320 Field Programmable Gate Arrays (FPGA) 100

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S500E-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	232	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	572 MHz	30 s	176	260 °C (500 °F)	19 mm
XC3S1200E-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	250	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	572 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S400-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	221	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	630 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S1000-4FGG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	1920 CLBS, 1000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	630 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S1200E-4FGG320CS1	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	250	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	572 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S500E-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	232	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	572 MHz	30 s	176	225 °C (437 °F)	19 mm
XC3S200A-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	248	200000	1.2	1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	667 MHz	30 s	192	260 °C (500 °F)	19 mm
XC3S1000-5FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	725 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S1600E-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	250	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	572 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S1000-4FG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	1920 CLBS, 1000000 Gates		Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	630 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S400A-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	251	400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	667 MHz	30 s	192	260 °C (500 °F)	19 mm
XC3S500E-4FG320CS1	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	232	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	572 MHz	30 s	176	225 °C (437 °F)	19 mm
XC3S200A-4FGG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	248	200000	1.2	1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	667 MHz	30 s	192	260 °C (500 °F)	19 mm
XC3S1000-5FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	725 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S1500-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	221	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	630 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S1200E-4FGG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	250	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	572 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S400A-4FGG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	251	400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	667 MHz	30 s	192	260 °C (500 °F)	19 mm
XC3S1600E-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	250	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	572 MHz	30 s	194	225 °C (437 °F)	19 mm
XC3S1000-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	630 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S1200E-5FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	250	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	657 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S1500-4FGG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	221	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	3328 CLBS, 1500000 Gates		Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	630 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S1500-5FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	221	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	725 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S1500-5FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	221	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	725 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S1600E-4FGG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	250	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	572 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S1600E-5FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	250	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	657 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S400-4FGG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	221	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	896 CLBS, 400000 Gates		Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	630 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S1000L-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes		1920	CMOS	221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0		30 s	221	225 °C (437 °F)	19 mm
XC3S500E-4FG320IS1	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	232	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	572 MHz	30 s	176	225 °C (437 °F)	19 mm
XC3S4000-5FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0		30 s		225 °C (437 °F)	19 mm
XC3S200A-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	248	200000	1.2	1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	667 MHz	30 s	192	225 °C (437 °F)	19 mm
XC3S200-4FGG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1					19 mm
XC3S500E-4FGG320IS1	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	232	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1	572 MHz	30 s	176	260 °C (500 °F)	19 mm
XC3S2000-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0		30 s		225 °C (437 °F)	19 mm
XC3S500E-5FGG320CS1	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes			CMOS	232			1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B320	3			No	e1	657 MHz	30 s	176	260 °C (500 °F)
XC3S5000-4FGG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1					19 mm
XC3S1500L-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes		3328	CMOS	221	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1		30 s	221	260 °C (500 °F)	19 mm
XC3S5000-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0		30 s		225 °C (437 °F)	19 mm
XC3S200-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0		30 s		225 °C (437 °F)	19 mm
XC3S50-4FG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0		30 s		225 °C (437 °F)	19 mm
XC3S4000-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0		30 s		225 °C (437 °F)	19 mm
XC3S500E-5FG320CS1	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes			CMOS	232			1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B320	3			No	e0	657 MHz	30 s	176	225 °C (437 °F)
XC3S1500-4FG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	221	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	3328 CLBS, 1500000 Gates		Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	630 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S1600E-4FG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	250	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	572 MHz	30 s	194	225 °C (437 °F)	19 mm
XC3S500E-4FG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	232	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	572 MHz	30 s	176	225 °C (437 °F)	19 mm
XC3S50-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1					19 mm
XC3S5000-4FG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0		30 s		225 °C (437 °F)	19 mm
XC3S1200E-4FG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	250	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	572 MHz	30 s	194	225 °C (437 °F)	19 mm
XC3S400A-5FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	251	400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	770 MHz	30 s	192	225 °C (437 °F)	19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.