2104 Field Programmable Gate Arrays (FPGA) 470

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Part	Manufacturer	Programmable IC Type	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Additional Features	No. of Outputs	Length
XCKU085-1FLVB2104E	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190	676	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		676	47.5 mm
XCKU060-1FFVB2104E	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460	624	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	41460 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm		624	47.5 mm
XCKU115-L1FLVB2104E	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920	832	0.9	Grid Array	BGA2104,46X46,40	.88 V	1 mm	100 °C (212 °F)	82920 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm	Also Operates at 0.95 V nominal supply	832	47.5 mm
XCKU085-L1FLVA2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190	676	0.9	Grid Array	BGA2104,46X46,40	.88 V	1 mm	85 °C (185 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm	Also Operates at 0.95 V nominal supply	676	47.5 mm
XCKU060-2FFVB2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460	624	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	41460 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm		624	47.5 mm
XCKU035-1FLVB2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391	520	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	25391 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		520	47.5 mm
XCKU025-1FFVB2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180	312	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	85 °C (185 °F)	18180 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm		312	47.5 mm
XCKU095-L1FFVB2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200	702	0.9	Grid Array	BGA2104,46X46,40	.88 V	1 mm	85 °C (185 °F)	67200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm	Also Operates at 0.95 V nominal supply	702	47.5 mm
XCKU040-2FFVB2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300	520	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	85 °C (185 °F)	30300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm		520	47.5 mm
XCKU115-L1FLVB2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920	832	0.9	Grid Array	BGA2104,46X46,40	.88 V	1 mm	85 °C (185 °F)	82920 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm	Also Operates at 0.95 V nominal supply	832	47.5 mm
XCKU040-1FLVB2104E	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300	520	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	30300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		520	47.5 mm
XCKU060-2FLVA2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460	624	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	41460 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		624	47.5 mm
XCKU095-L1FLVB2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200	702	0.9	Grid Array	BGA2104,46X46,40	.88 V	1 mm	100 °C (212 °F)	67200 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm	Also Operates at 0.95 V nominal supply	702	47.5 mm
XCKU115-2FFVB2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920	832	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	82920 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm		832	47.5 mm
XCKU095-3FLVB2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200	702	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	100 °C (212 °F)	67200 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		702	47.5 mm
XCKU095-1FLVA2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200	702	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	67200 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		702	47.5 mm
XCKU035-L1FFVB2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391	520	0.9	Grid Array	BGA2104,46X46,40	.88 V	1 mm	100 °C (212 °F)	25391 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm	Also Operates at 0.95 V nominal supply	520	47.5 mm
XCKU040-3FLVB2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300	520	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	100 °C (212 °F)	30300 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		520	47.5 mm
XCKU095-1FLVA2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200	702	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	85 °C (185 °F)	67200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		702	47.5 mm
XCKU085-3FFVB2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190	676	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	85 °C (185 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm		676	47.5 mm
XCKU035-3FLVB2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391	520	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	85 °C (185 °F)	25391 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		520	47.5 mm
XCKU040-3FLVB2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300	520	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	85 °C (185 °F)	30300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		520	47.5 mm
XCKU040-3FFVB2104E	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300	520	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	100 °C (212 °F)	30300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm		520	47.5 mm
XCKU025-1FLVA2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180	312	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	85 °C (185 °F)	18180 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		312	47.5 mm
XCKU040-L1FLVA2104E	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300	520	0.9	Grid Array	BGA2104,46X46,40	.88 V	1 mm	100 °C (212 °F)	30300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm	Also Operates at 0.95 V nominal supply	520	47.5 mm
XCKU060-L1FLVA2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460	624	0.9	Grid Array	BGA2104,46X46,40	.88 V	1 mm	85 °C (185 °F)	41460 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm	Also Operates at 0.95 V nominal supply	624	47.5 mm
XCKU035-3FLVB2104E	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391	520	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	100 °C (212 °F)	25391 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		520	47.5 mm
XCKU115-2FFVB2104E	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920	832	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	82920 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm		832	47.5 mm
XCKU025-1FFVB2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180	312	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	18180 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm		312	47.5 mm
XCKU085-1FLVB2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190	676	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	85 °C (185 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		676	47.5 mm
XCKU040-3FFVB2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300	520	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	100 °C (212 °F)	30300 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm		520	47.5 mm
XCKU095-L1FLVA2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200	702	0.9	Grid Array	BGA2104,46X46,40	.88 V	1 mm	85 °C (185 °F)	67200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm	Also Operates at 0.95 V nominal supply	702	47.5 mm
XCKU035-L1FFVB2104E	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391	520	0.9	Grid Array	BGA2104,46X46,40	.88 V	1 mm	100 °C (212 °F)	25391 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm	Also Operates at 0.95 V nominal supply	520	47.5 mm
XCKU025-2FFVB2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180	312	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	18180 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm		312	47.5 mm
XCKU040-2FLVA2104E	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300	520	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	30300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		520	47.5 mm
XCKU040-L1FFVB2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300	520	0.9	Grid Array	BGA2104,46X46,40	.88 V	1 mm	85 °C (185 °F)	30300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	3.86 mm	47.5 mm	Also Operates at 0.95 V nominal supply	520	47.5 mm
XCKU095-1FLVB2104I	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200	702	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	67200 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		702	47.5 mm
XCKU040-2FLVA2104C	Xilinx	FPGA	Ball	2104	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300	520	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	85 °C (185 °F)	30300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B2104	4.11 mm	47.5 mm		520	47.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.