956 Field Programmable Gate Arrays (FPGA) 96

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP1S25B956C6

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S80B956C7

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

79040

Yes

1.575 V

9191

CMOS

1238

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

85 °C (185 °F)

9191 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

4

3.5 mm

40 mm

No

e0

20 s

1238

220 °C (428 °F)

40 mm

EP1S60B956I6ES

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S60B956C6

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

57120

Yes

1.575 V

6570

CMOS

1022

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

85 °C (185 °F)

6570 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

3

3.5 mm

40 mm

No

e0

20 s

1022

220 °C (428 °F)

40 mm

EP1S20B956I5ES

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S10B956C7

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S60B956I7N

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin/Silver/Copper

Bottom

S-PBGA-B956

No

e1

40 s

245 °C (473 °F)

EP1S30B956C7N

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

3819

CMOS

1.5

Grid Array

1.425 V

1.27 mm

85 °C (185 °F)

3819 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B956

3.5 mm

40 mm

No

e1

40 s

245 °C (473 °F)

40 mm

EP1S30B956C7

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

32470

Yes

1.575 V

3819

CMOS

726

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

85 °C (185 °F)

3819 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

3

3.5 mm

40 mm

No

e0

20 s

726

220 °C (428 °F)

40 mm

EP1S20B956C5ES

Altera

FPGA

Other

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S20B956C5

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S60B956C5ES

Altera

FPGA

Other

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S30B956I7

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

32470

Yes

1.575 V

CMOS

726

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

Tin Lead

Bottom

S-PBGA-B956

No

e0

726

220 °C (428 °F)

EP1S20B956I7

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S25B956C5

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S80B956C7N

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

79040

Yes

1.575 V

9191

CMOS

1238

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

85 °C (185 °F)

9191 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B956

5A

3.5 mm

40 mm

No

e1

1238

40 mm

EP1S40B956C5N

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

4697

CMOS

1.5

Grid Array

1.425 V

1.27 mm

85 °C (185 °F)

4697 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B956

3.5 mm

40 mm

No

e1

40 s

245 °C (473 °F)

40 mm

EP1S20B956C7ES

Altera

FPGA

Other

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S80B956I7

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

79040

Yes

1.575 V

CMOS

1238

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

Tin Lead

Bottom

S-PBGA-B956

No

e0

1238

220 °C (428 °F)

EP1S80B956I5

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S40B956C7

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

41250

Yes

1.575 V

4697

CMOS

822

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

85 °C (185 °F)

4697 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

3

3.5 mm

40 mm

No

e0

20 s

822

220 °C (428 °F)

40 mm

EP1S40B956C7N

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

4697

CMOS

1.5

Grid Array

1.425 V

1.27 mm

85 °C (185 °F)

4697 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B956

3.5 mm

40 mm

No

e1

40 s

245 °C (473 °F)

40 mm

EP1S60B956I7ES

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S30B956I6ES

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S80B956I6ES

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S60B956I5ES

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S40B956I5

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

41250

Yes

1.575 V

CMOS

822

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

Tin Lead

Bottom

S-PBGA-B956

No

e0

426

220 °C (428 °F)

EP1S10B956C6ES

Altera

FPGA

Other

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S40B956C5

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

41250

Yes

1.575 V

4697

CMOS

822

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

85 °C (185 °F)

4697 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

3

3.5 mm

40 mm

No

e0

20 s

822

220 °C (428 °F)

40 mm

EP1S25B956I6

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S25B956C5ES

Altera

FPGA

Other

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S10B956C6

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S20B956C6

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S20B956I6

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S40B956C6N

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

41250

Yes

1.575 V

4697

CMOS

822

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

85 °C (185 °F)

4697 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B956

3

3.5 mm

40 mm

No

e1

822

40 mm

EP1S40B956I6ES

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S10B956I7

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S10B956I5

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S40B956C6ES

Altera

FPGA

Other

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S30B956C5N

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

3819

CMOS

1.5

Grid Array

1.425 V

1.27 mm

85 °C (185 °F)

3819 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B956

3.5 mm

40 mm

No

e1

40 s

245 °C (473 °F)

40 mm

EP1S20B956I6ES

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S30B956C6N

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

3819

CMOS

1.5

Grid Array

1.425 V

1.27 mm

85 °C (185 °F)

3819 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B956

3.5 mm

40 mm

No

e1

40 s

245 °C (473 °F)

40 mm

EP1S40B956I7ES

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S30B956C6

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

32470

Yes

1.575 V

3819

CMOS

726

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

85 °C (185 °F)

3819 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

3

3.5 mm

40 mm

No

e0

20 s

726

220 °C (428 °F)

40 mm

EP1S30B956I7ES

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1S80B956I6

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

79040

Yes

1.575 V

CMOS

1238

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

Tin Lead

Bottom

S-PBGA-B956

No

e0

1238

220 °C (428 °F)

EP1S30B956I6

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

32470

Yes

1.575 V

CMOS

726

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

Tin Lead

Bottom

S-PBGA-B956

No

e0

726

220 °C (428 °F)

EP1S40B956C5ES

Altera

FPGA

Other

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.