32 Field Programmable Gate Arrays (FPGA) 21

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	No. of Outputs	Peak Reflow Temperature (C)	Length
LCMXO2-256HC-4SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square	256	Yes	3.465 V	32		21	2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32	3	.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply		21		5 mm
LCMXO2-256HC-4SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square	256	Yes	3.465 V	32		21	2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	3	.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply		21		5 mm
LCMXO2-256HC-5SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square	256	Yes	3.465 V	32		21	2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply		21		5 mm
LCMXO2-256HC-5SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square	256	Yes	3.465 V	32		21	2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply		21		5 mm
ICE40LP384-SG32	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square	384	Yes	1.26 V	48	CMOS	21	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		1 mm	5 mm				21		5 mm
LCMXO2-1200HC-6SG32I	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square	1280	Yes	3.6 V	160		21	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply		21	260 °C (500 °F)	5 mm
LCMXO2-256ZE-2SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square	256	Yes	1.26 V	32		21	1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No			21		5 mm
LCMXO2-1200HC-4SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square	1280	Yes	3.6 V	160		21	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply		21	260 °C (500 °F)	5 mm
LCMXO2-256ZE-1SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square	256	Yes	1.26 V	32		21	1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No			21		5 mm
LCMXO2-256ZE-1SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square	256	Yes	1.26 V	32		21	1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No			21		5 mm
ICE40LP384-SG32TR1K	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square		Yes	1.26 V	48	CMOS		1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.5 mm	100 °C (212 °F)		48 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N32	3	1 mm	5 mm			e3		260 °C (500 °F)	5 mm
ICE40LP384-SG32TR	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square	384	Yes	1.26 V	48	CMOS	21	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N32	3	1 mm	5 mm			e3	21	260 °C (500 °F)	5 mm
LCMXO2-256ZE-2SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square	256	Yes	1.26 V	32		21	1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No			21		5 mm
LCMXO2-256HC-6SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square	256	Yes	3.465 V	32		21	2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply		21		5 mm
LCMXO2-256ZE-3SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square	256	Yes	1.26 V	32		21	1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No			21		5 mm
LCMXO2-1200HC-4SG32I	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square	1280	Yes	3.6 V	160		21	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		1 mm	5 mm		Also Operates at 3.3 V nominal supply		21		5 mm
LCMXO2-1200HC-5SG32I	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square	1280	Yes	3.6 V	160		21	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply		21	260 °C (500 °F)	5 mm
LCMXO2-1200HC-6SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square	1280	Yes	3.6 V	160		21	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply		21	260 °C (500 °F)	5 mm
LCMXO2-1200HC-5SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square	1280	Yes	3.6 V	160		21	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply		21	260 °C (500 °F)	5 mm
LCMXO2-256HC-6SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square	256	Yes	3.465 V	32		21	2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply		21		5 mm
LCMXO2-1200ZE-1SG32I	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square	1280	Yes	1.26 V	160		21	1.2	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		1.14 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm				21	260 °C (500 °F)	5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.