456 Field Programmable Gate Arrays (FPGA) 309

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2S100-5FG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS			100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	600 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s		225 °C (437 °F)	23 mm
XC3S1000L-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes		1920	CMOS		333	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1		30 s	333	250 °C (482 °F)	23 mm
XC2S100E-6FGG456C	Xilinx	FPGA	Commercial Extended	B	456	FBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	864	CMOS		202	52000	1.8	1.2/3.6,1.8 V	Grid Array, Fine Pitch	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	202	250 °C (482 °F)	23 mm
XC3S400-4FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		264	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	896 CLBS, 400000 Gates		Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	264	225 °C (437 °F)	23 mm
XC2VP7-7FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS		248		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	1232 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	1350 MHz	30 s	248	225 °C (437 °F)	23 mm
XC2VP7-7FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1232	CMOS				1.5		Grid Array			1.425 V	1 mm		0.28 ns	1232 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	1350 MHz	30 s		250 °C (482 °F)	23 mm
XCV150-4FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS			164674	2.5		Grid Array			2.375 V	1 mm		0.8 ns	864 CLBS, 164674 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	250 MHz	30 s		250 °C (482 °F)	23 mm
XCV300-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS		312	322970	2.5	1.2/3.6,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	333 MHz	30 s	312	225 °C (437 °F)	23 mm
XC2S50E-7FGG456C	Xilinx	FPGA		B	456	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e1	357 MHz				23 mm
XC2VP7-5FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS		248		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	1232 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	1050 MHz	30 s	248	225 °C (437 °F)	23 mm
XC2V250-4FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS		200	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	384 CLBS, 250000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	650 MHz	30 s	200	225 °C (437 °F)	23 mm
XC2S100-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS			100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s		225 °C (437 °F)	23 mm
XC3S200-4FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0					23 mm
XA3S400-4FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	125 MHz	30 s	264	250 °C (482 °F)	23 mm
XQ2V1000-4FGG456N	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS			1000000	1.5		Grid Array			1.425 V	1 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	650 MHz	30 s		250 °C (482 °F)	23 mm
XC3S5000-4FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1					23 mm
XC2S200-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			288	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 200000	e0	263 MHz	30 s	284	225 °C (437 °F)	23 mm
XC2S400E-6FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		410	145000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	2400 CLBS, 145000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 400000	e1	357 MHz	30 s	410	250 °C (482 °F)	23 mm
XC3S400-5FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	8064	Yes			CMOS		264			1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B456	3			No		e0		30 s	264	225 °C (437 °F)
XCV150-5FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS			164674	2.5		Grid Array			2.375 V	1 mm		0.7 ns	864 CLBS, 164674 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	294 MHz	30 s		250 °C (482 °F)	23 mm
XC2VP2-7FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS		156		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	352 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	1350 MHz	30 s	156	250 °C (482 °F)	23 mm
XCV200-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		284	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	294 MHz	30 s	284	225 °C (437 °F)	23 mm
XCV300E-7FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		312	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	400 MHz	30 s	312	250 °C (482 °F)	23 mm
XCV300E-8FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		312	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	1536 CLBS, 82944 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	416 MHz	30 s	312	250 °C (482 °F)	23 mm
XA3S1500-4FG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes				AEC-Q100	333			1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3			No		e0	125 MHz	30 s	333	225 °C (437 °F)
XC2V500-4FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.575 V	768	CMOS		264	500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	768 CLBS, 500000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	650 MHz	30 s	264	225 °C (437 °F)	23 mm
XC2S300E-6FG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		329	93000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		1536 CLBS, 93000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum no. of gates 300000	e0	357 MHz	30 s	329	225 °C (437 °F)	23 mm
XC2VP7-8FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1232	CMOS				1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)		1232 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
XCV200E-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		284	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	357 MHz	30 s	284	225 °C (437 °F)	23 mm
XCS300E-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V		CMOS		329		1.8	1.8,2.5,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3		23 mm	No		e0	357 MHz	30 s	329	225 °C (437 °F)	23 mm
XCS400E-7FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V		CMOS		410		1.8	1.8,2.5,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3		23 mm	No		e0	400 MHz	30 s	410	225 °C (437 °F)	23 mm
XC2V250-6FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS		200	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	384 CLBS, 250000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	820 MHz	30 s	200	225 °C (437 °F)	23 mm
XA3S400-4FG456Q	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	8064	Yes				AEC-Q100	264			1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3			No		e0	125 MHz	30 s	264	225 °C (437 °F)
XQR2V1000-4FGG456R	Xilinx	FPGA	Military	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS			1000000	1.5		Grid Array			1.425 V	1 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	650 MHz	30 s		250 °C (482 °F)	23 mm
XQR2V1000-4FG456R	Xilinx	FPGA	Military	Ball	456	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		324	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.44 ns	1280 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	650 MHz	30 s	324	225 °C (437 °F)	23 mm
XC2S100-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS			100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s		225 °C (437 °F)	23 mm
XC3S50-4FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0					23 mm
XCS100E-7FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V		CMOS		202		1.8	1.8,2.5,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3		23 mm	No		e0	400 MHz	30 s	202	225 °C (437 °F)	23 mm
XC2VP4-7FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS		248		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	752 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	1350 MHz	30 s	248	250 °C (482 °F)	23 mm
XC3S400-4FG456I0974	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.26 V	896	CMOS			400000	1.2		Grid Array			1.14 V	1 mm		0.61 ns	896 CLBS, 400000 Gates		Tin Lead	Bottom	S-PBGA-B456		2.6 mm	23 mm	No		e0	630 MHz				23 mm
XC2VP4-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS		248		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	752 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	1050 MHz	30 s	248	225 °C (437 °F)	23 mm
XC2S200E-6FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS		289	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	289	250 °C (482 °F)	23 mm
XC2V250-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS		200	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	384 CLBS, 250000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	650 MHz	30 s	200	250 °C (482 °F)	23 mm
XCV200E-7FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		284	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	400 MHz	30 s	284	225 °C (437 °F)	23 mm
XCV300E-7FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		312	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	400 MHz	30 s	312	225 °C (437 °F)	23 mm
XC2VP2-7FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.575 V	352	CMOS				1.5		Grid Array			1.425 V	1 mm		0.28 ns	352 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	1350 MHz	30 s		250 °C (482 °F)	23 mm
XC2V500-6FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.575 V	768	CMOS		264	500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	768 CLBS, 500000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	820 MHz	30 s	264	225 °C (437 °F)	23 mm
XCV200-5FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1176	CMOS			236666	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	294 MHz	30 s		250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.