358 Field Programmable Gate Arrays (FPGA) 103

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2AGX45CU17I5G	Intel	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B358		1.7 mm	17 mm					156		17 mm
EP2AGX65FU17C4N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX65FU17C5N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX45CU17C4	Altera	FPGA		Ball	358	FBGA	Square	Plastic/Epoxy	42959	Yes			CMOS	156		0.9,1.2/3.3,1.5,2.5 V	Grid Array, Fine Pitch	BGA358,20X20,32	Field Programmable Gate Arrays		.8 mm				Tin Lead	Bottom	S-PBGA-B358	3			No	e0		20 s	156	235 °C (455 °F)
EP2AGX45EU17C5	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX45EU17I3N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1			156		17 mm
EP2AGX45HU17I3	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65DU17C6N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX45FU17C4N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX65FU17C6N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX65HU17I5N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX45FU17C5N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX45CU17I5N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V		CMOS	156	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358	3	1.7 mm	17 mm	No	e1	500 MHz	30 s	156	260 °C (500 °F)	17 mm
EP2AGX45CU17C5N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V		CMOS	156	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32	Field Programmable Gate Arrays	.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358	3	1.7 mm	17 mm	No	e1	500 MHz	30 s	156	260 °C (500 °F)	17 mm
EP2AGX45HU17C5N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX45EU17C6	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX45EU17I5N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX65HU17C5	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65EU17I3	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	2530 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65DU17C6	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX45DU17C5	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65FU17C5	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX45EU17C4N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX45FU17C4	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX45FU17C5	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65DU17I3N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	2530 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1			156		17 mm
EP2AGX45DU17C6	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65EU17C6N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX65CU17C6	Altera	FPGA		Ball	358	FBGA	Square	Plastic/Epoxy	60214	Yes			CMOS	156		0.9,1.2/3.3,1.5,2.5 V	Grid Array, Fine Pitch	BGA358,20X20,32	Field Programmable Gate Arrays		.8 mm				Tin Lead	Bottom	S-PBGA-B358	3			No	e0		20 s	156	235 °C (455 °F)
EP2AGX45FU17I3	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX45DU17C4N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX65FU17I5N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX45CU17C6N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V		CMOS	156	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32	Field Programmable Gate Arrays	.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358	3	1.7 mm	17 mm	No	e1	500 MHz	30 s	156	260 °C (500 °F)	17 mm
EP2AGX65HU17I3N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	2530 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1			156		17 mm
EP2AGX45HU17I5N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX65CU17I5	Altera	FPGA		Ball	358	FBGA	Square	Plastic/Epoxy	60214	Yes			CMOS	156		0.9,1.2/3.3,1.5,2.5 V	Grid Array, Fine Pitch	BGA358,20X20,32	Field Programmable Gate Arrays		.8 mm				Tin Lead	Bottom	S-PBGA-B358	3			No	e0		20 s	156	235 °C (455 °F)
EP2AGX45DU17I5	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65DU17C4	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX45DU17I5N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX45HU17C6N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX45DU17I3	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX45CU17I3N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1			156		17 mm
EP2AGX45EU17I5	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65EU17C4	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65DU17C5N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX65EU17C5N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX45FU17I5N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX65FU17I3N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	2530 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1			156		17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.