672 Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5CGXFC4A6F27C7

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXFA7K4F27C5

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

5AGXBA3H6F27C4

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

5CGXFC9C6F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXFC7E7F27C8

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC7E7F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXFC7E6F27C8

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXMA3D6F27I3N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

670 MHz

27 mm

5CSEMA4U23C72

Altera

FPGA

Ball

672

FBGA

Square

Plastic/Epoxy

40000

Yes

CMOS

124

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,26X26,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B672

No

124

5CGXBC5E7F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CSXFC4C6U23A7N

Altera

FPGA

Automotive

Ball

672

FBGA

Square

Plastic/Epoxy

40000

Yes

1.13 V

CMOS

145

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,28X28,32

Field Programmable Gate Arrays

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

No

145

23 mm

5CGXBC4C7F27C8N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

50000

Yes

1.13 V

CMOS

336

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2 mm

27 mm

No

e1

336

27 mm

5AGXBA3H4F27I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

5CSXFC2C6U23C8N

Altera

FPGA

Other

Ball

672

FBGA

Square

Plastic/Epoxy

25000

Yes

1.13 V

CMOS

145

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,28X28,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

No

145

23 mm

10AX032E2F27I2LG

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

No

240

27 mm

5CGXFC9F6F27C7N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXFC7D6F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXMA1K6F27I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

EP1S80B672I6ES

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B672

No

e0

5AGXBA1G4F27I5

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

10M40DCF672I7

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B672

5AGXFA3G6F27I3N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

670 MHz

27 mm

5CGXFC9C7F27C7

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC7E6F27A7N

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

10AS032E5F27I3SP

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

11990

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

11990 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B672

No

240

EP4CGX75BF27I7

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array

1.15 V

1 mm

Bottom

S-PBGA-B672

2.4 mm

27 mm

27 mm

10AS027E1F27E1LG

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

5CGTFD7D5F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP2S60F672I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

60440

Yes

CMOS

492

1.2,1.5/3.3,3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B672

3

No

e0

484

220 °C (428 °F)

5AGXBA3K4F27C6

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

500 MHz

27 mm

EP1S40F672I6ES

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B672

No

e0

5AGXFA7G4F27C4

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

5AGXFA1D6F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

5AGXFA1K4F27I5N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

10AS022E3F27I2SG

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

220000

Yes

.93 V

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

No

240

27 mm

5AGXMA5D4F27I5

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

5CSXFC4D6U23C6N

Altera

FPGA

Other

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

10AS032E4F27E3LP

Altera

FPGA

Ball

672

BGA

Square

Plastic

320000

Yes

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B672

No

240

EP1S25F672C8

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

25660

Yes

1.575 V

2852

CMOS

706

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

2852 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

20 s

706

220 °C (428 °F)

27 mm

5CGXBC4F6F27C7N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGTFD5B5F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXFC7D7F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CEFA5F27C6

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

76500

Yes

CMOS

360

1.1,1.2/3.3,2.5 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B672

No

360

5CGXFC5C7F27C6

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXFC9B6F27A7N

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC9A7F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC7D6F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXBA5K4F27C4N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

670 MHz

27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.