1158 Field Programmable Gate Arrays (FPGA) 64

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7VX690T-3FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX690T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	350	1	0.9,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX485T-1FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX550T-2FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XCE7VX550T-L2FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	43300			1		Grid Array			.97 V	1 mm		0.61 ns	43300 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XCE7VX485T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	350	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XC7VX690T-2FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX415T-L2FFV1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32200			1		Grid Array			.97 V	1 mm		0.61 ns	32200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1158		3.35 mm	35 mm		e1					35 mm
XC7VX690T-2LFFG1158E	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150		350	1		Grid Array	BGA1158,34X34,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XCE7VX550T-3FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	43300			1		Grid Array			.97 V	1 mm		0.58 ns	43300 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XCE7VX415T-L2FFV1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	350	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158		3.35 mm	35 mm		e1			350		35 mm
XCE7VX415T-2FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	350	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XCE7VX690T-3FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.58 ns	54150 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XCE7VX550T-2FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	43300			1		Grid Array			.97 V	1 mm		0.61 ns	43300 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XC7VX550T-2FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	43300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX415T-2FFV1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32200			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158		3.35 mm	35 mm		e1					35 mm
XCE7VX485T-L2FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	350	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XC7VX415T-3FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XCE7VX690T-L2FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.61 ns	54150 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XC7VX415T-1FFV1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32200			1		Grid Array			.97 V	1 mm		0.74 ns	32200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1158		3.35 mm	35 mm		e1					35 mm
XCE7VX485T-2FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	350	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XCE7VX415T-1FFV1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	350	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158		3.35 mm	35 mm		e1			350		35 mm
XC7VX550T-2LFFG1158E	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300		350	1		Grid Array	BGA1158,34X34,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XCE7VX415T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	350	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XCE7VX415T-2FFV1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	350	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158		3.35 mm	35 mm		e1			350		35 mm
XCE7VX485T-1FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	350	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XCE7VX690T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XCE7VX690T-2FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XC7VX550T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS	350	1	0.9,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX485T-3FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XCE7VX415T-3FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	350	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XCE7VX550T-2FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	43300			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XCE7VX415T-1FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	350	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XC7VX485T-2FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XCE7VX415T-1FFV1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	350	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158		3.35 mm	35 mm		e1			350		35 mm
XCE7VX415T-2FFV1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	350	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158		3.35 mm	35 mm		e1			350		35 mm
XC7VX485T-2LFFG1158E	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950		350	1		Grid Array	BGA1158,34X34,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XC7VX485T-L2FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX485T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	350	1	0.9,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX690T-2FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XCE7VX690T-2FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.61 ns	54150 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XC7VX415T-1FFV1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32200			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158		3.35 mm	35 mm		e1					35 mm
XC7VX415T-2LFFG1158E	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200		350	1		Grid Array	BGA1158,34X34,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XCE7VX415T-L2FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	350	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s	350	245 °C (473 °F)	35 mm
XC7VX690T-L2FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XCE7VX690T-1FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.74 ns	54150 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XCE7VX415T-3FFV1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	350	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158		3.35 mm	35 mm		e1			350		35 mm
XC7VX415T-1FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS	350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.