FQFP Field Programmable Gate Arrays (FPGA) 1,255

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP1C6Q240C6N

Intel

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

5980

Yes

1.575 V

598

185

1.5

1.5,1.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

85 °C (185 °F)

598 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

405 MHz

185

32 mm

EP1C6Q240C8N

Intel

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

5980

Yes

1.575 V

598

185

1.5

1.5,1.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

85 °C (185 °F)

598 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

275 MHz

185

32 mm

EP2C5Q208C8N

Intel

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

4608

Yes

1.25 V

288

CMOS

142

1.2

1.2,1.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

85 °C (185 °F)

288 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Also requires 3.3 V supply

e3

402.5 MHz

134

28 mm

EP1C12Q240C8N

Intel

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

12060

Yes

1.575 V

1206

173

1.5

1.5,1.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

85 °C (185 °F)

1206 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

275 MHz

173

32 mm

EP3C16Q240C8N

Intel

FPGA

Other

Gull Wing

240

FQFP

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

160

1.2

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

85 °C (185 °F)

15408 CLBS

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G240

3

4.1 mm

32 mm

No

e3

472.5 MHz

160

32 mm

A3P250-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

6144

CMOS

250000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

100 °C (212 °F)

6144 CLBS, 250000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

M1A3P250-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

6144

CMOS

250000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

100 °C (212 °F)

6144 CLBS, 250000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

30 s

245 °C (473 °F)

28 mm

EP2C8Q208C8N

Intel

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

8256

Yes

1.25 V

516

CMOS

138

1.2

1.2,1.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

85 °C (185 °F)

516 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Also requires 3.3 V supply

e3

402.5 MHz

130

28 mm

A3P1000-PQG208M

Microchip Technology

FPGA

Military

Gull Wing

208

FQFP

Square

Plastic/Epoxy

24576

Yes

1.575 V

24576

CMOS

154

1000000

1.5

Tray

1.5,1.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

125 °C (257 °F)

24576 CLBS, 1000000 Gates

-55 °C (-67 °F)

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

154

245 °C (473 °F)

28 mm

M1A3P1000-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

24576

CMOS

1000000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

100 °C (212 °F)

24576 CLBS, 1000000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

M1A3P1000-PQG208M

Microchip Technology

FPGA

Military

Gull Wing

208

FQFP

Square

Plastic/Epoxy

24576

Yes

1.575 V

24576

CMOS

154

1000000

1.5

Tray

1.5,1.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

125 °C (257 °F)

24576 CLBS, 1000000 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

154

245 °C (473 °F)

28 mm

A3P1000-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

24576

CMOS

1000000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

100 °C (212 °F)

24576 CLBS, 1000000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

M7A3P1000-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

24576

Yes

1.575 V

24576

CMOS

154

1000000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

85 °C (185 °F)

24576 CLBS, 1000000 Gates

-40 °C (-40 °F)

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

350 MHz

30 s

154

245 °C (473 °F)

28 mm

M1A3P250-PQG208

Microchip Technology

FPGA

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

6144

CMOS

250000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

85 °C (185 °F)

6144 CLBS, 250000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

EP3C40Q240C8N

Intel

FPGA

Other

Gull Wing

240

FQFP

Rectangular

Plastic/Epoxy

39600

Yes

1.25 V

39600

CMOS

128

1.2

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

85 °C (185 °F)

39600 CLBS

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G240

3

4.1 mm

32 mm

No

e3

472.5 MHz

128

32 mm

EP3C25Q240C8N

Intel

FPGA

Other

Gull Wing

240

FQFP

Rectangular

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

148

1.2

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

85 °C (185 °F)

24624 CLBS

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G240

3

4.1 mm

32 mm

No

e3

472.5 MHz

148

32 mm

EP2C20Q240C8N

Intel

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

18752

Yes

1.25 V

1172

CMOS

142

1.2

1.2,1.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

85 °C (185 °F)

1172 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

Also requires 3.3 V supply

e3

402.5 MHz

126

32 mm

A3P1000-PQG208

Microchip Technology

FPGA

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

24576

CMOS

1000000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

85 °C (185 °F)

24576 CLBS, 1000000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

A3PE1500-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

38400

Yes

1.575 V

38400

CMOS

147

1500000

1.5

Tray

1.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

85 °C (185 °F)

38400 CLBS, 1500000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

30 s

147

245 °C (473 °F)

28 mm

A3P250-PQG208

Microchip Technology

FPGA

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

6144

CMOS

250000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

85 °C (185 °F)

6144 CLBS, 250000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

XC3S400-4PQG208C

Xilinx

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

8064

Yes

1.26 V

896

CMOS

141

400000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.61 ns

896 CLBS, 400000 Gates

0 °C (32 °F)

Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

630 MHz

30 s

141

245 °C (473 °F)

28 mm

A3P600-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

13824

CMOS

600000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

100 °C (212 °F)

13824 CLBS, 600000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

LFXP2-8E-5QN208C

Lattice Semiconductor

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

146

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.494 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

435 MHz

40 s

146

245 °C (473 °F)

28 mm

LFXP2-5E-5QN208C

Lattice Semiconductor

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

5000

Yes

1.26 V

625

CMOS

146

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.494 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

435 MHz

40 s

146

245 °C (473 °F)

28 mm

M1A3P1000-PQG208

Microchip Technology

FPGA

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

24576

CMOS

1000000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

85 °C (185 °F)

