1926 Field Programmable Gate Arrays (FPGA) 30

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7VX690T-3FFG1926E	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	54150 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XC7VX690T-2FFG1926I	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XC7VX980T-1FFG1926I	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	76500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XCE7VX690T-3FFG1926E	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.58 ns	54150 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1		30 s		245 °C (473 °F)	45 mm
XC7VX1140T-L2FLG1926E	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	89000 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1926		3.75 mm	45 mm	No	e1	1818 MHz		720		45 mm
XC7VX1140T-2GFLG1926E	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy		Yes	1.03 V				1		Grid Array	BGA1926,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1926		3.75 mm	45 mm		e1					45 mm
XC7VX980T-2FFG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XC7VX980T-L2FFG1926E	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	76500 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XC7VX980T-1FFG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	CMOS	720	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	76500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XC7VX690T-1FFG1926I	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	54150 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XC7VX690T-2FFG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XC7VX1140T-1FLG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	720	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	89000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1926		3.75 mm	45 mm	No	e1	1818 MHz		720		45 mm
XCE7VX980T-1FFG1926I	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG	720	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	76500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1		30 s	720	245 °C (473 °F)	45 mm
XCE7VX690T-L2FFG1926E	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.61 ns	54150 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1		30 s		245 °C (473 °F)	45 mm
XC7VX690T-2LFFG1926E	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150		720	1		Grid Array	BGA1926,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1			720		45 mm
XCE7VX980T-2FFG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG	720	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1		30 s	720	245 °C (473 °F)	45 mm
XC7VX1140T-1FLG1926I	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	89000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1926		3.75 mm	45 mm	No	e1	1818 MHz		720		45 mm
XC7VX1140T-2FLG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	89000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1926		3.75 mm	45 mm	No	e1	1818 MHz		720		45 mm
XCE7VX980T-L2FFG1926E	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG	720	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1		30 s	720	245 °C (473 °F)	45 mm
XCE7VX980T-1FFG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG	720	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	76500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1		30 s	720	245 °C (473 °F)	45 mm
XCE7VX690T-1FFG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1		30 s		245 °C (473 °F)	45 mm
XC7VX980T-2LFFG1926E	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500		720	1		Grid Array	BGA1926,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1			720		45 mm
XCE7VX690T-2FFG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1		30 s		245 °C (473 °F)	45 mm
XC7VX980T-2LFFG1926I	Xilinx	FPGA	Industrial	Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500		720	1		Grid Array	BGA1926,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	76500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1			720		45 mm
XC7VX690T-L2FFG1926E	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	54150 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XC7VX1140T-2LFLG1926E	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy		Yes	1.03 V				1		Grid Array	BGA1926,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1926		3.75 mm	45 mm		e1					45 mm
XC7VX1140T-G2FLG1926E	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	89000 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1926		3.75 mm	45 mm	No	e1	1818 MHz		720		45 mm
XCE7VX690T-1FFG1926I	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.74 ns	54150 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1		30 s		245 °C (473 °F)	45 mm
XCE7VX690T-2FFG1926I	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.61 ns	54150 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm		e1		30 s		245 °C (473 °F)	45 mm
XC7VX690T-1FFG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	720	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No	e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.