680 Field Programmable Gate Arrays (FPGA) 96

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV1000-5FGG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	6144	CMOS		1124022	2.5		Grid Array, Low Profile			2.375 V	1 mm		0.7 ns	6144 CLBS, 1124022 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e1	294 MHz	30 s		260 °C (500 °F)	40 mm
XCV600E-7FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1	400 MHz	30 s	512	260 °C (500 °F)	40 mm
XCV800-5FG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS	512	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e0	294 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV600E-8FGG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	3456 CLBS, 186624 Gates		Tin Silver Copper	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1	416 MHz	30 s	512	260 °C (500 °F)	40 mm
XCV1600E-6FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	512	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1	357 MHz	30 s	512	260 °C (500 °F)	40 mm
XCV300-5FG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.5 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0					40 mm
XCV300-4FG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0					40 mm
XCV1000E-7FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	512	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	400 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV1000-6FGG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	6144	CMOS		1124022	2.5		Grid Array, Low Profile			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	6144 CLBS, 1124022 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e1	333 MHz	30 s		260 °C (500 °F)	40 mm
XCV600-5FG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	512	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e0	294 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV800-4FG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS	512	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.8 ns	4704 CLBS, 888439 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e0	250 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV600-4FGG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	3456	CMOS		661111	2.5		Grid Array, Low Profile			2.375 V	1 mm	85 °C (185 °F)	0.8 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e1	250 MHz	30 s		260 °C (500 °F)	40 mm
XCV600-6FGG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	3456	CMOS		661111	2.5		Grid Array, Low Profile			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e1	333 MHz	30 s		260 °C (500 °F)	40 mm
XCV300-5FGG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array			2.375 V	1 mm		0.5 ns	1536 CLBS, 322970 Gates		Tin Silver Copper	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1					40 mm
XCV1000-4FGG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	6144	CMOS		1124022	2.5		Grid Array, Low Profile			2.375 V	1 mm		0.8 ns	6144 CLBS, 1124022 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e1	250 MHz	30 s		260 °C (500 °F)	40 mm
XCV300-4FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1					40 mm
XCV1000-4FG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy	27648	Yes	2.625 V	6144	CMOS	512	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.8 ns	6144 CLBS, 1124022 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e0	250 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV300-5FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.5 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1					40 mm
XCV600E-7FGG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	3456 CLBS, 186624 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1	400 MHz	30 s	512	260 °C (500 °F)	40 mm
XCV600E-8FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	3456 CLBS, 186624 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	416 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV600-4FG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	512	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.8 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e0	250 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV1000E-7FGG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	512	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1	400 MHz	30 s	512	260 °C (500 °F)	40 mm
XCV1600E-7FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	512	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1	400 MHz	30 s	512	260 °C (500 °F)	40 mm
XCV2000E-6FG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	512	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	357 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV1000E-7FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	512	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1	400 MHz	30 s	512	260 °C (500 °F)	40 mm
XCV800-5FGG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	4704	CMOS		888439	2.5		Grid Array, Low Profile			2.375 V	1 mm		0.7 ns	4704 CLBS, 888439 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e1	294 MHz	30 s		260 °C (500 °F)	40 mm
XCV800-6FGG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	4704	CMOS		888439	2.5		Grid Array, Low Profile			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e1	333 MHz	30 s		260 °C (500 °F)	40 mm
XCV2000E-7FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	512	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	9600 CLBS, 518400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	400 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV600E-8FG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	416 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV600-5FGG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	3456	CMOS		661111	2.5		Grid Array, Low Profile			2.375 V	1 mm		0.7 ns	3456 CLBS, 661111 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e1	294 MHz	30 s		260 °C (500 °F)	40 mm
XCV600E-6FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	3456 CLBS, 186624 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	357 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV300-6FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array			2.375 V	1 mm		0.4 ns	1536 CLBS, 322970 Gates		Tin Lead	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0					40 mm
XCV2000E-6FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	512	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	9600 CLBS, 518400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	357 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV600-5FG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	512	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.7 ns	3456 CLBS, 661111 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e0	294 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV600-5FGG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	3456	CMOS		661111	2.5		Grid Array, Low Profile			2.375 V	1 mm	85 °C (185 °F)	0.7 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e1	294 MHz	30 s		260 °C (500 °F)	40 mm
XCV2000E-8FG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	512	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	416 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV1000E-7FG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	512	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	400 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV1000-6FG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy	27648	Yes	2.625 V	6144	CMOS	512	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.6 ns	6144 CLBS, 1124022 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e0	333 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV1600E-8FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	512	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	7776 CLBS, 419904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	416 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV2000E-8FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	512	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	9600 CLBS, 518400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	416 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV300-6FG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.4 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0					40 mm
XCV800-6FG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS	512	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e0	333 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV800-6FG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS	512	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.6 ns	4704 CLBS, 888439 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No	e0	333 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV2000E-6FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	512	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1	357 MHz	30 s	512	260 °C (500 °F)	40 mm
XCV300-4FGG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array			2.375 V	1 mm		0.6 ns	1536 CLBS, 322970 Gates		Tin Silver Copper	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1					40 mm
XCV600E-8FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1	416 MHz	30 s	512	260 °C (500 °F)	40 mm
XCV600E-7FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	3456 CLBS, 186624 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	400 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV1000E-8FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	512	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e1	416 MHz	30 s	512	260 °C (500 °F)	40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.