280 Field Programmable Gate Arrays (FPGA) 8

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCS40XL-4CS280C	Xilinx	FPGA	Other	Ball	280	TFBGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS	224	13000	3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Field Programmable Gate Arrays	3 V	.8 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	Maximum usable gates 40000	e0	217 MHz	30 s	224	240 °C (464 °F)	16 mm
XCSG40XL-4CSG280C	Xilinx	FPGA	Other	Ball	280	TFBGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS		13000	3.3		Grid Array, Thin Profile, Fine Pitch			3 V	.8 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	Maximum usable gates 40000	e1	217 MHz				16 mm
XCSG30XL-4CSG280C	Xilinx	FPGA	Other	Ball	280	TFBGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS		10000	3.3		Grid Array, Thin Profile, Fine Pitch			3 V	.8 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	Maximum usable gates 30000	e1	217 MHz				16 mm
XCSG40XL-5CSG280C	Xilinx	FPGA	Other	Ball	280	TFBGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS		13000	3.3		Grid Array, Thin Profile, Fine Pitch			3 V	.8 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	Maximum usable gates 40000	e1	250 MHz				16 mm
XCS30XL-4CS280C	Xilinx	FPGA	Other	Ball	280	TFBGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	192	10000	3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Field Programmable Gate Arrays	3 V	.8 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	Maximum usable gates 30000	e0	217 MHz	30 s	192	240 °C (464 °F)	16 mm
XCS30XL-5CS280C	Xilinx	FPGA	Other	Ball	280	TFBGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	192	10000	3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Field Programmable Gate Arrays	3 V	.8 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	Maximum usable gates 30000	e0	250 MHz	30 s	192	240 °C (464 °F)	16 mm
XCS40XL-5CS280C	Xilinx	FPGA	Other	Ball	280	TFBGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS	224	13000	3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Field Programmable Gate Arrays	3 V	.8 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	Maximum usable gates 40000	e0	250 MHz	30 s	224	240 °C (464 °F)	16 mm
XCSG30XL-5CSG280C	Xilinx	FPGA	Other	Ball	280	TFBGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS		10000	3.3		Grid Array, Thin Profile, Fine Pitch			3 V	.8 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	Maximum usable gates 30000	e1	250 MHz				16 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.