176 Field Programmable Gate Arrays (FPGA) 146

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

A42MX24-2TQG176I

Microchip Technology

FPGA

Industrial

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

1890

CMOS

36000

3.3

Tray

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

1.8 ns

1890 CLBS, 36000 Gates

-40 °C (-40 °F)

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Also Operates at 5 V supply

114.75 MHz

24 mm

A42MX16-TQG176I

Microchip Technology

FPGA

Industrial

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

1232

CMOS

24000

3.3

Tray

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

2.8 ns

1232 CLBS, 24000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Also Operates at 5 V supply

e3

94 MHz

24 mm

A42MX24-TQG176I

Microchip Technology

FPGA

Industrial

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

1890

CMOS

36000

3.3

Tray

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

2.5 ns

1890 CLBS, 36000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Also Operates at 5 V supply

e3

91.8 MHz

24 mm

AGLP060V2-VQG176I

Microchip Technology

FPGA

Industrial

Gull Wing

176

TFQFP

Square

Plastic/Epoxy

1584

Yes

1.575 V

1584

CMOS

137

60000

1.5

1.2/1.5 V

Flatpack, Thin Profile, Fine Pitch

TQFP176,.87SQ,16

Field Programmable Gate Arrays

1.425 V

.4 mm

85 °C (185 °F)

1584 CLBS, 60000 Gates

-40 °C (-40 °F)

Quad

S-PQFP-G176

3

1.2 mm

20 mm

No

160 MHz

137

20 mm

AGLP060V2VQG176I

Actel

FPGA

Industrial

Gull Wing

176

TFQFP

Square

Plastic/Epoxy

1584

Yes

1.575 V

1584

CMOS

137

60000

1.5

1.2/1.5 V

Flatpack, Thin Profile, Fine Pitch

TQFP176,.87SQ,16

Field Programmable Gate Arrays

1.425 V

.4 mm

85 °C (185 °F)

1584 CLBS, 60000 Gates

-40 °C (-40 °F)

Quad

S-PQFP-G176

1.2 mm

20 mm

No

160 MHz

137

20 mm

5962-9215601MXA

Texas Instruments

FPGA

Military

Pin/Peg

176

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

1232

CMOS

8000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

6.1 ns

8000 Gates

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P176

4.7498 mm

39.878 mm

No

e0

41 MHz

30 s

225 °C (437 °F)

39.878 mm

TPC1280GB-176I

Texas Instruments

FPGA

Industrial

Pin/Peg

176

HPGA

Square

Ceramic, Metal-Sealed Cofired

1232

No

5.5 V

1232

CMOS

140

8000

5

5 V

Grid Array, Heat Sink/Slug

HPGA176,15X15

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

17.55 ns

1232 CLBS, 8000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P176

5.46 mm

39.88 mm

No

MAX 140 I/OS; 998 flip-flops

43 MHz

140

39.88 mm

TPC1280GB-176C

Texas Instruments

FPGA

Commercial

Pin/Peg

176

HPGA

Square

Ceramic, Metal-Sealed Cofired

1232

No

5.25 V

1232

CMOS

140

8000

5

5 V

Grid Array, Heat Sink/Slug

HPGA176,15X15

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

16.38 ns

1232 CLBS, 8000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P176

5.46 mm

39.88 mm

No

MAX 140 I/OS; 998 flip-flops

48 MHz

140

39.88 mm

TPC1280MGB176B

Texas Instruments

FPGA

Military

Pin/Peg

176

HPGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

1232

CMOS

MIL-STD-883 Class B

8000

5

Grid Array, Heat Sink/Slug

4.5 V

2.54 mm

125 °C (257 °F)

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P176

5.46 mm

39.88 mm

No

e4

39 MHz

39.88 mm

5962-9215602MXX

Texas Instruments

FPGA

Military

Pin/Peg

176

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

1232

CMOS

8000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

5.2 ns

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P176

4.7498 mm

39.878 mm

No

60 MHz

39.878 mm

TPC1280MGB176B-1

Texas Instruments

FPGA

Military

Pin/Peg

176

HPGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

1232

CMOS

MIL-STD-883 Class B

8000

5

Grid Array, Heat Sink/Slug

4.5 V

2.54 mm

125 °C (257 °F)

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P176

5.46 mm

39.88 mm

No

e4

50 MHz

39.88 mm

5962-9215601MXC

Texas Instruments

FPGA

Military

Pin/Peg

176

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

1232

CMOS

8000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

6.1 ns

8000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P176

4.7498 mm

39.878 mm

No

MAX 140 I/OS

e4

41 MHz

30 s

225 °C (437 °F)

39.878 mm

5962-9215602MXA

Texas Instruments

FPGA

Military

Pin/Peg

176

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

1232

CMOS

8000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

5.2 ns

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P176

4.7498 mm

39.878 mm

No

e0

60 MHz

30 s

225 °C (437 °F)

