1925 Field Programmable Gate Arrays (FPGA) 10

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
XC7V2000T-1FLG1925C	Xilinx	FPGA	Other	Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	1200	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925	3.75 mm	45 mm	No	e1	1818 MHz	1200	45 mm
XC7V2000T-2FLG1925C	Xilinx	FPGA	Other	Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	1200	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925	3.75 mm	45 mm	No	e1	1818 MHz	1200	45 mm
XC7V2000T-G2FLG1925E	Xilinx	FPGA		Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	1200	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925	3.75 mm	45 mm	No	e1	1818 MHz	1200	45 mm
XC7V2000T-L2FLG1925E	Xilinx	FPGA		Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	1200	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925	3.75 mm	45 mm	No	e1	1818 MHz	1200	45 mm
XC7V2000T-1FLG1925I	Xilinx	FPGA		Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	1200	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	152700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925	3.75 mm	45 mm	No	e1	1818 MHz	1200	45 mm
XC7V2000T-L2FLG1925C	Xilinx	FPGA	Other	Ball	1925	BGA	Square	Plastic/Epoxy		Yes	1.03 V	152700			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925	3.75 mm	45 mm		e1			45 mm
XC7V2000T-2FLG1925I	Xilinx	FPGA	Industrial	Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	HKMG	1200	1		Grid Array	BGA1925,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925	3.75 mm	45 mm		e1		1200	45 mm
XC7V2000T-G2FLG1925C	Xilinx	FPGA	Other	Ball	1925	BGA	Square	Plastic/Epoxy		Yes	1.03 V	152700			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925	3.75 mm	45 mm		e1			45 mm
XC7V2000T-2LFLG1925E	Xilinx	FPGA	Other	Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700		1200	1		Grid Array	BGA1925,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925	3.75 mm	45 mm		e1		1200	45 mm
XC7V2000T-2GFLG1925E	Xilinx	FPGA	Other	Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700		1200	1		Grid Array	BGA1925,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925	3.75 mm	45 mm		e1		1200	45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.