64 Field Programmable Gate Arrays (FPGA) 72

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LCMXO2-256ZE-1UMG64I	Lattice Semiconductor	FPGA		Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO2-256ZE-1UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO2-256HC-4UMG64I	Lattice Semiconductor	FPGA		Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	3.465 V			44		2.5	Tray	2.5/3.3 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	2.375 V	.4 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO2-256HC-4UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	3.465 V			44		2.5	Tray	2.5/3.3 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	2.375 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO2-256ZE-3UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LIF-MD6000-6UMG64I	Lattice Semiconductor	FPGA		Ball	64	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	1500				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm			1500 CLBS			Bottom	S-PBGA-B64		1 mm	3.5 mm								3.5 mm
LCMXO2-256HC-5UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	3.465 V			44		2.5	Tray	2.5/3.3 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	2.375 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	44	260 °C (500 °F)	4 mm
LIF-MDF6000-6UMG64I	Lattice Semiconductor	FPGA	Industrial	Ball	64	VFBGA	Square	Plastic/Epoxy	5936	Yes	1.26 V	742		29		1.2			Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16		1.14 V	.4 mm	100 °C (212 °F)		742 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B64		1 mm	3.5 mm						29		3.5 mm
EX64TQ64	Actel	FPGA	Commercial	Gull Wing	64	LFQFP	Square	Plastic/Epoxy	192	Yes	2.7 V	128	CMOS	41	3000	2.5		2.5,2.5/5 V	Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	70 °C (158 °F)	1 ns	128 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.6 mm	10 mm	No	Also requires 2.5 V OR 3.3 V OR 5 V supply	e0	250 MHz		41		10 mm
EX64-TQ64	Microchip Technology	FPGA		Gull Wing	64	LFQFP	Square	Plastic/Epoxy		Yes	2.7 V	128	CMOS	41	3000	2.5			Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20		2.3 V	.5 mm	70 °C (158 °F)	1 ns	128 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G64		1.6 mm	10 mm		2000 typical gates available		250 MHz		41		10 mm
LCMXO2-256ZE-2UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO2-256ZE-2UMG64I	Lattice Semiconductor	FPGA		Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
EX128-TQG64I	Microchip Technology	FPGA	Industrial	Gull Wing	64	LFQFP	Square	Plastic/Epoxy		Yes	2.7 V	256	CMOS	46	6000	2.5			Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20		2.3 V	.5 mm	85 °C (185 °F)		256 CLBS, 6000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.6 mm	10 mm		4000 typical gates available	e3		30 s	46	260 °C (500 °F)	10 mm
LCMXO2-256HC-6UMG64I	Lattice Semiconductor	FPGA		Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	3.465 V			44		2.5	Tray	2.5/3.3 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	2.375 V	.4 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	44	260 °C (500 °F)	4 mm
EX64-TQG64I	Microchip Technology	FPGA	Industrial	Gull Wing	64	LFQFP	Square	Plastic/Epoxy		Yes	2.7 V	128	CMOS	41	3000	2.5			Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20		2.3 V	.5 mm	85 °C (185 °F)		128 CLBS, 3000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.6 mm	10 mm		2000 typical gates available	e3		30 s	41	260 °C (500 °F)	10 mm
XC5202-6VQ64I	Xilinx	FPGA		Gull Wing	64	TFQFP	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	84	2000	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.5 V	.5 mm		5.6 ns	64 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	240 °C (464 °F)	10 mm
XC5202-3VQG64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5			Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	3 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	10 mm
XC3330A-3TQ64I	Xilinx	FPGA		Gull Wing	64	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS			5			Flatpack										Quad	R-PQFP-G64				No
XC3330L-8VQ64I	Xilinx	FPGA		Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes			CMOS			3.3			Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G64		1.2 mm	10 mm	No							10 mm
XC5202-6VQG64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5			Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	5.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	10 mm
XC3030L-8VQ64I	Xilinx	FPGA	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS	54	1500	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	6.7 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	Max usable 2000 Logic gates	e0	80 MHz	30 s	54	240 °C (464 °F)	10 mm
XC3130A-1VQ64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	54	1500	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.75 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	Max usable 2000 Logic gates	e0	323 MHz	30 s	54	240 °C (464 °F)	10 mm
XC3130A-3VQ64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	54	1500	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2.7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	Max usable 2000 Logic gates	e0	270 MHz	30 s	54	240 °C (464 °F)	10 mm
XC2318L-70VQ64I	Xilinx	FPGA		Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes			CMOS			3.3			Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G64		1.2 mm	10 mm	No			70 MHz				10 mm
