1157 Field Programmable Gate Arrays (FPGA) 152

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCE7VX330T-1FFV1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG	600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	25500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1157		3.35 mm	35 mm					600		35 mm
XC7VX330T-2FFV1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25500			1		Grid Array			.97 V	1 mm		0.61 ns	25500 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm		e1					35 mm
XC7V2000T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes		305400					Grid Array				1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7VX485T-1LFFG1157C	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes		75900					Grid Array				1 mm	85 °C (185 °F)		75900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4		35 mm	No	e1					35 mm
XC7VX415T-3FFV1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32200			1		Grid Array			.97 V	1 mm		0.58 ns	32200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm		e1					35 mm
XCE7VX330T-L2FFG1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG	600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XC7V855T-3FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XQ7VX330T-1RF1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG	600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	25500 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1157		3.48 mm	35 mm		e0			600		35 mm
XC7V855T-2FFG1157C	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7V1500T-1LFFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes		229050					Grid Array				1 mm	125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7V285T-3FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7V2000T-1LFFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes		305400					Grid Array				1 mm	100 °C (212 °F)		305400 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7V2000T-3FFG1157C	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400			1		Grid Array			.97 V	1 mm	85 °C (185 °F)		305400 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7V585T-2FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	CMOS	600	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	45525 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX330T-1FFG1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS	600	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7V2000T-3FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400			1		Grid Array			.97 V	1 mm	100 °C (212 °F)		305400 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7V585T-3FFG1157C	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes		91050					Grid Array				1 mm			91050 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XCE7VX330T-2FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG	600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XC7VX330T-2FFV1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25500			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm		e1					35 mm
XQ7V585T-1RF1157M	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	HKMG	600	1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	45525 CLBS	-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1157		3.48 mm	35 mm		e0			600		35 mm
XC7VX415T-2FFV1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32200			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm		e1					35 mm
XC7V2000T-1FFG1157C	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400			1		Grid Array			.97 V	1 mm	85 °C (185 °F)		305400 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XQ7V585T-2RF1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	HKMG	600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	45525 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1157		3.48 mm	35 mm		e0			600		35 mm
XC7V1500T-2FFG1157C	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes		229050					Grid Array				1 mm			229050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7VX690T-L2FFG1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	600	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	54150 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm	No	e1	1818 MHz		600		35 mm
XC7VX415T-1FFV1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32200			1		Grid Array			.97 V	1 mm		0.74 ns	32200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm		e1					35 mm
XCE7VX415T-1FFV1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	32200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1157		3.35 mm	35 mm					600		35 mm
XCE7VX485T-3FFG1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XC7VX330T-2FFG1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS	600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX485T-3FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	75900		600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)		75900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4		35 mm	No	e1			600		35 mm
XC7V855T-1LFFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7VX330T-L2FFV1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25500			1		Grid Array			.97 V	1 mm		0.61 ns	25500 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm		e1					35 mm
XCE7VX415T-2FFV1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	600	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1157		3.35 mm	35 mm					600		35 mm
XCE7VX415T-1FFV1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	600	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	32200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1157		3.35 mm	35 mm					600		35 mm
XCE7VX330T-1FFG1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG	600	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XC7VX485T-1LFFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes		75900					Grid Array				1 mm	100 °C (212 °F)		75900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4		35 mm	No	e1					35 mm
XC7V1500T-1FFG1157C	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes		229050					Grid Array				1 mm			229050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7VX690T-2LFFG1157E	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150		600	1		Grid Array	BGA1157,34X34,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm		e1			600		35 mm
XCE7VX330T-2FFV1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG	600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1157		3.35 mm	35 mm					600		35 mm
XCE7VX485T-L2FFG1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XC7V585T-2FFG1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	CMOS	600	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	45525 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XCE7VX690T-2FFG1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XC7V2000T-1FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400			1		Grid Array			.97 V	1 mm	100 °C (212 °F)		305400 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7VX485T-2FFG1157E	Xilinx	FPGA	Military	Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	75900			1		Grid Array			.97 V	1 mm	125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4		35 mm	No	e1					35 mm
XCE7VX330T-2FFV1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG	600	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1157		3.35 mm	35 mm					600		35 mm
XC7VX330T-1FFV1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25500			1		Grid Array			.97 V	1 mm		0.74 ns	25500 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm		e1					35 mm
XCE7VX415T-3FFG1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XC7VX415T-1FFV1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32200			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm		e1					35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.