225 Field Programmable Gate Arrays (FPGA) 206

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5215-3BGG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.5 V	484	CMOS			15000	5		Grid Array			4.5 V	1.5 mm		3 ns	484 CLBS, 15000 Gates		Tin Silver Copper	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	Typical gates = 15000-23000	e1	83 MHz				27 mm
XC5215L-3BGG225C	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes	3.6 V	484	CMOS			15000	3.3		Grid Array			3 V	1.5 mm	85 °C (185 °F)		484 CLBS, 15000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	Typical gates = 15000-23000	e1					27 mm
XC5410-4BG225C	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes			CMOS				5		Grid Array				1.5 mm						Bottom	S-PBGA-B225		2.55 mm	27 mm	No							27 mm
XC6216-2BG225C	Xilinx	FPGA		Ball	225	BGA	Square	Plastic	4096	Yes			CMOS		256		5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		1.5 mm					Tin Lead	Bottom	S-PBGA-B225	3			No		e0	181 MHz	30 s	256	225 °C (437 °F)
XC4310-4BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes			CMOS				5		Grid Array				1.5 mm						Bottom	S-PBGA-B225		2.165 mm	27 mm	No							27 mm
XC5215-4BGG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	484	CMOS			15000	5		Grid Array			4.75 V	1.5 mm	85 °C (185 °F)	3.8 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	MAX available 23000 Logic gates	e1	83 MHz				27 mm
XA6SLX4-3CSG225Q	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic/Epoxy	3840	Yes				AEC-Q100	132			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B225	3			No		e1	62.5 MHz	30 s	132	260 °C (500 °F)
XC4013L-5BG225C	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	576	CMOS			10000	5		Grid Array			4.75 V	1.5 mm			576 CLBS, 10000 Gates			Bottom	S-PBGA-B225		3.5 mm	27 mm	No	Typical gates = 10000-30000						27 mm
XC8109-2BG225C	Xilinx	FPGA	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	2688	CMOS			9000	5		Grid Array			4.75 V	1.5 mm	70 °C (158 °F)		2688 CLBS, 9000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B225		3.5 mm	27 mm	No	1344 flip-flops; 3.3 V operation; OTP based						27 mm
XC4010E-2BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS		160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	27 mm
XC5215L-6BGG225C	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes	3.6 V	484	CMOS			15000	3.3		Grid Array			3 V	1.5 mm	85 °C (185 °F)		484 CLBS, 15000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	Typical gates = 15000-23000	e1					27 mm
XC5215L-6BG225C	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes	3.6 V	484	CMOS			15000	3.3		Grid Array			3 V	1.5 mm	85 °C (185 °F)		484 CLBS, 15000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	Typical gates = 15000-23000	e0					27 mm
XC5210-3BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS		196	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	3 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	27 mm
XC7A30T-2CSG225I	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic	33600	Yes	1.05 V		CMOS		100		1	1 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B225			13 mm	No			1286 MHz		100		13 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.