36 Field Programmable Gate Arrays (FPGA) 86

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
ICE40LP1K-CM36	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	25		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA36,6X6,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm	No	e1	133 MHz		25	260 °C (500 °F)	2.5 mm
10M02DCV36I7G	Intel	FPGA	Industrial	Ball	36	VFBGA	Rectangular	Plastic/Epoxy	2000	Yes	1.25 V	125		246		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA36,6X6,16	Field Programmable Gate Arrays	1.15 V	.4 mm	100 °C (212 °F)		125 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36	1	.54 mm	3.396 mm	No				246		3.466 mm
10M02DCV36C8G	Intel	FPGA	Commercial Extended	Ball	36	VFBGA	Rectangular	Plastic/Epoxy	2000	Yes	1.25 V	125		246		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA36,6X6,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		125 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36	1	.54 mm	3.396 mm	No				246		3.466 mm
ICE40LP384-CM36	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	25		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm		e1			25	260 °C (500 °F)	2.5 mm
ICE40UL1K-CM36AITR	Lattice Semiconductor	FPGA	Industrial	Ball	36	BGA	Square	Plastic/Epoxy	1248	Yes	1.26 V	156	CMOS	26		1.2			Grid Array			1.14 V	.4 mm	100 °C (212 °F)	9 ns	156 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3		2.5 mm		e1			26	260 °C (500 °F)	2.5 mm
10M02DCV36C7G	Intel	FPGA	Commercial Extended	Ball	36	VFBGA	Rectangular	Plastic/Epoxy	2000	Yes	1.25 V	125		246		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA36,6X6,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		125 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36	1	.54 mm	3.396 mm	No				246		3.466 mm
ICE40UL1K-CM36AITR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	BGA	Square	Plastic/Epoxy	1248	Yes	1.26 V	156	CMOS	26		1.2			Grid Array			1.14 V	.4 mm	100 °C (212 °F)	9 ns	156 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3		2.5 mm		e1			26	260 °C (500 °F)	2.5 mm
LCMXO3LF-1300E-5UWG36ITR1K	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm					28		2.541 mm
ICE40LP1K-CM36TR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	25		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm		e1			25	260 °C (500 °F)	2.5 mm
LCMXO3LF-1300E-5UWG36CTR50	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm							2.541 mm
ICE40LP384-CM36TR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	25		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm		e1			25	260 °C (500 °F)	2.5 mm
ICE40LP384-CM36TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	25		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm		e1			25	260 °C (500 °F)	2.5 mm
LCMXO3LF-1300E-5UWG36ITR50	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm					28		2.541 mm
ICE5LP4K-SWG36ITR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	26		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9 ns	440 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36	1	.491 mm	2.078 mm				30 s	26	260 °C (500 °F)	2.078 mm
ICE5LP4K-SWG36ITR50	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	440	CMOS			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)		440 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36	1	.491 mm	2.078 mm				30 s		260 °C (500 °F)	2.078 mm
ICE5LP4K-SWG36ITR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	26		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9 ns	440 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36	1	.491 mm	2.078 mm				30 s	26	260 °C (500 °F)	2.078 mm
ICE40LP1K-CM36TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	25		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm		e1			25	260 °C (500 °F)	2.5 mm
LIF-MD6000-6UWG36ITR1K	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	1500				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm			1500 CLBS		Tin Silver Copper Nickel	Bottom	R-PBGA-B36	1	.6 mm	2.535 mm		e2				260 °C (500 °F)	2.585 mm
ICE40UL640-CM36AITR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	BGA	Square	Plastic/Epoxy	640	Yes	1.26 V	80	CMOS	26		1.2			Grid Array			1.14 V	.4 mm	100 °C (212 °F)	9 ns	80 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36			2.5 mm					26		2.5 mm
LCMXO3L-1300E-5UWG36ITR1K	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm					28		2.541 mm
LCMXO3L-1300E-5UWG36CTR	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm							2.541 mm
LCMXO3L-1300E-5UWG36CTR50	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm							2.541 mm
LCMXO3L-1300E-5UWG36ITR	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm					28		2.541 mm
AGLN010V2-UCG36I	Microchip Technology	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	260	CMOS		10000	1.2	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		260 CLBS, 10000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B36		.8 mm	3 mm	No						3 mm
LCMXO3LF-1300E-5UWG36ITR	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm					28		2.541 mm
LCMXO3LF-1300E-5UWG36CTR1K	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm							2.541 mm
ICE40UL640-CM36AITR	Lattice Semiconductor	FPGA	Industrial	Ball	36	BGA	Square	Plastic/Epoxy	640	Yes	1.26 V	80	CMOS	26		1.2			Grid Array			1.14 V	.4 mm	100 °C (212 °F)	9 ns	80 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36			2.5 mm					26		2.5 mm
LCMXO3L-1300E-5UWG36CTR1K	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm							2.541 mm
AGLN010V5-UCG36	Microchip Technology	FPGA	Other	Ball	36	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	260	CMOS		10000	1.5	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.425 V	.4 mm	70 °C (158 °F)		260 CLBS, 10000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B36		.8 mm	3 mm	No						3 mm
10M08DCV36C8	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B36
10M02DFV36I7	Altera	FPGA		Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B36
10M08DFV36C7G	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B36
10M08DAV36A7G	Altera	FPGA	Automotive	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B36
10M02DFV36I6G	Altera	FPGA		Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B36
10M02DAV36C8G	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B36
10M02DAV36I6	Altera	FPGA		Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B36
10M08DCV36C7	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B36
10M08DCV36I6G	Altera	FPGA		Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B36
10M08DCV36C8G	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B36
10M02DFV36I7G	Altera	FPGA		Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B36
10M08DAV36C7	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B36
10M08DFV36C7	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B36
10M02DFV36C8G	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B36
10M02DCV36A7G	Altera	FPGA	Automotive	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B36
10M02DFV36I6	Altera	FPGA		Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B36
10M02DCV36C7	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B36
10M02DCV36I6	Altera	FPGA		Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B36
10M08DAV36C8	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B36

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.