238 Field Programmable Gate Arrays (FPGA) 132

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A12T-2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		150		10 mm
XC7A12T-1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7A12T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7A12T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG	150	0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7A25T-1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7A25T-2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		150		10 mm
XC7A12T-L2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG	150	0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		150		10 mm
XC7A12T-2CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		150		10 mm
XC7A25T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7A25T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG	150	0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7A25T-L2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	.93 V	1825	HKMG	150	0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		150		10 mm
XC7A75T-L1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	75520	Yes	.98 V	5900		300	0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		300		10 mm
XC7A35T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		250		10 mm
XC7A15T-L2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300		250	0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		250		10 mm
XC7A15-2CPG236C	Xilinx	FPGA			238			Plastic	15360	Yes	1.05 V		CMOS	140	1	1 V		BGA238,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	85 °C (185 °F)	1.05 ns		0 °C (32 °F)	Tin Silver Copper			3		10 mm	No		e1	1286 MHz	30 s	140	260 °C (500 °F)	10 mm
XC7A75T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	75520	Yes	.98 V	5900		300	0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		300		10 mm
XC7A200T-2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		500		10 mm
XC7A100T-L2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	101440	Yes	.93 V	7925		300	0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		300		10 mm
XC7A15T-2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		250		10 mm
XC7A35T-2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		250		10 mm
XC7A200T-2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		500		10 mm
XC7A15-1CPG236C	Xilinx	FPGA			238			Plastic	15360	Yes	1.05 V		CMOS	140	1	1 V		BGA238,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	85 °C (185 °F)	1.27 ns		0 °C (32 °F)	Tin Silver Copper			3		10 mm	No		e1	1098 MHz	30 s	140	260 °C (500 °F)	10 mm
XC7A15T-2CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		250		10 mm
XC7A15T-L1CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300		250	0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		250		10 mm
XC7A200T-3CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1412 MHz		500		10 mm
XC7A50T-2CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		250		10 mm
XC7A25T-2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		150		10 mm
XC7A35T-L1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600		250	0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		250		10 mm
XC7A25T-L1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG	150	0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7A12T-L2CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG	150	0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	85 °C (185 °F)	1.51 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		150		10 mm
XC7A35T-L2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	33280	Yes	.93 V	2600		250	0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		250		10 mm
XC7A35T-1CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		250		10 mm
XC7A200T-L2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825		500	0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		500		10 mm
XC7A50T-3CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1412 MHz		250		10 mm
XC7A12T-L1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG	150	0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7A25T-L2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	.93 V	1825	HKMG	150	0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		150		10 mm
XC7A15-L2CPG236E	Xilinx	FPGA			238			Plastic	15360	Yes	1.05 V		CMOS	140	1	1 V		BGA238,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	1.05 ns		0 °C (32 °F)	Tin Silver Copper			3		10 mm	No		e1	1286 MHz	30 s	140	260 °C (500 °F)	10 mm
XC7A200T-2CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		500		10 mm
XC7A25T-3CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1412 MHz		150		10 mm
XC7A50T-2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		250		10 mm
XC7A8-2CPG236C	Xilinx	FPGA			238			Plastic	8000	Yes	1.05 V		CMOS	140	1	1 V		BGA238,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	85 °C (185 °F)	1.05 ns		0 °C (32 °F)						10 mm	No			1286 MHz		140		10 mm
XC7A100T-3CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1412 MHz		300		10 mm
XC7A15T-1CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		250		10 mm
XC7A35T-1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		250		10 mm
XC7A12T-2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		150		10 mm
XC7A8-2CPG236I	Xilinx	FPGA			238			Plastic	8000	Yes	1.05 V		CMOS	140	1	1 V		BGA238,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	1.05 ns		-40 °C (-40 °F)						10 mm	No			1286 MHz		140		10 mm
XC7A100T-3CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1412 MHz		300		10 mm
XC7A25T-1CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.