411 Field Programmable Gate Arrays (FPGA) 61

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XH4036XLPG411I

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

3.3

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.54 mm

Matte Tin

Perpendicular

S-CPGA-P411

5.334 mm

52.324 mm

No

e3

52.324 mm

XC4044EX-3PG411C

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

1600

CMOS

27000

5

Grid Array, Heat Sink/Slug, Interstitial Pitch

4.75 V

2.54 mm

85 °C (185 °F)

1600 CLBS, 27000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P411

4.318 mm

52.324 mm

No

Typical gates = 27000-80000

e0

125 MHz

52.324 mm

XC4052XL-2PG411I

Xilinx

FPGA

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1936

No

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

3 V

2.54 mm

1.5 ns

1936 CLBS, 33000 Gates

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 52000 Logic gates

179 MHz

352

52.324 mm

XH4044XLPG411C

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

3.3

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.54 mm

Matte Tin

Perpendicular

S-CPGA-P411

5.334 mm

52.324 mm

No

e3

52.324 mm

XC4036XL-3PG411C

Xilinx

FPGA

Other

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1296

No

3.6 V

1296

CMOS

288

22000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

3 V

2.54 mm

85 °C (185 °F)

1.6 ns

1296 CLBS, 22000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 36000 Logic gates

166 MHz

288

52.324 mm

XC4036XL-2PG411I

Xilinx

FPGA

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1296

No

3.6 V

1296

CMOS

288

22000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

3 V

2.54 mm

1.5 ns

1296 CLBS, 22000 Gates

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 36000 Logic gates

179 MHz

288

52.324 mm

XC4036EX-4PG411I

Xilinx

FPGA

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1296

No

1296

CMOS

288

22000

5

5 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

2.54 mm

1296 CLBS, 22000 Gates

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 36000 Logic gates

143 MHz

288

52.324 mm

XC4036EX-1PG411I

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

1296

CMOS

22000

5

Grid Array, Heat Sink/Slug, Interstitial Pitch

4.5 V

2.54 mm

1296 CLBS, 22000 Gates

Perpendicular

S-CPGA-P411

5.334 mm

52.324 mm

No

52.324 mm

XH4036EX-3PG411I

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

5

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.54 mm

Matte Tin

Perpendicular

S-CPGA-P411

5.334 mm

52.324 mm

No

e3

52.324 mm

XH4044EX-3PG411C

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

5

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.54 mm

Matte Tin

Perpendicular

S-CPGA-P411

5.334 mm

52.324 mm

No

e3

52.324 mm

XH4436EX-3PG411I

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

3.3

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.54 mm

Matte Tin

Perpendicular

S-CPGA-P411

5.334 mm

52.324 mm

No

e3

52.324 mm

XC4036EX-4PG411C

Xilinx

FPGA

Other

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1296

No

1296

CMOS

288

22000

5

5 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

1296 CLBS, 22000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 36000 Logic gates

143 MHz

288

52.324 mm

XC4044XL-3PG411I

Xilinx

FPGA

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1600

No

3.6 V

1600

CMOS

320

27000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

3 V

2.54 mm

1.6 ns

1600 CLBS, 27000 Gates

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 44000 Logic gates

166 MHz

320

52.324 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.