XC2018L-10VQ64C	Xilinx	FPGA	Other	Gull Wing	64	LFQFP	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS	54	1000	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	9.5 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.27 mm	10 mm	No	174 flip-flops; typical gates = 1000-1500	e0	70 MHz	30 s	54	240 °C (464 °F)	10 mm
XC3330A-6VQ64I	Xilinx	FPGA		Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes			CMOS			5			Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G64		1.2 mm	10 mm	No							10 mm
XC2318L-70PQ64C	Xilinx	FPGA		Gull Wing	64	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS			3.3			Flatpack										Quad	R-PQFP-G64				No			70 MHz
XC2318-70VQ64I	Xilinx	FPGA		Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes			CMOS			5			Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G64		1.2 mm	10 mm	No			70 MHz				10 mm
XC3130A-4VQ64I	Xilinx	FPGA		Gull Wing	64	TFQFP	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	54	1500	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.5 V	.5 mm		3.3 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	Max usable 2000 Logic gates	e0	227 MHz	30 s	54	240 °C (464 °F)	10 mm
XC2018-130VQ64C	Xilinx	FPGA	Other	Gull Wing	64	LFQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	54	1000	5		5 V	Flatpack, Low Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	5.5 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.27 mm	10 mm	No	174 flip-flops; typical gates = 1000-1500	e0	130 MHz	30 s	54	240 °C (464 °F)	10 mm
XC3330L-8VQ64C	Xilinx	FPGA		Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes			CMOS			3.3			Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G64		1.2 mm	10 mm	No							10 mm
XC3330L-8TQ64I	Xilinx	FPGA		Gull Wing	64	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS			3.3			Flatpack										Quad	R-PQFP-G64				No
XC3130A-2VQ64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	54	1500	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2.2 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	Max usable 2000 Logic gates	e0	323 MHz	30 s	54	240 °C (464 °F)	10 mm
XC5202-4VQ64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	84	2000	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.8 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	240 °C (464 °F)	10 mm
XC5202-5VQ64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	84	2000	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	240 °C (464 °F)	10 mm
XC5202-6VQ64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	84	2000	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	5.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	240 °C (464 °F)	10 mm
XC3330A-6TQ64C	Xilinx	FPGA		Gull Wing	64	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS			5			Flatpack										Quad	R-PQFP-G64				No
XC2318L-70PQ64I	Xilinx	FPGA		Gull Wing	64	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS			3.3			Flatpack										Quad	R-PQFP-G64				No			70 MHz
XC3130A-4VQ64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	54	1500	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.3 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	Max usable 2000 Logic gates	e0	227 MHz	30 s	54	240 °C (464 °F)	10 mm
XC3020L-8VQ64C	Xilinx	FPGA	Commercial	Gull Wing	64	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	64	CMOS			3.3			Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	70 °C (158 °F)		64 CLBS	0 °C (32 °F)		Quad	S-PQFP-G64		1.27 mm	10 mm	No	MAX 64 I/OS; 1300 to 7500 available gates						10 mm
XC5202-5VQG64I	Xilinx	FPGA		Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS		2000	5			Flatpack, Thin Profile, Fine Pitch			4.5 V	.5 mm		4.6 ns	64 CLBS, 2000 Gates		Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	10 mm
XC2018LVQ64C	Xilinx	FPGA	Commercial	Gull Wing	64	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	100	CMOS		1500	3.3			Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	70 °C (158 °F)		100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQFP-G64		1.27 mm	10 mm	No	MAX 74 I/OS; 1200 to 1500 available gates						10 mm
XC2318-70PQ64C	Xilinx	FPGA		Gull Wing	64	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS			5			Flatpack										Quad	R-PQFP-G64				No			70 MHz
XC5202-3VQ64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	84	2000	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	240 °C (464 °F)	10 mm
XC5202-5VQG64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5			Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	4.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	10 mm
XC3130A-5VQ64I	Xilinx	FPGA		Gull Wing	64	TFQFP	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	54	1500	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.5 V	.5 mm		4.1 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	Typical gates = 1500-2000	e0	188 MHz	30 s	54	240 °C (464 °F)	10 mm
XC3030L-8VQ64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS	54	1500	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	6.7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	Max usable 2000 Logic gates	e0	80 MHz	30 s	54	240 °C (464 °F)	10 mm
XC3030A-7VQ64I	Xilinx	FPGA	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	54	1500	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	54	240 °C (464 °F)	10 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.