784 Field Programmable Gate Arrays (FPGA) 319

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU060-1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						624		23 mm
XCKU115-2SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						832		23 mm
XCKU035-L1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				520		23 mm
XCKU095-L1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				702		23 mm
XCKU060-1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						624		23 mm
XCKU085-1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						676		23 mm
XCKU025-2SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						312		23 mm
XCKU095-3SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						702		23 mm
XCKU095-1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						702		23 mm
XCKU025-3SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						312		23 mm
XCKU115-1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						832		23 mm
XCKU060-L1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				624		23 mm
XCKU025-L1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				312		23 mm
XCKU060-2SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						624		23 mm
XCKU035-3SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						520		23 mm
XCKU085-3SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						676		23 mm
XCKU115-L1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				832		23 mm
XCKU025-L1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				312		23 mm
XCKU115-1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						832		23 mm
XCKU025-3SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						312		23 mm
XCKU060-L1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				624		23 mm
XCKU085-2SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						676		23 mm
XCKU025-1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						312		23 mm
XCKU060-3SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460		624	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						624		23 mm
XCKU085-2SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						676		23 mm
XCKU095-2SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						702		23 mm
XCKU085-L1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				676		23 mm
XCKU025-L1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				312		23 mm
XCKU035-2SFVA784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95	0.95 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.922 V	.8 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No		e1			520		23 mm
XC6VCX195T-2FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS	400	1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XCKU5P-L2SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120		304	0.72		Grid Array, Fine Pitch	BGA784,28X28,32		.698 V	.8 mm	110 °C (230 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		Also Operates at 0.85 V nominal supply	e1		30 s	304	250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.