Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
576 |
Yes |
1.575 V |
64 |
CMOS |
88 |
40000 |
1.5 |
1.5,1.5/3.3,3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.425 V |
.8 mm |
85 °C (185 °F) |
0.39 ns |
64 CLBS, 40000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
750 MHz |
30 s |
88 |
240 °C (464 °F) |
12 mm |
||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1368 |
Yes |
3.6 V |
576 |
CMOS |
113 |
10000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates 30000 |
e3 |
217 MHz |
30 s |
113 |
260 °C (500 °F) |
20 mm |
||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
1536 |
CMOS |
322970 |
2.5 |
Flatpack, Low Profile, Fine Pitch |
2.375 V |
.5 mm |
0.4 ns |
1536 CLBS, 322970 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.3 ns |
784 CLBS, 13000 Gates |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 20000 Logic gates |
e0 |
200 MHz |
224 |
20 mm |
||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
144 |
Yes |
CMOS |
96 |
5 |
5 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
No |
e0 |
325 MHz |
30 s |
96 |
225 °C (437 °F) |
|||||||||||||||
|
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
5292 |
Yes |
1.89 V |
1176 |
CMOS |
94 |
63504 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
0.42 ns |
1176 CLBS, 63504 Gates |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
400 MHz |
30 s |
94 |
260 °C (500 °F) |
12 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
3.6 V |
196 |
CMOS |
112 |
3000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Can also use 10000 gates |
e0 |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.26 V |
192 |
CMOS |
97 |
50000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
0.61 ns |
192 CLBS, 50000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
630 MHz |
30 s |
97 |
260 °C (500 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
224 |
Yes |
5.25 V |
224 |
CMOS |
120 |
3500 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
2.7 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 4500 Logic gates |
e0 |
270 MHz |
30 s |
120 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
896 |
CMOS |
400000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
4.88 ns |
896 CLBS, 400000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
667 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
1728 |
Yes |
2.625 V |
384 |
CMOS |
94 |
57906 |
2.5 |
1.2/3.6,2.5 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
2.375 V |
.8 mm |
0.7 ns |
384 CLBS, 57906 Gates |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
294 MHz |
30 s |
94 |
240 °C (464 °F) |
12 mm |
|||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
CMOS |
176 |
1.5/3.3,2.5 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
100 °C (212 °F) |
0.7 ns |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
20 mm |
No |
e0 |
30 s |
176 |
225 °C (437 °F) |
20 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
144 |
CMOS |
2000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
2.2 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Max usable 3000 Logic gates |
e3 |
323 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
5.25 V |
144 |
CMOS |
96 |
2000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.5 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 3000 Logic gates |
e0 |
370 MHz |
30 s |
96 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 20000 Logic gates |
e0 |
166 MHz |
224 |
20 mm |
|||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
2.625 V |
384 |
96 |
50000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
0.7 ns |
384 CLBS, 50000 Gates |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
263 MHz |
92 |
20 mm |
|||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
144 |
CMOS |
2000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.5 V |
.5 mm |
2.7 ns |
144 CLBS, 2000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Max usable 3000 Logic gates |
e3 |
270 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
3000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
196 CLBS, 3000 Gates |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
20 mm |
||||||||||||||||||||
Xilinx |
FPGA |
Commercial Extended |
G |
144 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
864 |
52000 |
1.8 |
Flatpack, Fine Pitch |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.47 ns |
864 CLBS, 52000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Maximum usable gates = 150000 |
357 MHz |
20 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Ball |
144 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.05 V |
469 |
1 |
Grid Array |
.95 V |
1.27 ns |
469 CLBS |
Bottom |
S-PBGA-B144 |
|||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
192 CLBS, 50000 Gates |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
20 mm |
|||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
896 |
CMOS |
400000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
4.36 ns |
896 CLBS, 400000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
770 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
2700 |
Yes |
1.89 V |
600 |
CMOS |
94 |
32400 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
85 °C (185 °F) |
0.47 ns |
600 CLBS, 32400 Gates |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
357 MHz |
30 s |
94 |
240 °C (464 °F) |
12 mm |
||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
784 |
CMOS |
13000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Max usable 20000 Logic gates |
e3 |
217 MHz |
20 mm |
||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
320 |
CMOS |
5000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
