1932 Field Programmable Gate Arrays (FPGA) 867

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10AX115S1F45I1SG	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	624	0.9		Grid Array	BGA1932,44X44,40		.87 V	1 mm	100 °C (212 °F)		42720 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm		Also Operates at 0.95 V nominal supply				624		45 mm
5SGXEABN1F45I2G	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	952000	Yes	.93 V	35920	TSMC	840	.9		Grid Array	BGA1932,44X44,40		.87 V	1 mm	100 °C (212 °F)		35920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.85 mm	45 mm						840		45 mm
10AX115N4F45I3SGES	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
5SGSMD6N2F45C3N	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	583000	Yes	.88 V	22000	CMOS	840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		22000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
10AX090N2F45E1SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				768		45 mm
10AX090S2F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	624	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				624		45 mm
5SGXEA5N2F45I2N	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	840	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
10AX115N4F45I3SGE2	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V	42720			.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		42720 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm								45 mm
10AX090N4F45E3SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No					768		45 mm
10AX090S4F45E3SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	624	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No					624		45 mm
10AX115N4F45E3SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No					768		45 mm
10AX115U3F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	480	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				480		45 mm
5SGXEA7N2F45C2	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	622000	Yes	.93 V	23472	CMOS	840	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
5SGXEA7N2F45I3N	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
10AT090S2F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962		624	.9		Grid Array	BGA1932,44X44,40		.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm		Also Operates at 0.95 VCC nominal				624		45 mm
10AX090S3F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	624	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				624		45 mm
10AX090U2F45E1SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	480	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				480		45 mm
10AX115N2F45E1SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				768		45 mm
10AX115N3F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				768		45 mm
10AX115U2F45I2SGES	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
5SGXEA5N2F45I2L	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
5SGXEABN2F45C2N	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	952000	Yes	.93 V	35920	CMOS	840	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		35920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
EP4SGX530NF45I3N	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	531200	Yes	.93 V	212480		920	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		212480 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1932		3.8 mm	45 mm	No		e1	717 MHz		920		45 mm
XC7VH870T-2FLG1932C	Xilinx	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	1.03 V	68450			1		Grid Array			.97 V		85 °C (185 °F)	0.61 ns	68450 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1932						e1
XC7VH870T-L2FLG1932E	Xilinx	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy		Yes	1.03 V	68450			1		Grid Array			.97 V			0.61 ns	68450 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1932						e1
XC7VH870T-1HCG1932C	Xilinx	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	1.03 V	68450			1		Grid Array			.97 V		85 °C (185 °F)	0.74 ns	68450 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B1932						e3
XC7VH870T-G2HCG1932E	Xilinx	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy		Yes	1.03 V	68450			1		Grid Array			.97 V			0.61 ns	68450 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1932						e1
XC7VH870T-1FLG1932C	Xilinx	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	1.03 V	68450			1		Grid Array			.97 V		85 °C (185 °F)	0.74 ns	68450 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1932						e1
XC7VH870T-2HCG1932C	Xilinx	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	1.03 V	68450			1		Grid Array			.97 V		85 °C (185 °F)	0.61 ns	68450 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1932						e1
XC7VH870T-G2FLG1932E	Xilinx	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy		Yes	1.03 V	68450			1		Grid Array			.97 V			0.61 ns	68450 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1932						e1
XC7VH870T-L2HCG1932E	Xilinx	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy		Yes	1.03 V	68450			1		Grid Array			.97 V			0.61 ns	68450 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1932						e1
10AX090U2F45I1MG	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
5SGXMA7N3F45	Altera	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm						Bottom	S-PBGA-B1932		3.4 mm	45 mm				12.5 MHz				45 mm
10AT115S2F45E1LG	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
5SGXMA7N3F45C2LN	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
5SGXEA9N2F45I2N	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	840000	Yes	.93 V	31700	CMOS	840	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		31700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
5SGXEA5N1F45C2N	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	840	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
10AX090N2F45E2LP	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V		CMOS	768	.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm	No					768		45 mm
EP4SGX360NF45I4	Altera	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	141440	CMOS	920	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm			141440 CLBS		Tin Lead	Bottom	S-PBGA-B1932	4	3.8 mm	45 mm	No		e0	717 MHz	20 s	920	220 °C (428 °F)	45 mm
5SGXMA5N1F45C2	Altera	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes			CMOS	840		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1932				No					840
10AX115U2F45I1MP	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
10AX115N3F45I2SP	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	CMOS	768	.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No					768		45 mm
10AX090U2F45E1SP	Altera	FPGA		Ball	1932	BGA	Square	Plastic	900000	Yes			CMOS	480	.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1932				No					480
5SGXMA5N3F45C3N	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
5SGSED6N1F45C2	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	583000	Yes	.93 V	22000	CMOS	840	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		22000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
EP4S100G3F45C1N	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy		Yes		116480					Grid Array				1 mm	85 °C (185 °F)		116480 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B		3.6 mm	45 mm								45 mm
EP4SGX530NF45C2ES	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V	21248			.9		Grid Array			.87 V	1 mm	85 °C (185 °F)		21248 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B		3.8 mm	45 mm	No		e0	800 MHz				45 mm
EP4SGX360NF45C3N	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	141440	CMOS	920	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		141440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1932	4	3.8 mm	45 mm	No		e1	717 MHz	30 s	920	245 °C (473 °F)	45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.