1759 Field Programmable Gate Arrays (FPGA) 143

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VLX550T-2FFG1759E	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes			CMOS	840		1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4			No	e1	1286 MHz	30 s	840	245 °C (473 °F)
XQ6VSX315T-2RFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V	24600	CMOS	720	1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.67 ns	24600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm		e1			720		42.5 mm
XC6VSX475T-L1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	.93 V		CMOS	840	.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1098 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XC6VLX365T-1LFF1759I	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy		Yes	.97 V						Grid Array			.91 V	1 mm					Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0		30 s		225 °C (437 °F)	42.5 mm
XC6VSX315T-1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1098 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC6VLX240T-2FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1286 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC6VLX550T-2FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS	840	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1286 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XC6VLX550T-L1FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	.93 V		CMOS	840	.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XC5VTX150T-1FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS	680	1	1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	11600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1		30 s	680	245 °C (473 °F)	42.5 mm
XC6VLX240T-L1FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	.93 V		CMOS	720	.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XC6VLX240T-2FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1286 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XC6VSX315T-2FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1286 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XC6VLX365T-3FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	364032	Yes			CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B	4	3.5 mm	42.5 mm	No	e1	1412 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XC5VTX150T-2FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS	680	1	1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	11600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1		30 s	680	245 °C (473 °F)	42.5 mm
XQ6VLX240T-1LRFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	.93 V	18840	CMOS	720	0.9		Grid Array	BGA1759,42X42,40		.87 V	1 mm	100 °C (212 °F)	0.85 ns	18840 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm		e1			720		42.5 mm
XQ6VLX240T-2RFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS	720	1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.67 ns	18840 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm		e1			720		42.5 mm
XQ6VLX550T-2RFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V	42960	CMOS	840	1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.67 ns	42960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm		e1			840		42.5 mm
XC6VSX315T-3FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1412 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XQ6VLX240T-1RFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS	720	1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.79 ns	18840 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm		e1			720		42.5 mm
XC5VTX240T-1FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS	680	1	1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	18720 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1		30 s	680	245 °C (473 °F)	42.5 mm
XC6VSX475T-L1FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	.93 V		CMOS	840	.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XC6VSX315T-1LFF1759I	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy		Yes	.97 V						Grid Array			.91 V	1 mm					Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm	No	e0					42.5 mm
XC6VLX550T-1LFFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	.93 V	42960	CMOS	840	0.9		Grid Array	BGA1759,42X42,40		.87 V	1 mm	85 °C (185 °F)	0.85 ns	42960 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm		e1		30 s	840	245 °C (473 °F)	42.5 mm
XC6VSX315T-3FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes			CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B	4	3.5 mm	42.5 mm	No	e1	1412 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XC6VLX365T-3FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1412 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC6VLX550T-L1FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	.93 V		CMOS	840	.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1098 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XC6VLX550T-3FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V	42960	CMOS	840	1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	85 °C (185 °F)	0.59 ns	42960 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm		e1		30 s	840	245 °C (473 °F)	42.5 mm
XQ6VLX240T-1LRF1759M	Xilinx	FPGA	Military	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes		18840	CMOS	720			Grid Array	BGA1759,42X42,40			1 mm	125 °C (257 °F)	0.85 ns	18840 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm		e0			720		42.5 mm
XC6VSX475T-2FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS	840	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1286 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XQ6VSX475T-1RF1759M	Xilinx	FPGA	Military	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS	840	1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	125 °C (257 °F)	0.79 ns	37200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm		e0			840		42.5 mm
XQ6VSX315T-1RFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V	24600	CMOS	720	1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.79 ns	24600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		4.37 mm	42.5 mm		e1			720		42.5 mm
XC6VLX365T-1LFF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy		Yes	.93 V						Grid Array			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm	No	e0					42.5 mm
XC6VSX315T-2FF1759E	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm					Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1286 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC6VSX475T-1LFF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	.97 V	37200	CMOS	840			Grid Array	BGA1759,42X42,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	37200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm		e0			840		42.5 mm
XC5VTX150T-1FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS	680	1	1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	11600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm	No	e0			680		42.5 mm
XC5VTX240T-1FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS	680	1	1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	18720 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm	No	e0			680		42.5 mm
XC6VLX550T-1FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS	840	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XC6VLX550T-2FF1759E	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS	840	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm					Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1286 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XC6VSX475T-1FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS	840	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XC6VLX240T-1LFF1759I	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy		Yes	.97 V						Grid Array			.91 V	1 mm					Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm	No	e0					42.5 mm
XC5VTX240T-2FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS	680	1	1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	18720 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1		30 s	680	245 °C (473 °F)	42.5 mm
XQ6VSX315T-L1RF1759I	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic	315000	Yes			CMOS	720	.9	0.9 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1759	4			No	e0	1098 MHz		720
XC5VTX150T-2FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS	680	1	1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	11600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm	No	e0			680		42.5 mm
XC6VLX240T-1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1098 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC6VLX550T-L1FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	.93 V		CMOS	840	.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XQ6VSX315T-2RF1759M	Xilinx	FPGA	Military	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V	24600	CMOS	720	1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	125 °C (257 °F)	0.67 ns	24600 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm		e0			720		42.5 mm
XC6VLX365T-L1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	364032	Yes	.93 V		CMOS	720	.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1098 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC5VTX240T-2FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS	680	1	1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	18720 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm	No	e0			680		42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.