223 Field Programmable Gate Arrays (FPGA) 119

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC4005H-4PG223C

Xilinx

FPGA

Commercial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

466

No

5.25 V

196

CMOS

190

4000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

4 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

MAX 192 I/OS; 392 flip-flops; typical gates = 4000 - 5000

133.3 MHz

190

47.244 mm

XC4025E-1PGG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

784

CMOS

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

784 CLBS, 13000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e3

166 MHz

47.244 mm

XC3195-3PG223C

Xilinx

FPGA

Commercial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.25 V

484

CMOS

176

6500

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

2.7 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

270 MHz

176

47.244 mm

XC4025E-3PG223C

Xilinx

FPGA

Other

Pin/Peg

223

HPGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

5.25 V

1024

CMOS

256

15000

5

5 V

Grid Array, Heat Sink/Slug

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

2 ns

1024 CLBS, 15000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Max usable 25000 Logic gates

e0

125 MHz

256

47.244 mm

XC4013-5PG223C

Xilinx

FPGA

Other

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

576

No

5.25 V

576

CMOS

192

10000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.5 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

1536 flip-flops; typical gates = 10000-13000

e0

133.3 MHz

192

47.244 mm

XC4013-5PG223I

Xilinx

FPGA

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

576

CMOS

10000

5

Grid Array

4.5 V

2.54 mm

4.5 ns

576 CLBS, 10000 Gates

Perpendicular

S-CPGA-P223

4.064 mm

47.244 mm

No

1536 flip-flops; typical gates = 10000-13000

47.244 mm

XC3195A-3PG223C

Xilinx

FPGA

Other

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.25 V

484

CMOS

176

6500

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

2.7 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Typical gates = 6500-7500

270 MHz

176

47.244 mm

XC4025-5PG223I

Xilinx

FPGA

Industrial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

5.5 V

1024

CMOS

256

20000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

4.5 ns

1024 CLBS, 20000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

2560 flip-flops; typical gates = 20000-25000

133.3 MHz

256

47.244 mm

5962-9473001MXX

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

MIL-STD-883

5

Grid Array

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e4

47.244 mm

XC3195-5PG223C

Xilinx

FPGA

Commercial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.25 V

484

CMOS

176

6500

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

4.1 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

190 MHz

176

47.244 mm

XC4020-5PG223I

Xilinx

FPGA

Industrial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

784

No

5.5 V

784

CMOS

224

16000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

4.5 ns

784 CLBS, 16000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

2016 flip-flops; typical gates = 16000-20000

133.3 MHz

224

47.244 mm

XC4020E-3PG223I

Xilinx

FPGA

Pin/Peg

223

HPGA

Square

Ceramic, Metal-Sealed Cofired

784

No

5.5 V

784

CMOS

224

13000

5

5 V

Grid Array, Heat Sink/Slug

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

2 ns

784 CLBS, 13000 Gates

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Max usable 20000 Logic gates

125 MHz

224

47.244 mm

XQ4013XL-3PG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

1368

No

3.6 V

576

CMOS

MIL-PRF-38535

192

10000

3.3

3.3 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

3 V

2.54 mm

125 °C (257 °F)

1.6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Typical gates = 10000 to 30000

e0

166 MHz

192

47.244 mm

XC4020E-4PG223I

Xilinx

FPGA

Pin/Peg

223

HPGA

Square

Ceramic, Metal-Sealed Cofired

784

No

5.5 V

784

CMOS

224

13000

5

5 V

Grid Array, Heat Sink/Slug

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

2.7 ns

784 CLBS, 13000 Gates

Tin Lead

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Max usable 20000 Logic gates

e0

111 MHz

224

47.244 mm

XC3195-4PG223I

Xilinx

FPGA

Industrial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.5 V

484

CMOS

176

6500

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

3.3 ns

484 CLBS, 6500 Gates

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

e0

230 MHz

176

47.244 mm

5962-9851301QXX

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

3.6 V

576

CMOS

MIL-PRF-38535 Class Q

10000

3.3

Grid Array

3 V

2.54 mm

125 °C (257 °F)

1.6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

166 MHz

47.244 mm

XC4005H-5PG223C

Xilinx

FPGA

Other

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

466

No

5.25 V

196

CMOS

190

4000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.5 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

392 flip-flops; typical gates = 4000-5000

e0

133.3 MHz

190

47.244 mm

XC3195-5PG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

484

CMOS

176

6500

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

4.1 ns

484 CLBS, 6500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

190 MHz

176

47.244 mm

XC3195A-5PG223C

Xilinx

FPGA

Other

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.25 V

484

CMOS

176

6500

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.1 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Typical gates = 6500-7500

e0

188 MHz

176

47.244 mm

XC3195A-5PG223B

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

484

CMOS

38535Q/M;38534H;883B

176

6500

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

4.1 ns

484 CLBS, 6500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Typical gates = 6500-7500

188 MHz

176

47.244 mm

CP20840CPGA223A-0C

Renesas Electronics

FPGA

Commercial

Pin/Peg

223

PGA

Square

Ceramic

6740

No

CMOS

180

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Perpendicular

S-XPGA-P223

No

e0

180

CP20840CPGA223A-0M

Renesas Electronics

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic

6740

No

CMOS

180

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Perpendicular

S-XPGA-P223

No

e0

180

CP20840CPGA223A-0I

Renesas Electronics

FPGA

Industrial

Pin/Peg

223

PGA

Square

Ceramic

6740

No

CMOS

180

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Perpendicular

S-XPGA-P223

No

e0

180

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.