901 Field Programmable Gate Arrays (FPGA) 100

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCE7K480T-2FFV901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	HKMG	380	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	380	245 °C (473 °F)	31 mm
XC7K355T-2LFFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	.93 V				0.9		Grid Array	BGA901,30X30,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1					31 mm
XCE7K355T-1FFV901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	27825			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	27825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7K355T-2LFFG901I	Xilinx	FPGA	Industrial	Ball	901	BGA	Square	Plastic/Epoxy	356160	Yes	.93 V	27825		300	0.9		Grid Array	BGA901,30X30,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	27825 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1			300		31 mm
XCE7K355T-2FFV901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	27825			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	27825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCE7K480T-L2FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	.97 V	37325	HKMG	380	.95		Grid Array			.93 V	1 mm	100 °C (212 °F)	0.61 ns	37325 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1			380		31 mm
XCE7K480T-2FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	HKMG	380	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37325 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1			380		31 mm
XC7K480T-2LFFG901E	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	.93 V	37325		380	0.9		Grid Array	BGA901,30X30,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	380	245 °C (473 °F)	31 mm
XC7K355T-3FFV901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	27825			1		Grid Array			.97 V	1 mm		0.58 ns	27825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1					31 mm
XCE7K355T-L2FFG901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	.93 V	27825			.9		Grid Array			.87 V	1 mm		0.91 ns	27825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XCE7K355T-2FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	27825			1		Grid Array			.97 V	1 mm		0.61 ns	27825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XC7K420T-2LFFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	.93 V				0.9		Grid Array	BGA901,30X30,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1					31 mm
XC7K480T-L2FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	.97 V	37325			.95		Grid Array			.93 V	1 mm		0.61 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCE7K355T-1FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	27825			1		Grid Array			.97 V	1 mm		0.74 ns	27825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XCE7K480T-L2FFV901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	.97 V	37325	HKMG	380	.95		Grid Array			.93 V	1 mm	100 °C (212 °F)	0.61 ns	37325 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	380	245 °C (473 °F)	31 mm
XC7K480T-2FFV901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	37325			1		Grid Array			.97 V	1 mm		0.61 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XC7K420T-1FFV901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32575			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	32575 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XCE7K420T-2FFV901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	380	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	32575 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	380	245 °C (473 °F)	31 mm
XCE7K355T-1FFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	27825			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	27825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XC7K355T-L2FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	.97 V	27825			.95		Grid Array			.93 V	1 mm		0.61 ns	27825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCE7K355T-2FFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	27825			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	27825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XC7K480T-1FFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	CMOS	380	1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1	1098 MHz	30 s	380	245 °C (473 °F)	31 mm
XCE7K420T-2FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	380	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	32575 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1			380		31 mm
XCE7K420T-L2FFG901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	.93 V	32575	HKMG	380	.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	0.91 ns	32575 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1			380		31 mm
XCE7K420T-L2FFV901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	.97 V	32575	HKMG	380	.95		Grid Array			.93 V	1 mm	100 °C (212 °F)	0.61 ns	32575 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	380	245 °C (473 °F)	31 mm
XC7K420T-1FFV901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32575			1		Grid Array			.97 V	1 mm		0.74 ns	32575 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XCE7K420T-1FFV901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	380	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	32575 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	380	245 °C (473 °F)	31 mm
XC7K420T-2FFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	CMOS	350	1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	32575 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1	1286 MHz	30 s	350	245 °C (473 °F)	31 mm
XC7K355T-L2FFV901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	.97 V	27825			.95		Grid Array			.93 V	1 mm		0.61 ns	27825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1					31 mm
XC7K480T-2LFFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	.93 V				0.9		Grid Array	BGA901,30X30,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1					31 mm
XC7K420T-3FFV901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32575			1		Grid Array			.97 V	1 mm		0.58 ns	32575 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XCE7K355T-L2FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	.97 V	27825			.95		Grid Array			.93 V	1 mm		0.61 ns	27825 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XC7K480T-1FFV901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	37325			1		Grid Array			.97 V	1 mm		0.74 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XCE7K480T-1FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	HKMG	380	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	37325 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1			380		31 mm
XC7K420T-L2FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	.97 V	32575			.95		Grid Array			.93 V	1 mm		0.61 ns	32575 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCE7K480T-1FFV901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	HKMG	380	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	380	245 °C (473 °F)	31 mm
XC7K420T-2FFG901E	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V				1		Grid Array	BGA901,30X30,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1					31 mm
XC7K420T-2LFFG901E	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	.93 V	32575		380	0.9		Grid Array	BGA901,30X30,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	32575 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	380	245 °C (473 °F)	31 mm
XC7K420T-2LFFG901I	Xilinx	FPGA	Industrial	Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	.93 V	32575		380	0.9		Grid Array	BGA901,30X30,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	32575 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1			380		31 mm
XC7K420T-1FFG901E	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V				1		Grid Array	BGA901,30X30,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1					31 mm
XC7K355T-1FFV901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	27825			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	27825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1					31 mm
XC7K355T-2LFFG901E	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	356160	Yes	.93 V	27825		300	0.9		Grid Array	BGA901,30X30,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	27825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	300	245 °C (473 °F)	31 mm
XC7K480T-2LFFG901I	Xilinx	FPGA	Industrial	Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	.93 V	37325		380	0.9		Grid Array	BGA901,30X30,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	37325 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1			380		31 mm
XCE7K480T-1FFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	HKMG	380	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1			380		31 mm
XC7K480T-L2FFV901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	.93 V	37325			.9		Grid Array			.87 V	1 mm		0.91 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCE7K355T-3FFV901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	27825			1		Grid Array			.97 V	1 mm		0.58 ns	27825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7K480T-L2FFG901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	.93 V	37325	CMOS	380	.9	0.9,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No	Also Operates at 1 V supply	e1		30 s	380	245 °C (473 °F)	31 mm
XCE7K420T-1FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	380	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	32575 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1			380		31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.