323 Field Programmable Gate Arrays (FPGA) 29

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5VLX20T-1FFG323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX30T-1FF323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	2400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e0		30 s	172	225 °C (437 °F)	19 mm
XC5VLX30T-2FFG323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	2400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX30T-1FFG323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX30T-3FFG323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX20T-1FFV323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1		Grid Array	BGA323,18X18,40		.95 V	1 mm	85 °C (185 °F)	0.9 ns	1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm		e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX30T-1FFV323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1		Grid Array	BGA323,18X18,40		.95 V	1 mm	85 °C (185 °F)	0.9 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm		e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX30T-3FF323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	2400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e0		30 s	172	225 °C (437 °F)	19 mm
XC5VLX30T-3FFV323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1		Grid Array	BGA323,18X18,40		.95 V	1 mm	85 °C (185 °F)	0.67 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm		e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX30T-2FFV323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1		Grid Array	BGA323,18X18,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm		e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX20T-1FF323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	1560 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e0		30 s	172	225 °C (437 °F)	19 mm
XC5VLX30T-2FFG323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX30T-1FFG323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	2400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX30T-2FFV323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1		Grid Array	BGA323,18X18,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	2400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm		e1		30 s	172	250 °C (482 °F)	19 mm
XQ5VLX30T-1FF323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400	CMOS	172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e0	1098 MHz		172		19 mm
XC5VLX20T-2FFG323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX20T-1FFV323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1		Grid Array	BGA323,18X18,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm		e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX20T-2FF323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	1560 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e0		30 s	172	225 °C (437 °F)	19 mm
XC5VLX20T-1FFG323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX30T-2FF323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	2400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e0		30 s	172	225 °C (437 °F)	19 mm
XC5VLX20T-1FF323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	1560 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e0		30 s	172	225 °C (437 °F)	19 mm
XC5VLX20T-2FFV323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1		Grid Array	BGA323,18X18,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm		e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX30T-1FFV323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1		Grid Array	BGA323,18X18,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	2400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm		e1		30 s	172	250 °C (482 °F)	19 mm
XQ5VLX30T-2FF323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400	CMOS	172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e0	1265 MHz		172		19 mm
XC5VLX20T-2FF323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	1560 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e0		30 s	172	225 °C (437 °F)	19 mm
XC5VLX30T-2FF323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	2400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e0		30 s	172	225 °C (437 °F)	19 mm
XC5VLX20T-2FFG323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX20T-2FFV323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS	172	1		Grid Array	BGA323,18X18,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm		e1		30 s	172	250 °C (482 °F)	19 mm
XC5VLX30T-1FF323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172	1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	2400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No	e0		30 s	172	225 °C (437 °F)	19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.