3.3 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Max usable 6000 Logic gates |
e3 |
227 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
5.5 V |
144 |
CMOS |
96 |
2000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
3.3 ns |
144 CLBS, 2000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 3000 Logic gates |
e0 |
227 MHz |
30 s |
96 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.5 V |
196 |
CMOS |
112 |
3000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
2.7 ns |
196 CLBS, 3000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 5000 Logic gates |
e0 |
111 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
144 |
CMOS |
2000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.5 V |
.5 mm |
5.1 ns |
144 CLBS, 2000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Max usable 3000 Logic gates |
e3 |
113 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4320 |
Yes |
1.26 V |
480 |
CMOS |
97 |
200000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.53 ns |
480 CLBS, 200000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
725 MHz |
30 s |
97 |
260 °C (500 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.26 V |
192 |
CMOS |
97 |
50000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.61 ns |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
630 MHz |
97 |
20 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2700 |
Yes |
2.625 V |
600 |
CMOS |
98 |
108904 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.7 ns |
600 CLBS, 108904 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
294 MHz |
30 s |
98 |
225 °C (437 °F) |
20 mm |
||||||
Altera |
FPGA |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
Yes |
Flatpack |
Quad |
S-PQFP-G144 |
||||||||||||||||||||||||||||||||||
Altera |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
1.03 V |
963 |
1 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
.97 V |
.5 mm |
85 °C (185 °F) |
963 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
No |
e0 |
265 MHz |
20 mm |
||||||||||||||||||
Altera |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2910 |
Yes |
1.575 V |
291 |
104 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
100 °C (212 °F) |
291 CLBS |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
405 MHz |
104 |
220 °C (428 °F) |
20 mm |
||||||||||
|
Altera |
FPGA |
Other |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
Yes |
Flatpack |
85 °C (185 °F) |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
||||||||||||||||||||||||||||||
Altera |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
5980 |
1.5 |
Flatpack, Low Profile, Fine Pitch |
1.425 V |
.5 mm |
5980 CLBS |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
275 MHz |
20 mm |
||||||||||||||||||||
|
Altera |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
CMOS |
84 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
Matte Tin |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
No |
e3 |
84 |
20 mm |
|||||||||||||||||
Altera |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5980 |
Yes |
1.575 V |
598 |
98 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
100 °C (212 °F) |
598 CLBS |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
275 MHz |
98 |
220 °C (428 °F) |
20 mm |
||||||||||
|
Altera |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5980 |
Yes |
1.575 V |
598 |
98 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
598 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
405 MHz |
30 s |
98 |
260 °C (500 °F) |
20 mm |
||||||||
Altera |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Rectangular |
Plastic/Epoxy |
24624 |
Yes |
1.25 V |
24624 |
CMOS |
82 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
100 °C (212 °F) |
24624 CLBS |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
472.5 MHz |
20 s |
82 |
220 °C (428 °F) |
20 mm |
|||||||||
Altera |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
15408 |
CMOS |
84 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.4 mm |
100 °C (212 °F) |
15408 CLBS |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e0 |
472.5 MHz |
20 s |
84 |
220 °C (428 °F) |
20 mm |
|||||||||
Altera |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
2910 |
1.5 |
Flatpack, Low Profile, Fine Pitch |
1.425 V |
.5 mm |
2910 CLBS |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
320 MHz |
20 mm |
||||||||||||||||||||
|
Altera |
FPGA |
Automotive |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
Yes |
Flatpack |
125 °C (257 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
||||||||||||||||||||||||||||||
Altera |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
15408 |
CMOS |
84 |
1.2 |
1.2/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.4 mm |
15408 CLBS |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
No |
84 |
20 mm |
|||||||||||||||||
Altera |
FPGA |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
Yes |
Flatpack |
Quad |
S-PQFP-G144 |
||||||||||||||||||||||||||||||||||
Altera |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
15408 |
CMOS |
84 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.4 mm |
85 °C (185 °F) |
15408 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e0 |
472.5 MHz |
20 s |
84 |
220 °C (428 °F) |
20 mm |
|||||||||
|
Altera |
FPGA |
Other |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
Yes |
Flatpack |
85 °C (185 °F) |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
||||||||||||||||||||||||||||||
|
Altera |
FPGA |
Other |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
Yes |
Flatpack |
85 °C (185 °F) |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.