1704 Field Programmable Gate Arrays (FPGA) 56

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2VPX70-6FFG1704C	Xilinx	FPGA	Other	Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	992	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	8272 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e1	1200 MHz	30 s	992	245 °C (473 °F)	42.5 mm
XC2VP125-6FFG1704C	Xilinx	FPGA	Other	Ball	1704	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13904	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.32 ns	13904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e1	1200 MHz	30 s		245 °C (473 °F)	42.5 mm
XC2VPX70-6FF1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	992	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	8272 CLBS		Tin Lead	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e0	1200 MHz	30 s	992	225 °C (437 °F)	42.5 mm
XC2VP70-5FFG1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	996	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	8272 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e1	1050 MHz	30 s	996	245 °C (473 °F)	42.5 mm
XC2VPX70-5FFG1704C	Xilinx	FPGA	Other	Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	992	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	8272 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e1	1050 MHz	30 s	992	245 °C (473 °F)	42.5 mm
XC2VP125-7FFG1704C	Xilinx	FPGA	Other	Ball	1704	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13904	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.28 ns	13904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	42.5 mm
XC2VP100-6FF1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1040	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	11024 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e0	1200 MHz	30 s	1040	225 °C (437 °F)	42.5 mm
XC2VP100-5FF1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1040	1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	11024 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e0	1050 MHz	30 s	1040	225 °C (437 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.