1696 Field Programmable Gate Arrays (FPGA) 24

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2VP125-6FF1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy	125136	Yes	1.575 V	13904	CMOS	1200	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	13904 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1200 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC2VP100-6FF1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1164	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	11024 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1200 MHz	30 s	1164	225 °C (437 °F)	42.5 mm
XC2VP125-5FFG1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13904	CMOS		1.5		Grid Array			1.425 V	1 mm		0.36 ns	13904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1050 MHz	30 s		245 °C (473 °F)	42.5 mm
XC2VP100-7FF1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1164	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	11024 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1350 MHz	30 s	1164	225 °C (437 °F)	42.5 mm
XC2VP125-7FF1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy	125136	Yes	1.575 V	13904	CMOS	1200	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	13904 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1350 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC2VP100-5FF1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1164	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	11024 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1050 MHz	30 s	1164	225 °C (437 °F)	42.5 mm
XC2VP125-6FF1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy	125136	Yes	1.575 V	13904	CMOS	1200	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	13904 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1200 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC2VP100-6FFG1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1164	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	11024 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1200 MHz	30 s	1164	245 °C (473 °F)	42.5 mm
XC2VP125-6FFG1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13904	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.32 ns	13904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1200 MHz	30 s		245 °C (473 °F)	42.5 mm
XC2VP125-5FFG1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13904	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.36 ns	13904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1050 MHz	30 s		245 °C (473 °F)	42.5 mm
XC2VP125-5FF1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy	125136	Yes	1.575 V	13904	CMOS	1200	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	13904 CLBS		Tin Lead	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1050 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC2VP125-6FFG1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13904	CMOS		1.5		Grid Array			1.425 V	1 mm		0.32 ns	13904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1200 MHz	30 s		245 °C (473 °F)	42.5 mm
XC2VP100-7FFG1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy		Yes	1.575 V	11024	CMOS		1.5		Grid Array			1.425 V	1 mm		0.28 ns	11024 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	42.5 mm
XC2VP100-5FF1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1164	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	11024 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1050 MHz	30 s	1164	225 °C (437 °F)	42.5 mm
XC2VP100-7FFG1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy		Yes	1.575 V	11024	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.28 ns	11024 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	42.5 mm
XC2VP100-6FF1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1164	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	11024 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1200 MHz	30 s	1164	225 °C (437 °F)	42.5 mm
XC2VP100-5FFG1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1164	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	11024 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1050 MHz	30 s	1164	245 °C (473 °F)	42.5 mm
XC2VP125-5FF1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy	125136	Yes	1.575 V	13904	CMOS	1200	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	13904 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1050 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC2VP100-5FFG1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1164	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	11024 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1050 MHz	30 s	1164	245 °C (473 °F)	42.5 mm
XC2VP125-7FF1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy	125136	Yes	1.575 V	13904	CMOS	1200	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	13904 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1350 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC2VP100-6FFG1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1164	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	11024 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1200 MHz	30 s	1164	245 °C (473 °F)	42.5 mm
XC2VP125-7FFG1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13904	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.28 ns	13904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	42.5 mm
XC2VP125-7FFG1696I	Xilinx	FPGA		Ball	1696	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13904	CMOS		1.5		Grid Array			1.425 V	1 mm		0.28 ns	13904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	42.5 mm
XC2VP100-7FF1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1164	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	11024 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No	e0	1350 MHz	30 s	1164	225 °C (437 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.