301 Field Programmable Gate Arrays (FPGA) 484

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5CGXFC4F7M11C8N

Intel

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

50000

Yes

1.13 V

CMOS

129

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA301,21X21,20

Field Programmable Gate Arrays

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

No

129

11 mm

5CGXFC5F6M11C6N

Intel

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

77000

Yes

1.13 V

CMOS

129

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA301,21X21,20

Field Programmable Gate Arrays

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

No

129

11 mm

5CGXFC5D7M11A7

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC4C6M11I7N

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5D7M11A7

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC4D7M11C8N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC5A6M11C6N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5A7M11I7N

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC5B6M11C7N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC4C7M11C8

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC5D6M11C8N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC4A6M11C8N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC4E7M11I7N

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5F6M11I7N

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC4C7M11C7

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5F7M11I7N

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5F6M11I7

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC4D7M11C7

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC5C6M11C8N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC4A7M11I7N

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5C7M11A7

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC5C7M11A7N

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC4D6M11I7

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5E6M11C6N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5C7M11C8N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5B6M11C8

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC5D7M11C8N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC4C6M11C8

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC5F6M11C6

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

77000

Yes

1.13 V

CMOS

129

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA301,21X21,20

Field Programmable Gate Arrays

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

No

129

11 mm

5CGXFC4B7M11C7N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5B7M11C6

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC4E6M11I7

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC5A7M11A7

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC4F6M11C8

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC4A6M11A7

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC4F7M11I7

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5C6M11C6

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5E6M11C8N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC5E7M11A7N

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5B6M11C6

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5E7M11C7

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC5E6M11C7N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC4A7M11I7

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC5F6M11A7N

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC4A7M11A7

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC4B6M11C8

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC4C7M11I7

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC5D6M11C7

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.