717 Field Programmable Gate Arrays (FPGA) 7

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
XQ2V3000-4CG717M	Xilinx	FPGA	Military	717	CGA	Square	Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X717	1	3.3 mm	35 mm	No	e0	650 MHz	516	35 mm
XQR2V3000-4CGG717V	Xilinx	FPGA	Military	717	CGA	Square	Ceramic, Metal-Sealed Cofired		Yes	1.575 V	3584	CMOS			3000000	1.5		Grid Array			1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X717		3.3 mm	35 mm	No	e3	650 MHz		35 mm
XQR2V3000-4CGG717M	Xilinx	FPGA	Military	717	CGA	Square	Ceramic, Metal-Sealed Cofired		Yes	1.575 V	3584	CMOS			3000000	1.5		Grid Array			1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X717		3.3 mm	35 mm	No	e3	650 MHz		35 mm
XQR2V3000-4CG717V	Xilinx	FPGA	Military	717	CGA	Square	Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X717		3.3 mm	35 mm	No	e0	650 MHz	516	35 mm
XQR2V3000-4CG717M	Xilinx	FPGA	Military	717	CGA	Square	Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-X717		3.3 mm	35 mm	No		650 MHz	516	35 mm
5962-0253001QZC	Xilinx	FPGA	Military	717	CGA	Square	Ceramic	32256	Yes			CMOS	38535Q/M;38534H;883B	516			1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays		1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-XBGA-X717				No		400 MHz	516
XQ2V3000-4CGG717M	Xilinx	FPGA		717	CGA	Square	Ceramic, Metal-Sealed Cofired		Yes	1.575 V	3584	CMOS			3000000	1.5		Grid Array			1.425 V	1.27 mm		0.44 ns	3584 CLBS, 3000000 Gates		Matte Tin	Bottom	S-CBGA-X717		3.3 mm	35 mm	No	e3	650 MHz		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.