177 Field Programmable Gate Arrays (FPGA) 9

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	Maximum Clock Frequency	No. of Outputs	Length
TPC1280GB-177C	Texas Instruments	FPGA	Commercial	Pin/Peg	177	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.25 V	1232	CMOS		140	8000	5	5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	16.38 ns	1232 CLBS, 8000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P177	5.46 mm	39.88 mm	No	MAX 140 I/OS; 998 flip-flops	48 MHz	140	39.88 mm
TPC1280MGB177B-1	Texas Instruments	FPGA	Military	Pin/Peg	177	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.5 V	1232	CMOS	MIL-STD-883 Class B	140	8000	5	5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)	Perpendicular	S-CPGA-P177	5.46 mm	39.88 mm	No		50 MHz	140	39.88 mm
TPC1280GB-177C1	Texas Instruments	FPGA	Commercial	Pin/Peg	177	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.25 V	1232	CMOS		140	8000	5	5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		1232 CLBS, 8000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P177	5.46 mm	39.88 mm	No	MAX 140 I/OS; 998 flip-flops	65 MHz	140	39.88 mm
TPC1280GB-177I1	Texas Instruments	FPGA	Industrial	Pin/Peg	177	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.5 V	1232	CMOS		140	8000	5	5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)		1232 CLBS, 8000 Gates	-40 °C (-40 °F)	Perpendicular	S-CPGA-P177	5.46 mm	39.88 mm	No	MAX 140 I/OS; 998 flip-flops	60 MHz	140	39.88 mm
TPC1280MGB177B	Texas Instruments	FPGA	Military	Pin/Peg	177	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.5 V	1232	CMOS	MIL-STD-883 Class B	140	8000	5	5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	18.72 ns	1232 CLBS, 8000 Gates	-55 °C (-67 °F)	Perpendicular	S-CPGA-P177	5.46 mm	39.88 mm	No	MAX 140 I/OS; 998 flip-flops	39 MHz	140	39.88 mm
TPC1280GB-177I	Texas Instruments	FPGA	Industrial	Pin/Peg	177	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.5 V	1232	CMOS		140	8000	5	5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	17.55 ns	1232 CLBS, 8000 Gates	-40 °C (-40 °F)	Perpendicular	S-CPGA-P177	5.46 mm	39.88 mm	No	MAX 140 I/OS; 998 flip-flops	43 MHz	140	39.88 mm
TPC1280MGB177	Texas Instruments	FPGA	Military	Pin/Peg	177	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.5 V	1232	CMOS	MIL-STD-883	140	8000	5	5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)	Perpendicular	S-CPGA-P177	5.46 mm	39.88 mm	No		39 MHz	140	39.88 mm
TPC1280MGB177-1	Texas Instruments	FPGA	Military	Pin/Peg	177	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.5 V	1232	CMOS	MIL-STD-883	140	8000	5	5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)	Perpendicular	S-CPGA-P177	5.46 mm	39.88 mm	No		50 MHz	140	39.88 mm
TPC1280GB-177M	Texas Instruments	FPGA	Military	Pin/Peg	177	PGA	Square	Ceramic	1232	No			CMOS		140		5	5 V	Grid Array	HPGA177,15X15	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Perpendicular	S-XPGA-P177			No		39 MHz	140

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.