16 Field Programmable Gate Arrays (FPGA) 6

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
ICE40UL1K-SWG16ITR	Lattice Semiconductor	FPGA	Industrial	Ball	16	BGA	Square	Plastic/Epoxy	1248	Yes	1.26 V	156	CMOS	10	1.2	Grid Array	1.14 V	.35 mm	100 °C (212 °F)	9 ns	156 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B16	1		1.409 mm	30 s	10	260 °C (500 °F)	1.409 mm
ICE40UL1K-SWG16ITR50	Lattice Semiconductor	FPGA	Industrial	Ball	16	BGA	Square	Plastic/Epoxy		Yes	1.26 V	156	CMOS		1.2	Grid Array	1.14 V		100 °C (212 °F)		156 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B16	1					260 °C (500 °F)
ICE40LP1K-SWG16TR50	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160	CMOS		1.2	Grid Array, Very Thin Profile, Fine Pitch	1.14 V	.35 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Bottom	R-PBGA-B16		.491 mm	1.4 mm				1.48 mm
ICE40LP1K-SWG16TR	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	10	1.2	Grid Array, Very Thin Profile, Fine Pitch	1.14 V	.35 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Bottom	R-PBGA-B16		.491 mm	1.4 mm		10		1.48 mm
ICE40LP1K-SWG16TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	10	1.2	Grid Array, Very Thin Profile, Fine Pitch	1.14 V	.35 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Bottom	R-PBGA-B16		.491 mm	1.4 mm		10		1.48 mm
ICE40UL640-SWG16ITR	Lattice Semiconductor	FPGA	Industrial	Ball	16	BGA	Square	Plastic/Epoxy	640	Yes	1.26 V	80	CMOS	10	1.2	Grid Array	1.14 V	.35 mm	100 °C (212 °F)	9 ns	80 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B16	1		1.409 mm	30 s	10	260 °C (500 °F)	1.409 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.