1923 Field Programmable Gate Arrays (FPGA) 22

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VHX565T-3FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V	44280	CMOS	720	1		Grid Array	BGA1923,44X44,40		.95 V	1 mm	85 °C (185 °F)	0.59 ns	44280 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm		e1		30 s	720	245 °C (473 °F)	45 mm
XC6VHX565T-2FFG1923E	Xilinx	FPGA		Ball	1923	BGA	Square	Plastic/Epoxy	566784	Yes			CMOS	720		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B1923	4			No	e1	1286 MHz	30 s	720	245 °C (473 °F)
XC6VHX380T-2FFG1923I	Xilinx	FPGA	Industrial	Ball	1923	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1286 MHz	30 s	720	245 °C (473 °F)	45 mm
XC6VHX255T-2FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS	480	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1286 MHz	30 s	480	245 °C (473 °F)	45 mm
XC6VHX565T-1FFG1923I	Xilinx	FPGA	Industrial	Ball	1923	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1098 MHz	30 s	720	245 °C (473 °F)	45 mm
XC6VHX380T-1FFG1923I	Xilinx	FPGA	Industrial	Ball	1923	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1098 MHz	30 s	720	245 °C (473 °F)	45 mm
XC6VHX255T-1FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS	480	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1098 MHz	30 s	480	245 °C (473 °F)	45 mm
XC6VHX565T-2FFG1923I	Xilinx	FPGA	Industrial	Ball	1923	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1286 MHz	30 s	720	245 °C (473 °F)	45 mm
XC6VHX380T-3FFG1923C	Xilinx	FPGA		Ball	1923	BGA	Square	Plastic/Epoxy	382464	Yes			CMOS	720		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4			No	e1	1412 MHz	30 s	720	245 °C (473 °F)
XC6VHX565T-2FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1286 MHz	30 s	720	245 °C (473 °F)	45 mm
XC6VHX255T-2FFG1923I	Xilinx	FPGA	Industrial	Ball	1923	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS	480	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1286 MHz	30 s	480	245 °C (473 °F)	45 mm
XC6VHX380T-1FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1098 MHz	30 s	720	245 °C (473 °F)	45 mm
XC6VHX255T-2FFG1923E	Xilinx	FPGA		Ball	1923	BGA	Square	Plastic/Epoxy	253440	Yes			CMOS	480		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B1923	4			No	e1	1286 MHz	30 s	480	245 °C (473 °F)
XC6VHX380T-2FFG1923E	Xilinx	FPGA		Ball	1923	BGA	Square	Plastic/Epoxy	382464	Yes			CMOS	720		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B1923	4			No	e1	1286 MHz	30 s	720	245 °C (473 °F)
XC6VHX380T-2FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1286 MHz	30 s	720	245 °C (473 °F)	45 mm
XC6VHX255T-1FFG1923I	Xilinx	FPGA	Industrial	Ball	1923	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS	480	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1098 MHz	30 s	480	245 °C (473 °F)	45 mm
XC6VHX255T-3FFG1923C	Xilinx	FPGA		Ball	1923	BGA	Square	Plastic/Epoxy	253440	Yes			CMOS	480		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4			No	e1	1412 MHz	30 s	480	245 °C (473 °F)
XC6VHX565T-1FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1098 MHz	30 s	720	245 °C (473 °F)	45 mm
EP1S80F1923C6	Altera	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy		Yes	1.575 V	9191	CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		9191 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1923	3			No	e0				220 °C (428 °F)
EP1S80F1923C7	Altera	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy		Yes	1.575 V	9191	CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		9191 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1923	3			No	e0				220 °C (428 °F)
EP1S120F1923C6	Altera	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13130	CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		13130 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1923				No	e1				220 °C (428 °F)
EP1S120F1923C7	Altera	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13130	CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		13130 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1923				No	e1				220 °C (428 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.