672 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length
5CEFA9F27C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm	No			336		27 mm
5CSEMA6U23C8	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy	110000	Yes	1.13 V	CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No			145		23 mm
5CGXBC4B7F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXBC4D7F27I7N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm				Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXBA1D4F27C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
5AGXMA3D6F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	670 MHz			27 mm
5AGXFA7K6F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm			Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
5CEBA9F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXBC7C6F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXFC4A6F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXBA1H4F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz			27 mm
EP1SGX25GF672C7ES	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		3.5 mm	27 mm	No	e0				27 mm
5CGXBC4D6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXFA3D4F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz			27 mm
5CSEBA4U23C6S	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm						23 mm
5CGXFC5F7F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
EP20K300EFI672-1X	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	11520	Yes		CMOS	400		1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm				Bottom	S-PBGA-B672	3			No			400	220 °C (428 °F)
5AGXFA7G6F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz			27 mm
EP1SGX25GF672I7N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	CMOS		1.5		Grid Array			1.425 V	1 mm			Tin Silver Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No	e1				27 mm
5AGXMA5G4F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz			27 mm
5AGXBA5K6F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz			27 mm
5CGXBC7B7F27I7N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm				Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXBA3H6F27I3N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V			1.15		Grid Array			1.12 V	1 mm			Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	670 MHz			27 mm
EP1SGX25FF672I7ES	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	CMOS		1.5		Grid Array			1.425 V	1 mm			Tin Lead	Bottom	S-PBGA-B672		3.5 mm	27 mm	No	e0				27 mm
5CGTFD9B5F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXFA3G4F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm			Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
5AGXMA1K4F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
5CGXFC5A6F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm				Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
EP1S80F672I7ES	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	CMOS		1.5		Grid Array			1.425 V				Tin Lead	Bottom	S-PBGA-B672				No	e0
5AGXMA5G6F27C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz			27 mm
5CGXFC4C6F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXBC9D6F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXBA7D4F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	500 MHz			27 mm
5CGXFC9C7F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXBA7G4F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
5CGXBC5E6F27C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXBC4A6F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
10AX027E1F27E1SP	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	.93 V			.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm						27 mm
5CGXBC5F7F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXBA3H6F27I3	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V			1.15		Grid Array			1.12 V	1 mm			Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz			27 mm
5AGXFA5D4F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm			Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm	No	e1	622 MHz	336		27 mm
10M40DFF672C7G	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	40000	Yes		CMOS	500	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No	e1		500
10AX022E3F27E2LG	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm	No			240		27 mm
5CEBA7F27C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXFC9A7F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5AGXBA1G4F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz			27 mm
5CGTFD9D5F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm
5CGXFC9B7F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V			1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)	0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm						27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.