164 Field Programmable Gate Arrays (FPGA) 154

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3C10M164C8N	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V		CMOS		106		1.2	1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B164	3	1.2 mm	8 mm	No		e1	472.5 MHz	30 s	106	260 °C (500 °F)	8 mm
EP3C5M164I7N	Intel	FPGA	Industrial	Ball	164	BGA	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS		106		2.5	1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		5136 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164				No					106
EP3C5M164C8N	Intel	FPGA	Other	Ball	164	BGA	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS		106		2.5	1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164				No					106
10CL010YM164I7G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645					1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	100 °C (212 °F)		645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
EP4CE15M8I7N	Intel	FPGA		Ball	164	TFBGA	Square	Plastic/Epoxy	15408	Yes		15408			89		1	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20	Field Programmable Gate Arrays		.5 mm			15408 CLBS		Tin Silver Copper	Bottom	S-PBGA-B164	3	1.2 mm	8 mm	No		e1			89		8 mm
10CL016YM164I7G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963					1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	100 °C (212 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
10CL010YM164C6G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645					1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
10CL010ZM164I8G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645			176		1		Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20		.97 V	.5 mm	100 °C (212 °F)		645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm		-40 to 125 °C range is available as extended industrial				176		8 mm
EP3C10M164C7N	Intel	FPGA	Other	Ball	164	BGA	Square	Plastic/Epoxy	10320	Yes	2.625 V	10320	CMOS		106		2.5	1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		10320 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164				No					106
10CL010YM164C8G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645					1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
EP3C5M164C7N	Intel	FPGA	Other	Ball	164	BGA	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS		106		2.5	1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164				No					106
10CL016YM164C8G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963					1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
EP3C10M164I7N	Intel	FPGA	Industrial	Ball	164	BGA	Square	Plastic/Epoxy	10320	Yes	2.625 V	10320	CMOS		106		2.5	1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		10320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B164	3			No		e1			106
5962-9230502NYX	Xilinx	FPGA	Military	Flat	164	QFF	Square			Yes	5.5 V		CMOS	MIL-PRF-38535 Class N		5000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	6 ns	5000 Gates	-55 °C (-67 °F)		Quad	S-XQFP-F164		2.92 mm	28.702 mm	No			50 MHz				28.702 mm
XC3090-70CQ164MSPC0107	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				27.432 mm
XC3090-100CB164MSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	100 MHz				28.702 mm
5962-8982303MTC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V		CMOS	MIL-STD-883	142	9000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		9000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No		e4	100 MHz		142		28.702 mm
5962-9225201MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	466	Yes			CMOS	MIL-STD-883	112		5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4			112		28.702 mm
5962-8982301MTX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS				5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
5962-9561101MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	190 MHz		142		28.702 mm
5962-8982303MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns		-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
XC3190A-5CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS	38535Q/M;38534H;883B	142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 5000-6000	e0	188 MHz		142		28.702 mm
XC3090-50CQ164BSPC0109	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)		320 CLBS, 9000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.432 mm
5962-8982302MTC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	70 MHz		142		28.702 mm
XC3190A-4CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		320	CMOS	MIL-STD-883 Class B		5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	3.3 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e0					28.702 mm
5962-9561102MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
XC3190-5CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS	38535Q/M;38534H;883B	142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164	1	2.921 mm	28.702 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500		190 MHz		142		28.702 mm
5962-9561201MYX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		484	CMOS	MIL-STD-883		6500	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 6500-7500	e4	188 MHz				28.702 mm
XC3090-50CQ164C	Xilinx	FPGA	Commercial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes	5.25 V	320	CMOS		142	9000	5	5 V	Flatpack	QFL164,1.2SQ,25	Field Programmable Gate Arrays	4.75 V	.635 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-CQFP-F164	1	3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops		50 MHz		142		27.432 mm
5962-9752201QYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	466	Yes	5.5 V	196	CMOS	MIL-PRF-38535 Class Q	112	3000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 3000-9000	e4	111 MHz		112		28.702 mm
5962-9561202MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-8982301MYX	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
XC3090-100CB164C	Xilinx	FPGA	Other	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes	5.25 V	320	CMOS		142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		100 MHz		142		28.702 mm
XC3090-50CQ164ISPC0109	Xilinx	FPGA	Industrial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.432 mm
5962-8982303MYX	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No							27.432 mm
XC3090-70CQ164CSPC0109	Xilinx	FPGA	Commercial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS			9000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	9 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				27.432 mm
XC3090-100CB164CSPC0107	Xilinx	FPGA	Other	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS			5000	5		Flatpack, Guard Ring			4.75 V	.65 mm	85 °C (185 °F)	7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	100 MHz				28.702 mm
XC3090-50CQ164I	Xilinx	FPGA	Industrial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V	320	CMOS		142	9000	5	5 V	Flatpack	QFL164,1.2SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)		Quad	S-CQFP-F164	1	3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops		50 MHz		142		27.432 mm
XC3090-100CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS		142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	100 MHz		142		28.702 mm
5962-9561101MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
XC3195A-5CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	484	Yes		484	CMOS		176	6500	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	484 CLBS, 6500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	Typical gates = 6500-7500		188 MHz		176		28.702 mm
5962-8982301MYA	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
XC3190A-5CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS		142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.302 mm	28.702 mm	No	Typical gates = 5000-6000	e0	188 MHz		142		28.702 mm
5962-8982302MYA	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
XC3090-50CQ164CSPC0109	Xilinx	FPGA	Commercial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS			9000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.432 mm
XC4005-10CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	196	CMOS	MIL-STD-883 Class B		4000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	616 flip-flops; typical gates = 4000-5000						28.702 mm
5962-9561101MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS	MIL-STD-883	142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 5000-6000	e4	188 MHz		142		28.702 mm
5962-8982302MYX	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.