228 Field Programmable Gate Arrays (FPGA) 120

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5962R9957301QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

15552

Yes

2.625 V

3456

CMOS

MIL-PRF-38535 Class Q

162

661111

2.5

1.2/3.6,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

661111 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.0226 mm

39.37 mm

Yes

e4

162

39.37 mm

5962-9473002MZA

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e4

39.37 mm

5962-9957501QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

3136

CMOS

MIL-PRF-38535 Class Q

55000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.3 ns

3136 CLBS, 55000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e4

200 MHz

39.37 mm

XQVR300-4CB228B

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic

6912

Yes

CMOS

38535Q/M;38534H;883B

162

1.5/3.3,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

.635 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-XQFP-F228

No

e0

162

XQ4025E-4CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

2432

Yes

5.5 V

1024

CMOS

MIL-PRF-38535

192

15000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.7 ns

1024 CLBS, 15000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates = 45000

e0

111 MHz

192

39.37 mm

XQV300-4CBG228Q

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e3

39.37 mm

5962-9752401QYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

576

MIL-PRF-38535 Class Q

10000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 10000-30000

39.37 mm

XQV300-4CB228Q

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e0

39.37 mm

XC4013-10CB228B

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

576

MIL-STD-883 Class B

13000

5

Flatpack, Guard Ring

4.5 V

.65 mm

125 °C (257 °F)

576 CLBS, 13000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

39.37 mm

5962-9752401QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

576

MIL-PRF-38535 Class Q

10000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 10000-30000

39.37 mm

5962-9851301QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

576

CMOS

MIL-PRF-38535 Class Q

10000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 30000

166 MHz

39.37 mm

5962R9957201QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

Yes

39.37 mm

XQV600-4CBG228Q

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

3456

CMOS

MIL-PRF-38535 Class Q

661111

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

3456 CLBS, 661111 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e3

39.37 mm

5962-9473002MZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

1368

Yes

CMOS

MIL-STD-883

192

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e4

90.9 MHz

192

39.37 mm

5962-9957201QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

6912

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

162

322970

2.5

1.2/3.6,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

322970 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.0226 mm

39.37 mm

Yes

e4

162

39.37 mm

5962-9957301QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

15552

Yes

2.625 V

3456

CMOS

MIL-PRF-38535 Class Q

162

661111

2.5

1.2/3.6,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

661111 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.0226 mm

39.37 mm

Yes

e4

162

39.37 mm

XQ4036XL-3CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

3078

Yes

3.6 V

1296

CMOS

MIL-PRF-38535

192

22000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

1

3.302 mm

39.37 mm

No

Typical gates = 22000 to 65000

e0

166 MHz

192

39.37 mm

5962R9957201QYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

Yes

39.37 mm

XC4025E-4CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

2432

Yes

5.5 V

1024

CMOS

192

15000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

1024 CLBS, 15000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 15000-45000

e0

111 MHz

192

39.37 mm

XQ4013E-4CB228B

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic

1368

Yes

576

CMOS

38535Q/M;38534H;883B

192

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

.635 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-XQFP-F228

39.37 mm

No

e0

111 MHz

192

39.37 mm

XQVR300-4CBG228Q

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e3

39.37 mm

XQVR600-4CB228V

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

15552

Yes

2.625 V

3456

CMOS

316

661111

2.5

1.5/3.3,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

3456 CLBS, 661111 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e0

316

39.37 mm

5962-9752501QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

2432

Yes

5.5 V

1024

CMOS

MIL-PRF-38535 Class Q

192

15000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

1024 CLBS, 15000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 15000-45000

e4

192

39.37 mm

5962-9473001MYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e4

39.37 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.