1930 Field Programmable Gate Arrays (FPGA) 53

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
XC7VX1140T-1FLG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	1100	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	89000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.75 mm	45 mm	No	e1	1818 MHz	1100	45 mm
XC7VX485T-1FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	700	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	700	45 mm
XC7VX690T-3FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	1000	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	1000	45 mm
XC7VX690T-1FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	1000	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	1000	45 mm
XC7VX690T-2FFG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	1000	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	1000	45 mm
XC7VX1140T-2FLG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	1100	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	89000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.75 mm	45 mm	No	e1	1818 MHz	1100	45 mm
XC7VX485T-2LFFG1930E	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950		700	1		Grid Array	BGA1930,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930	4	3.65 mm	45 mm		e1		700	45 mm
XC7VX1140T-L2FLG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	1100	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	89000 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1930		3.75 mm	45 mm	No	e1	1818 MHz	1100	45 mm
XC7VX690T-L2FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	1000	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	1000	45 mm
XCE7VX980T-L2FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG	900	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1930		3.65 mm	45 mm				900	45 mm
XCE7VX485T-1FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	700	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	37950 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1930		3.65 mm	45 mm				700	45 mm
XCE7VX690T-3FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.58 ns	54150 CLBS			Bottom	S-PBGA-B1930		3.65 mm	45 mm					45 mm
XC7VX1140T-2LFLG1930E	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy		Yes	1.03 V				1		Grid Array	BGA1930,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930	4	3.75 mm	45 mm		e1			45 mm
XQ7VX485T-1RF1930M	Xilinx	FPGA	Military	Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	700	1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	37950 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1930		4.27 mm	45 mm				700	45 mm
XC7VX1140T-G2FLG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	1100	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	89000 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1930		3.75 mm	45 mm	No	e1	1818 MHz	1100	45 mm
XQ7VX980T-1RF1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG	900	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	76500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1930		4.27 mm	45 mm				900	45 mm
XC7VX485T-3FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	700	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	700	45 mm
XQ7VX690T-2RF1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	HKMG	1000	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1930		4.27 mm	45 mm				1000	45 mm
XC7VX980T-1FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	CMOS	900	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	76500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	900	45 mm
XC7VX980T-3FFG1930E	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500		900	1		Grid Array	BGA1930,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.58 ns	76500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930	4	3.65 mm	45 mm		e1		900	45 mm
XCE7VX485T-1FFG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	700	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	37950 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1930		3.65 mm	45 mm				700	45 mm
XCE7VX485T-L2FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	700	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1930		3.65 mm	45 mm				700	45 mm
XC7VX980T-1FFG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	CMOS	900	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	76500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	900	45 mm
XC7VX980T-2FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	CMOS	900	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	900	45 mm
XC7VX980T-2LFFG1930E	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500		900	1		Grid Array	BGA1930,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930	4	3.65 mm	45 mm		e1		900	45 mm
XCE7VX980T-1FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG	900	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	76500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1930		3.65 mm	45 mm				900	45 mm
XCE7VX690T-1FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1930		3.65 mm	45 mm					45 mm
XCE7VX690T-L2FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.61 ns	54150 CLBS			Bottom	S-PBGA-B1930		3.65 mm	45 mm					45 mm
XCE7VX690T-2FFG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.61 ns	54150 CLBS			Bottom	S-PBGA-B1930		3.65 mm	45 mm					45 mm
XCE7VX690T-2FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1930		3.65 mm	45 mm					45 mm
XC7VX980T-L2FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	CMOS	900	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	76500 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	900	45 mm
XC7VX690T-1FFG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	1000	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	54150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	1000	45 mm
XC7VX690T-2FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	1000	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	1000	45 mm
XC7VX485T-2FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	700	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	700	45 mm
XCE7VX485T-3FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	700	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	37950 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1930		3.65 mm	45 mm				700	45 mm
XC7VX485T-2FFG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	700	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	700	45 mm
XCE7VX485T-2FFG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	700	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1930		3.65 mm	45 mm				700	45 mm
XC7VX485T-L2FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	700	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	700	45 mm
XC7VX980T-2FFG1930I	Xilinx	FPGA	Industrial	Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500		900	1		Grid Array	BGA1930,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	76500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930	4	3.65 mm	45 mm		e1		900	45 mm
XQ7VX485T-L2RF1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	700	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1930		4.27 mm	45 mm				700	45 mm
XC7VX485T-1FFG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	700	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz	700	45 mm
XQ7VX485T-1RF1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	700	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	37950 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1930		4.27 mm	45 mm				700	45 mm
XC7VX980T-2LFFG1930I	Xilinx	FPGA	Industrial	Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500		900	1		Grid Array	BGA1930,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	76500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930	4	3.65 mm	45 mm		e1		900	45 mm
XC7VX1140T-2GFLG1930E	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy		Yes	1.03 V				1		Grid Array	BGA1930,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930	4	3.75 mm	45 mm		e1			45 mm
XCE7VX690T-1FFG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.74 ns	54150 CLBS			Bottom	S-PBGA-B1930		3.65 mm	45 mm					45 mm
XC7VX1140T-1FLG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	1100	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	89000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.75 mm	45 mm	No	e1	1818 MHz	1100	45 mm
XC7VX690T-2LFFG1930E	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150		1000	1		Grid Array	BGA1930,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930	4	3.65 mm	45 mm		e1		1000	45 mm
XQ7VX980T-L2RF1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG	900	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1930		4.27 mm	45 mm				900	45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.