Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1890 |
CMOS |
36000 |
3.3 |
Tray |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.8 ns |
1890 CLBS, 36000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Also Operates at 5 V supply |
114.75 MHz |
24 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1232 |
CMOS |
24000 |
3.3 |
Tray |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
2.8 ns |
1232 CLBS, 24000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Also Operates at 5 V supply |
e3 |
94 MHz |
24 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1890 |
CMOS |
36000 |
3.3 |
Tray |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
2.5 ns |
1890 CLBS, 36000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Also Operates at 5 V supply |
e3 |
91.8 MHz |
24 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
176 |
TFQFP |
Square |
Plastic/Epoxy |
1584 |
Yes |
1.575 V |
1584 |
CMOS |
137 |
60000 |
1.5 |
1.2/1.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP176,.87SQ,16 |
Field Programmable Gate Arrays |
1.425 V |
.4 mm |
85 °C (185 °F) |
1584 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQFP-G176 |
3 |
1.2 mm |
20 mm |
No |
160 MHz |
137 |
20 mm |
||||||||||
|
Actel |
FPGA |
Industrial |
Gull Wing |
176 |
TFQFP |
Square |
Plastic/Epoxy |
1584 |
Yes |
1.575 V |
1584 |
CMOS |
137 |
60000 |
1.5 |
1.2/1.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP176,.87SQ,16 |
Field Programmable Gate Arrays |
1.425 V |
.4 mm |
85 °C (185 °F) |
1584 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQFP-G176 |
1.2 mm |
20 mm |
No |
160 MHz |
137 |
20 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
6.1 ns |
8000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P176 |
4.7498 mm |
39.878 mm |
No |
e0 |
41 MHz |
30 s |
225 °C (437 °F) |
39.878 mm |
|||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
17.55 ns |
1232 CLBS, 8000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
43 MHz |
140 |
39.88 mm |
||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.25 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
16.38 ns |
1232 CLBS, 8000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
48 MHz |
140 |
39.88 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
39 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
5.2 ns |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P176 |
4.7498 mm |
39.878 mm |
No |
60 MHz |
39.878 mm |
|||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
50 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
6.1 ns |
8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
4.7498 mm |
39.878 mm |
No |
MAX 140 I/OS |
e4 |
41 MHz |
30 s |
225 °C (437 °F) |
39.878 mm |
||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
5.2 ns |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P176 |
4.7498 mm |
39.878 mm |
No |
e0 |
60 MHz |
30 s |
225 °C (437 °F) |
39.878 mm |
|||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
6.1 ns |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P176 |
4.7498 mm |
39.878 mm |
No |
41 MHz |
39.878 mm |
|||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
1232 CLBS, 8000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
60 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
50 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
39 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.25 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
1232 CLBS, 8000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
65 MHz |
140 |
39.88 mm |
|||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.25 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
3.3 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 6000 Logic gates |
e0 |
227 MHz |
30 s |
144 |
225 °C (437 °F) |
24 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.6 ns |
400 CLBS, 7000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 10000 Logic gates |
e0 |
166 MHz |
30 s |
160 |
225 °C (437 °F) |
24 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G176 |
1.6 mm |
24 mm |
No |
24 mm |
||||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
192 |
10000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 13000 Logic gates |
e0 |
166 MHz |
192 |
24 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
784 |
CMOS |
13000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G176 |
1.6 mm |
24 mm |
No |
Max usable 20000 Logic gates |
e3 |
217 MHz |
24 mm |
||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G176 |
1.6 mm |
24 mm |
No |
Max usable 13000 Logic gates |
e3 |
217 MHz |
24 mm |
||||||||||||||
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.5 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
5.1 ns |
320 CLBS, 5000 Gates |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 6000 Logic gates |
e0 |
113 MHz |
30 s |
144 |
225 °C (437 °F) |
24 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.25 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
2.2 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 6000 Logic gates |
e0 |
323 MHz |
30 s |
144 |
225 °C (437 °F) |
24 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
1368 |
Yes |
3.6 V |
576 |
CMOS |
145 |
10000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 13000 Logic gates |
e0 |
217 MHz |
145 |
24 mm |
|||||||
Xilinx |
FPGA |
Gull Wing |
176 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack |
Quad |
R-PQFP-G176 |
No |
|||||||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
400 |
CMOS |
7000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 10000 Logic gates |
e3 |
217 MHz |
24 mm |
||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 10000 Logic gates |
e0 |
166 MHz |
30 s |
160 |
225 °C (437 °F) |
24 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 20000 Logic gates |
e0 |
166 MHz |
224 |
24 mm |
|||||||
Xilinx |
FPGA |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
192 |
10000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.5 ns |
576 CLBS, 10000 Gates |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 13000 Logic gates |
e0 |
179 MHz |
192 |
24 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Typical gates = 13000-40000 |
e0 |
217 MHz |
224 |
24 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
320 |
CMOS |
5000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
2.7 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
Max usable 6000 Logic gates |
e3 |
270 MHz |
30 s |
260 °C (500 °F) |
24 mm |
|||||||||||
|
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
400 |
CMOS |
7000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Typical gates = 7000-20000 |
e3 |
30 s |
260 °C (500 °F) |
24 mm |
|||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.25 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.1 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 6000 Logic gates |
e0 |
135 MHz |
30 s |
144 |
225 °C (437 °F) |
24 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G176 |
1.6 mm |
24 mm |
No |
24 mm |
||||||||||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
324 |
Yes |
5.5 V |
324 |
CMOS |
196 |
10000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
4.6 ns |
324 CLBS, 10000 Gates |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
MAX available 16000 Logic gates |
e0 |
83 MHz |
30 s |
196 |
225 °C (437 °F) |
24 mm |
||||||||
|
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
400 |
CMOS |
7000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
1.6 ns |
400 CLBS, 7000 Gates |
Matte Tin |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 10000 Logic gates |
e3 |
166 MHz |
30 s |
260 °C (500 °F) |
24 mm |
|||||||||||||
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G176 |
1.6 mm |
24 mm |
No |
24 mm |
||||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
1.6 ns |
576 CLBS, 10000 Gates |
Quad |
S-PQFP-G176 |
1.6 mm |
24 mm |
No |
Max usable 13000 Logic gates |
166 MHz |
24 mm |
||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
784 |
CMOS |
13000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
1.6 ns |
784 CLBS, 13000 Gates |
Quad |
S-PQFP-G176 |
1.6 mm |
24 mm |
No |
Max usable 20000 Logic gates |
166 MHz |
24 mm |
||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G176 |
1.6 mm |
24 mm |
No |
Max usable 13000 Logic gates |
166 MHz |
24 mm |
|||||||||||||||
Xilinx |
FPGA |
Gull Wing |
176 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack |
Quad |
R-PQFP-G176 |
No |
|||||||||||||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G176 |
1.6 mm |
24 mm |
No |
24 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
192 |
10000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Typical gates = 10000-30000 |
e0 |
217 MHz |
192 |
24 mm |
|||||||
Xilinx |
FPGA |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G176 |
1.6 mm |
24 mm |
No |
24 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
176 |
HLFQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP176,1.0SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.3 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
No |
Max usable 20000 Logic gates |
e0 |
200 MHz |
224 |
24 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.