39.878 mm

5962-9215601MXX

Texas Instruments

FPGA

Military

Pin/Peg

176

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

1232

CMOS

8000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

6.1 ns

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P176

4.7498 mm

39.878 mm

No

41 MHz

39.878 mm

TPC1280GB-176I1

Texas Instruments

FPGA

Industrial

Pin/Peg

176

HPGA

Square

Ceramic, Metal-Sealed Cofired

1232

No

5.5 V

1232

CMOS

140

8000

5

5 V

Grid Array, Heat Sink/Slug

HPGA176,15X15

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

1232 CLBS, 8000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P176

5.46 mm

39.88 mm

No

MAX 140 I/OS; 998 flip-flops

60 MHz

140

39.88 mm

TPC1280MGB176-1

Texas Instruments

FPGA

Military

Pin/Peg

176

HPGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

1232

CMOS

MIL-STD-883

8000

5

Grid Array, Heat Sink/Slug

4.5 V

2.54 mm

125 °C (257 °F)

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P176

5.46 mm

39.88 mm

No

e4

50 MHz

39.88 mm

TPC1280MGB176

Texas Instruments

FPGA

Military

Pin/Peg

176

HPGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

1232

CMOS

MIL-STD-883

8000

5

Grid Array, Heat Sink/Slug

4.5 V

2.54 mm

125 °C (257 °F)

1232 CLBS, 8000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P176

5.46 mm

39.88 mm

No

e4

39 MHz

39.88 mm

TPC1280GB-176C1

Texas Instruments

FPGA

Commercial

Pin/Peg

176

HPGA

Square

Ceramic, Metal-Sealed Cofired

1232

No

5.25 V

1232

CMOS

140

8000

5

5 V

Grid Array, Heat Sink/Slug

HPGA176,15X15

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

1232 CLBS, 8000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P176

5.46 mm

39.88 mm

No

MAX 140 I/OS; 998 flip-flops

65 MHz

140

39.88 mm

XC3190A-4TQ176C

Xilinx

FPGA

Other

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

320

Yes

5.25 V

320

CMOS

144

5000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP176,1.0SQ,20

Field Programmable Gate Arrays

4.75 V

.5 mm

85 °C (185 °F)

3.3 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 6000 Logic gates

e0

227 MHz

30 s

144

225 °C (437 °F)

24 mm

XC4010XL-3TQ176I

Xilinx

FPGA

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

400

Yes

3.6 V

400

CMOS

160

7000

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP176,1.0SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

1.6 ns

400 CLBS, 7000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 10000 Logic gates

e0

166 MHz

30 s

160

225 °C (437 °F)

24 mm

XC5404L-4TQ176C

Xilinx

FPGA

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

3.3

Flatpack, Low Profile, Fine Pitch

.5 mm

Quad

S-PQFP-G176

1.6 mm

24 mm

No

24 mm

XC4013XL-3HT176C

Xilinx

FPGA

Other

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

576

Yes

3.6 V

576

CMOS

192

10000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP176,1.0SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.6 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 13000 Logic gates

e0

166 MHz

192

24 mm

XC4020XL-09CHTG176C

Xilinx

FPGA

Other

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

Yes

3.6 V

784

CMOS

13000

3.3

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

1.2 ns

784 CLBS, 13000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G176

1.6 mm

24 mm

No

Max usable 20000 Logic gates

e3

217 MHz

24 mm

XC4013XL-09CHTG176C

Xilinx

FPGA

Other

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

Yes

3.6 V

576

CMOS

10000

3.3

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

1.2 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G176

1.6 mm

24 mm

No

Max usable 13000 Logic gates

e3

217 MHz

24 mm

XC3090A-7TQ176I

Xilinx

FPGA

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

320

Yes

5.5 V

320

CMOS

144

5000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP176,1.0SQ,20

Field Programmable Gate Arrays

4.5 V

.5 mm

5.1 ns

320 CLBS, 5000 Gates

Tin Lead

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 6000 Logic gates

e0

113 MHz

30 s

144

225 °C (437 °F)

24 mm

XC3190A-2TQ176C

Xilinx

FPGA

Other

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

320

Yes

5.25 V

320

CMOS

144

5000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP176,1.0SQ,20

Field Programmable Gate Arrays

4.75 V

.5 mm

85 °C (185 °F)

2.2 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 6000 Logic gates

e0

323 MHz

30 s

144

225 °C (437 °F)

24 mm

XC4013XL-09CHT176C

Xilinx

FPGA

Other

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

1368

Yes

3.6 V

576

CMOS

145

10000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

QFP176,1.0SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.2 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 13000 Logic gates

e0

217 MHz

145

24 mm

XC3390A-6VQ176C

Xilinx

FPGA

Gull Wing

176

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

5

Flatpack

Quad

R-PQFP-G176

No

XC4010XL-09CTQG176C

Xilinx

FPGA

Other

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

400

CMOS

7000

3.3

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

1.2 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 10000 Logic gates

e3

217 MHz

24 mm

XC4010XL-3TQ176C

Xilinx

FPGA

Other

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

400

Yes

3.6 V

400

CMOS

160

7000

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP176,1.0SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.6 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 10000 Logic gates

e0

166 MHz

30 s

160

225 °C (437 °F)

24 mm

XC4020XL-3HT176C

Xilinx

FPGA

Other

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

784

Yes

3.6 V

784

CMOS

224

13000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP176,1.0SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.6 ns

