560 Field Programmable Gate Arrays (FPGA) 338

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC40200XV-09BG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	7056	Yes	2.7 V	7056	CMOS		448	130000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm		1.3 ns	7056 CLBS, 130000 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 400000 gates	e0	225 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC4052XLA-8BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	263 MHz				42.5 mm
XCV2000E-8BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS		404	518400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.4 ns	9600 CLBS, 518400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	416 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XC40250XV-08BG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	8464	Yes	2.7 V	8464	CMOS		448	180000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm		1.1 ns	8464 CLBS, 180000 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 500000 gates	e0	258 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC4052XLA-07BG560I	Xilinx	FPGA		Ball	560	BGA	Square		Plastic/Epoxy	1936	Yes			CMOS		352		3.3	3.3 V	Grid Array	BGA560,33X33,50	Field Programmable Gate Arrays		1.27 mm					Tin Lead	Bottom	S-PBGA-B560	3			No		e0	294 MHz	30 s	352	225 °C (437 °F)
XCV800-4BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	4704	CMOS			888439	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4052XLA-9BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	227 MHz				42.5 mm
XC4062XLA-9BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	227 MHz				42.5 mm
XCV1000E-7BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		404	331776	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XCV600E-8BG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		404	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.4 ns	3456 CLBS, 186624 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV600E-7BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		404	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	3456 CLBS, 186624 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XC4052XL-2BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.5 ns	1936 CLBS, 33000 Gates		Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Max usable 52000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	42.5 mm
XCV400-6BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	2400	CMOS			468252	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.6 ns	2400 CLBS, 468252 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4052XLA-09BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 100000 gates	e1	227 MHz	30 s		260 °C (500 °F)	42.5 mm
XCV400-5BG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	10800	Yes	2.625 V	2400	CMOS		404	468252	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.7 ns	2400 CLBS, 468252 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	294 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC4085XL-09BG560I	Xilinx	FPGA		Ball	560	BGA	Square		Plastic/Epoxy	3136	Yes			CMOS		448		3.3	3.3 V	Grid Array	BGA560,33X33,50	Field Programmable Gate Arrays		1.27 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3			No		e0	217 MHz	30 s	448	225 °C (437 °F)
XC4085XL-2BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.5 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Max usable 85000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	42.5 mm
XCV400E-6BG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		404	129600	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	2400 CLBS, 129600 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	357 MHz	30 s	404	225 °C (437 °F)	42.5 mm
5962-9957401QXX	Xilinx	FPGA	Military	Ball	560	BGA	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V		CMOS			1124022	2.5		Grid Array			2.375 V	1.27 mm	125 °C (257 °F)		1124022 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-B560		5.35 mm	42.5 mm	No							42.5 mm
XC4085XLA-8BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	3136 CLBS, 55000 Gates		Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	263 MHz				42.5 mm
XC40250XV-08BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy	8464	Yes	2.7 V	8464	CMOS		448	180000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 500000 gates	e0	258 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC40250XV-07BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy	8464	Yes	2.7 V	8464	CMOS		448	180000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 500000 gates	e0	296 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XCV1600E-7BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS		404	419904	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	400 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC40250XV-9BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.7 V	8464	CMOS			180000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	1.2 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B560		1.7 mm	42.5 mm	No			188 MHz				42.5 mm
XC40150XV-08BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy	5184	Yes	2.7 V	5184	CMOS		448	100000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 300000 gates	e0	258 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XCV300-4BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.6 ns	1536 CLBS, 322970 Gates		Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1					42.5 mm
XQVR1000-4CGG560Q	Xilinx	FPGA	Military		560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q		1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X560		4.9 mm	42.5 mm	No		e3					42.5 mm
XC4062XLA-09BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 130000 gates	e0	227 MHz	30 s	384	225 °C (437 °F)	42.5 mm
XCV800-4BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS		404	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	250 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV800-6BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	4704	CMOS			888439	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.6 ns	4704 CLBS, 888439 Gates		Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4052XL-3BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.6 ns	1936 CLBS, 33000 Gates		Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Max usable 52000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	42.5 mm
XCV1000-4BG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	27648	Yes	2.625 V	6144	CMOS		404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.8 ns	6144 CLBS, 1124022 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	250 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV400-5BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	2400	CMOS			468252	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.7 ns	2400 CLBS, 468252 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	294 MHz	30 s		260 °C (500 °F)	42.5 mm
XCV1000-6BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	6144	CMOS			1124022	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	6144 CLBS, 1124022 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	42.5 mm
XCV812E-6BG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square		Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS		404	254016	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	357 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC40200XV-8BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.7 V	7056	CMOS			130000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	7056 CLBS, 130000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	217 MHz				42.5 mm
XC40110XV-8BG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm		1.1 ns	4096 CLBS, 75000 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	217 MHz				42.5 mm
XC40200XV-07BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy	7056	Yes	2.7 V	7056	CMOS		448	130000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1 ns	7056 CLBS, 130000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 400000 gates	e0	296 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XCV600-4BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	3456	CMOS			661111	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.8 ns	3456 CLBS, 661111 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	42.5 mm
XCV400-6BG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	10800	Yes	2.625 V	2400	CMOS		404	468252	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.6 ns	2400 CLBS, 468252 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	333 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC4052XL-09BG560I	Xilinx	FPGA		Ball	560	BGA	Square		Plastic/Epoxy	1936	Yes			CMOS		352		3.3	3.3 V	Grid Array	BGA560,33X33,50	Field Programmable Gate Arrays		1.27 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3			No		e0	217 MHz	30 s	352	225 °C (437 °F)
XC4052XLA-08BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	1936 CLBS, 33000 Gates		Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 100000 gates	e1	263 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4062XLA-8BG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	2304 CLBS, 40000 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	263 MHz				42.5 mm
XCV1600E-7BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS		404	419904	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XC40110XV-7BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	0.9 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	250 MHz				42.5 mm
XCV800-4BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	4704	CMOS			888439	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.8 ns	4704 CLBS, 888439 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4052XLA-08BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 100000 gates	e1	263 MHz	30 s		260 °C (500 °F)	42.5 mm
XCV600-5BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	3456	CMOS			661111	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	294 MHz	30 s		260 °C (500 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.