1509 Field Programmable Gate Arrays (FPGA) 4

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	Maximum Clock Frequency	No. of Outputs	Length
XQRKU060-1CNA1509Y	Xilinx	FPGA	Military	1509	CGA	Square	120k Rad(Si)	Ceramic, Metal-Sealed Cofired	725550	Yes		41460		MIL-PRF-38535 CLASS Y	620		Box; Tray		Grid Array	CGA1509,39X39,40			1 mm	125 °C (257 °F)	41460 CLBS	-55 °C (-67 °F)	Bottom	S-CBGA-X1509	8.97 mm	40 mm		Tray contains 1 device		620	40 mm
XQRKU060-1CNA1509B	Xilinx	FPGA	Military	1509	CGA	Square	120k Rad(Si)	Ceramic, Metal-Sealed Cofired	725550	Yes		41460		MIL-PRF-38535 Class B	620		Box; Tray		Grid Array	CGA1509,39X39,40			1 mm	125 °C (257 °F)	41460 CLBS	-55 °C (-67 °F)	Bottom	S-CBGA-X1509	8.97 mm	40 mm		Tray contains 1 device		620	40 mm
XQR4VLX200-10CF1509V	Xilinx	FPGA	Military	1509	CGA	Square		Ceramic, Metal-Sealed Cofired	200448	Yes	1.26 V	22272	CMOS	38535V;38534K;883S	960	1.2		1.2,2.5,3.3 V	Grid Array	PGA1509,39X39,39	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	22272 CLBS	-55 °C (-67 °F)	Bottom	S-CBGA-X1509	8.47 mm	40 mm	No		1028 MHz	960	40 mm
XQR4VFX140-10CF1509V	Xilinx	FPGA	Military	1509	CGA	Square		Ceramic, Metal-Sealed Cofired	142128	Yes	1.26 V	16128	CMOS	38535V;38534K;883S	768	1.2		1.2,2.5,3.3 V	Grid Array	PGA1509,39X39,39	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	16128 CLBS	-55 °C (-67 °F)	Bottom	S-CBGA-X1509	8.47 mm	40 mm	No		1028 MHz	768	40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.