera	FPGA	Military	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V		CMOS	607	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)			-65 °C (-85 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e1		40 s	607	245 °C (473 °F)	33 mm
EP1SGX25GF1020C5ES	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e0					33 mm
EP1S80F1020C7ES	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020				No	e0
EP1S30F1020I6ES	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1020				No	e0

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.