172 Field Programmable Gate Arrays (FPGA) 8

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

TPC1280MHFG172

Texas Instruments

FPGA

Military

Flat

172

QFF

Square

Ceramic, Metal-Sealed Cofired

1232

Yes

5.5 V

1232

CMOS

MIL-STD-883

140

8000

5

5 V

Flatpack

TPAK172(UNSPEC)

Field Programmable Gate Arrays

4.5 V

125 °C (257 °F)

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F172

No

39 MHz

140

TPC1280MHFG172B-1

Texas Instruments

FPGA

Military

Flat

172

QFF

Square

Ceramic, Metal-Sealed Cofired

1232

Yes

5.5 V

1232

CMOS

MIL-STD-883 Class B

140

8000

5

5 V

Flatpack

TPAK172(UNSPEC)

Field Programmable Gate Arrays

4.5 V

125 °C (257 °F)

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F172

No

50 MHz

140

TPC1280MHFG172B

Texas Instruments

FPGA

Military

Flat

172

QFF

Square

Ceramic, Metal-Sealed Cofired

1232

Yes

5.5 V

1232

CMOS

MIL-STD-883 Class B

140

8000

5

5 V

Flatpack

TPAK172(UNSPEC)

Field Programmable Gate Arrays

4.5 V

.64 mm

125 °C (257 °F)

18.72 ns

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F172

3.3 mm

26.665 mm

No

MAX 140 I/OS; 998 flip-flops

39 MHz

140

26.665 mm

TPC1280MHFG172-1

Texas Instruments

FPGA

Military

Flat

172

QFF

Square

Ceramic, Metal-Sealed Cofired

1232

Yes

5.5 V

1232

CMOS

MIL-STD-883

140

8000

5

5 V

Flatpack

TPAK172(UNSPEC)

Field Programmable Gate Arrays

4.5 V

125 °C (257 °F)

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F172

No

50 MHz

140

5962-9215601MYX

Texas Instruments

FPGA

Military

Flat

172

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

1232

CMOS

8000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

6.1 ns

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F172

2.9464 mm

29.972 mm

No

41 MHz

29.972 mm

5962-9215602MYX

Texas Instruments

FPGA

Military

Flat

172

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

1232

CMOS

8000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

5.2 ns

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F172

2.9464 mm

29.972 mm

No

60 MHz

29.972 mm

5962-9215601MYA

Texas Instruments

FPGA

Military

Flat

172

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

1232

CMOS

8000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

6.1 ns

8000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F172

3.175 mm

29.972 mm

No

e0

41 MHz

30 s

225 °C (437 °F)

29.972 mm

5962-9215602MYA

Texas Instruments

FPGA

Military

Flat

172

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

1232

CMOS

8000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

5.2 ns

8000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F172

3.175 mm

29.972 mm

No

e0

60 MHz

30 s

225 °C (437 °F)

29.972 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.