225 Field Programmable Gate Arrays (FPGA) 206

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5215-3BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	244	15000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	3 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	MAX available 23000 Logic gates	e0	83 MHz	30 s	244	225 °C (437 °F)	27 mm
XC6SLX4-3CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS	120		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	862 MHz	30 s	120	260 °C (500 °F)	13 mm
XC7A50T-1CSG225I	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic	52160	Yes	1.05 V		CMOS	100		1	1 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B225				No			1098 MHz		100
XC4013E-3BGG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	576	CMOS		10000	5		Grid Array			4.75 V	1.5 mm	85 °C (185 °F)	2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e1	125 MHz				27 mm
XC4013E-2BGG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	576	CMOS		10000	5		Grid Array			4.75 V	1.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e1	125 MHz				27 mm
XC8106-2BG225C	Xilinx	FPGA	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	1728	CMOS		6000	5		Grid Array			4.75 V	1.5 mm	70 °C (158 °F)		1728 CLBS, 6000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B225		3.5 mm	27 mm	No	864 flip-flops; 3.3 V operation; OTP based						27 mm
XC5215-4BGG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.5 V	484	CMOS		15000	5		Grid Array			4.5 V	1.5 mm		3.8 ns	484 CLBS, 15000 Gates		Tin Silver Copper	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	Typical gates = 15000-23000	e1	83 MHz				27 mm
XC5415L-4BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes						3.3		Grid Array				1.5 mm						Bottom	S-PBGA-B225		2.55 mm	27 mm	No							27 mm
XC4010D-6BG225I	Xilinx	FPGA	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS	160	8000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm	85 °C (185 °F)	6 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	2.165 mm	27 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	90.9 MHz	30 s	160	225 °C (437 °F)	27 mm
XC4010-6BG225I	Xilinx	FPGA	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS	160	8000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm	85 °C (185 °F)	6 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	2.165 mm	27 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	90.9 MHz	30 s	160	225 °C (437 °F)	27 mm
XC8109-3BG225C	Xilinx	FPGA	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	2688	CMOS		9000	5		Grid Array			4.75 V	1.5 mm	70 °C (158 °F)		2688 CLBS, 9000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B225		3.5 mm	27 mm	No	1344 flip-flops; 3.3 V operation; OTP based						27 mm
XC5410L-4BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes						3.3		Grid Array				1.5 mm						Bottom	S-PBGA-B225		2.55 mm	27 mm	No							27 mm
XC5410L-4BG225C	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy		Yes						3.3		Grid Array				1.5 mm						Bottom	S-PBGA-B225		2.55 mm	27 mm	No							27 mm
XC4010E-3PG225C	Xilinx	FPGA	Other	Pin/Peg	225	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	400			7000	5		Grid Array			4.75 V		85 °C (185 °F)	2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P225				No	Can also use 20000 gates	e3	125 MHz

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.