133 Field Programmable Gate Arrays (FPGA) 10

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	Maximum Clock Frequency	No. of Outputs	Length
TPC1240MGB133B-1	Texas Instruments	FPGA	Military	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired	684	No	5.5 V	684	CMOS	MIL-STD-883 Class B	104	4000	5	5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		684 CLBS, 4000 Gates	-55 °C (-67 °F)	Perpendicular	S-CPGA-P133	4.27 mm	34.544 mm	No		55 MHz	104	34.544 mm
TPC1240GB-133C1	Texas Instruments	FPGA	Commercial	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired	684	No	5.25 V	684	CMOS		104	4000	5	5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		684 CLBS, 4000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P133	4.27 mm	34.544 mm	No		75 MHz	104	34.544 mm
TPC1240GB-133I1	Texas Instruments	FPGA	Industrial	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired	684	No	5.5 V	684	CMOS		104	4000	5	5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)		684 CLBS, 4000 Gates	-40 °C (-40 °F)	Perpendicular	S-CPGA-P133	4.27 mm	34.544 mm	No		66 MHz	104	34.544 mm
TPC1240MGB133	Texas Instruments	FPGA	Military	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired	684	No	5.5 V	684	CMOS	MIL-STD-883	104	4000	5	5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		684 CLBS, 4000 Gates	-55 °C (-67 °F)	Perpendicular	S-CPGA-P133	4.27 mm	34.544 mm	No		50 MHz	104	34.544 mm
TPC1425GB-133C	Texas Instruments	FPGA	Commercial	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS						Grid Array				2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Perpendicular	S-CPGA-P133	4.27 mm	34.544 mm	No	MAX 100 I/OS			34.544 mm
TPC1425GB-133I	Texas Instruments	FPGA	Industrial	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS						Grid Array				2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Perpendicular	S-CPGA-P133	4.27 mm	34.544 mm	No	MAX 100 I/OS			34.544 mm
TPC1240GB-133C	Texas Instruments	FPGA	Commercial	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired	684	No	5.25 V	684	CMOS		104	4000	5	5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	14 ns	684 CLBS, 4000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P133	4.27 mm	34.544 mm	No	MAX 92 I/OS; 565 flip-flops	66 MHz	104	34.544 mm
TPC1240MGB133B	Texas Instruments	FPGA	Military	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired	684	No	5.5 V	684	CMOS	MIL-STD-883 Class B	104	4000	5	5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	16 ns	684 CLBS, 4000 Gates	-55 °C (-67 °F)	Perpendicular	S-CPGA-P133	4.27 mm	34.544 mm	No	565 flip-flops	50 MHz	104	34.544 mm
TPC1240MGB133-1	Texas Instruments	FPGA	Military	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired	684	No	5.5 V	684	CMOS	MIL-STD-883	104	4000	5	5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		684 CLBS, 4000 Gates	-55 °C (-67 °F)	Perpendicular	S-CPGA-P133	4.27 mm	34.544 mm	No		55 MHz	104	34.544 mm
TPC1240GB-133I	Texas Instruments	FPGA	Industrial	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired	684	No	5.5 V	684	CMOS		104	4000	5	5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	15 ns	684 CLBS, 4000 Gates	-40 °C (-40 °F)	Perpendicular	S-CPGA-P133	4.27 mm	34.544 mm	No	MAX 92 I/OS; 565 flip-flops	55 MHz	104	34.544 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.