784 CLBS, 13000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 20000 Logic gates

e0

166 MHz

224

24 mm

XC4013XL-2HT176I

Xilinx

FPGA

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

576

Yes

3.6 V

576

CMOS

192

10000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP176,1.0SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

1.5 ns

576 CLBS, 10000 Gates

Tin Lead

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 13000 Logic gates

e0

179 MHz

192

24 mm

XC4020XL-09HT176C

Xilinx

FPGA

Other

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

784

Yes

3.6 V

784

CMOS

224

13000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP176,1.0SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.2 ns

784 CLBS, 13000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Typical gates = 13000-40000

e0

217 MHz

224

24 mm

XC3190A-3TQG176C

Xilinx

FPGA

Other

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

5.25 V

320

CMOS

5000

5

Flatpack, Low Profile, Fine Pitch

4.75 V

.5 mm

85 °C (185 °F)

2.7 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G176

3

1.6 mm

24 mm

Max usable 6000 Logic gates

e3

270 MHz

30 s

260 °C (500 °F)

24 mm

XC4010L-6TQG176C

Xilinx

FPGA

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

5.25 V

400

CMOS

7000

5

Flatpack, Low Profile, Fine Pitch

4.75 V

.5 mm

85 °C (185 °F)

400 CLBS, 7000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Typical gates = 7000-20000

e3

30 s

260 °C (500 °F)

24 mm

XC3090A-6TQ176C

Xilinx

FPGA

Other

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

320

Yes

5.25 V

320

CMOS

144

5000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP176,1.0SQ,20

Field Programmable Gate Arrays

4.75 V

.5 mm

85 °C (185 °F)

4.1 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 6000 Logic gates

e0

135 MHz

30 s

144

225 °C (437 °F)

24 mm

XC5406L-4TQ176I

Xilinx

FPGA

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

3.3

Flatpack, Low Profile, Fine Pitch

.5 mm

Quad

S-PQFP-G176

1.6 mm

24 mm

No

24 mm

XC5210-5TQ176I

Xilinx

FPGA

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

324

Yes

5.5 V

324

CMOS

196

10000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP176,1.0SQ,20

Field Programmable Gate Arrays

4.5 V

.5 mm

4.6 ns

324 CLBS, 10000 Gates

Tin Lead

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

MAX available 16000 Logic gates

e0

83 MHz

30 s

196

225 °C (437 °F)

24 mm

XC4010XL-3TQG176I

Xilinx

FPGA

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

400

CMOS

7000

3.3

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

1.6 ns

400 CLBS, 7000 Gates

Matte Tin

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 10000 Logic gates

e3

166 MHz

30 s

260 °C (500 °F)

24 mm

XC5402L-4TQ176I

Xilinx

FPGA

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

3.3

Flatpack, Low Profile, Fine Pitch

.5 mm

Quad

S-PQFP-G176

1.6 mm

24 mm

No

24 mm

XC4013XL-3HTG176I

Xilinx

FPGA

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

Yes

3.6 V

576

CMOS

10000

3.3

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

3 V

.5 mm

1.6 ns

576 CLBS, 10000 Gates

Quad

S-PQFP-G176

1.6 mm

24 mm

No

Max usable 13000 Logic gates

166 MHz

24 mm

XC4020XL-3HTG176I

Xilinx

FPGA

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

Yes

3.6 V

784

CMOS

13000

3.3

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

3 V

.5 mm

1.6 ns

784 CLBS, 13000 Gates

Quad

S-PQFP-G176

1.6 mm

24 mm

No

Max usable 20000 Logic gates

166 MHz

24 mm

XC4013XL-3HTG176C

Xilinx

FPGA

Other

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

Yes

3.6 V

576

CMOS

10000

3.3

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

1.6 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Quad

S-PQFP-G176

1.6 mm

24 mm

No

Max usable 13000 Logic gates

166 MHz

24 mm

XC3390A-3VQ176I

Xilinx

FPGA

Gull Wing

176

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

5

Flatpack

Quad

R-PQFP-G176

No

XC3390A-3TQ176C

Xilinx

FPGA

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Low Profile, Fine Pitch

.5 mm

Quad

S-PQFP-G176

1.6 mm

24 mm

No

24 mm

XC4013XL-09HT176C

Xilinx

FPGA

Other

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

576

Yes

3.6 V

576

CMOS

192

10000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP176,1.0SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.2 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Typical gates = 10000-30000

e0

217 MHz

192

24 mm

XC3390A-3TQ176I

Xilinx

FPGA

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Low Profile, Fine Pitch

.5 mm

Quad

S-PQFP-G176

1.6 mm

24 mm

No

24 mm

XC4020XL-1HT176C

Xilinx

FPGA

Other

Gull Wing

176

HLFQFP

Square

Plastic/Epoxy

784

Yes

3.6 V

784

CMOS

224

13000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP176,1.0SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.3 ns

784 CLBS, 13000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G176

3

1.6 mm

24 mm

No

Max usable 20000 Logic gates

e0

200 MHz

224

24 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.