24576 CLBS, 1000000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

EP2C8Q208I8N

Intel

FPGA

Gull Wing

208

FQFP

Square

Plastic/Epoxy

8256

Yes

1.25 V

516

CMOS

138

1.2

1.2,1.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

516 CLBS

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Also requires 3.3 V supply

e3

402.5 MHz

130

28 mm

EP2C5Q208I8N

Intel

FPGA

Gull Wing

208

FQFP

Square

Plastic/Epoxy

4608

Yes

1.25 V

288

CMOS

142

1.2

1.2,1.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

288 CLBS

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Also requires 3.3 V supply

e3

402.5 MHz

134

28 mm

A3P600-PQG208

Microchip Technology

FPGA

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

13824

CMOS

600000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

85 °C (185 °F)

13824 CLBS, 600000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

LFEC6E-3QN208C

Lattice Semiconductor

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

6100

Yes

1.26 V

768

147

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.56 ns

768 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

420 MHz

40 s

147

245 °C (473 °F)

28 mm

EP1C12Q240I7N

Intel

FPGA

Industrial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

12060

Yes

1.575 V

1206

173

1.5

1.5,1.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

100 °C (212 °F)

1206 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

320 MHz

173

32 mm

M1A3PE1500-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

38400

Yes

1.575 V

38400

CMOS

147

1500000

1.5

Tray

1.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

85 °C (185 °F)

38400 CLBS, 1500000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

147

245 °C (473 °F)

28 mm

M1A3P600-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

13824

Yes

1.575 V

CMOS

154

600000

1.5

Flatpack, Fine Pitch

QFP208,1.2SQ,20

1.425 V

.5 mm

100 °C (212 °F)

600000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

30 s

154

245 °C (473 °F)

28 mm

A3P400-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

9216

CMOS

400000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

100 °C (212 °F)

9216 CLBS, 400000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

EP3C25Q240C8NES

Intel

FPGA

Other

Gull Wing

240

FQFP

Rectangular

Plastic/Epoxy

Yes

1.25 V

24624

1.2

Flatpack, Fine Pitch

1.15 V

.5 mm

85 °C (185 °F)

24624 CLBS

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G240

4.1 mm

32 mm

No

e3

472.5 MHz

32 mm

XC3S400-4PQG208I

Xilinx

FPGA

Gull Wing

208

FQFP

Square

Plastic/Epoxy

8064

Yes

1.26 V

896

CMOS

141

400000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

0.61 ns

896 CLBS, 400000 Gates

Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

630 MHz

30 s

141

245 °C (473 °F)

28 mm

M7A3P1000-PQG208

Microchip Technology

FPGA

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

24576

Yes

1.575 V

24576

CMOS

154

1000000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

70 °C (158 °F)

24576 CLBS, 1000000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

154

245 °C (473 °F)

28 mm

A3PE600-PQ208I

Microsemi

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

13824

Yes

1.575 V

13824

CMOS

147

600000

1.5

1.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

85 °C (185 °F)

13824 CLBS, 600000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

350 MHz

147

28 mm

XC3S500E-4PQG208C

Xilinx

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10476

Yes

1.26 V

1164

CMOS

158

500000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.76 ns

1164 CLBS, 500000 Gates

0 °C (32 °F)

Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

572 MHz

30 s

126

245 °C (473 °F)

28 mm

APA1000-PQG208M

Microchip Technology

FPGA

Military

Gull Wing

208

FQFP

Square

Plastic/Epoxy

56320

Yes

2.7 V

CMOS

158

1000000

2.5

Tray

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

2.3 V

.5 mm

125 °C (257 °F)

1000000 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

180 MHz

30 s

158

245 °C (473 °F)

28 mm

XQ4013E-3HQ240N

Xilinx

FPGA

Military

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1368

Yes

5.5 V

576

CMOS

MIL-PRF-38535

192

10000

5

5 V

Flatpack, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

4.5 V

.5 mm

125 °C (257 °F)

2.01 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

Maximum usable gates = 30000

e0

125 MHz

30 s

192

225 °C (437 °F)

32 mm

APA600-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

21504

Yes

2.7 V

CMOS

158

600000

2.5

Tray

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

2.3 V

.5 mm

85 °C (185 °F)

600000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

180 MHz

30 s

158

245 °C (473 °F)

28 mm

A3P125-PQG208

Microchip Technology

FPGA

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

3072

CMOS

125000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

85 °C (185 °F)

3072 CLBS, 125000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

350 MHz

30 s

245 °C (473 °F)

28 mm

XC3S500E-4PQG208CS1

Xilinx

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10476

Yes

1.26 V

1164

CMOS

158

500000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.76 ns

1164 CLBS, 500000 Gates

0 °C (32 °F)

Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

572 MHz

30 s

126

245 °C (473 °F)

28 mm

EP1C12Q240C6N

Intel

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

12060

Yes

1.575 V

1206

173

1.5

1.5,1.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

85 °C (185 °F)

1206 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

405 MHz

173

32 mm

XC2S50-5PQG208C

Xilinx

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

176

50000

2.5

1.5/3.3,2.5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.7 ns

384 CLBS, 50000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Maximum usable gates 50000

e3

263 MHz

30 s

176

245 °C (473 °F)

28 mm

XC3S200-4PQG208C

Xilinx

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

4320

Yes

1.26 V

480

CMOS

141

200000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.61 ns

480 CLBS, 200000 Gates

0 °C (32 °F)

Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

630 MHz

30 s

141

245 °C (473 °F)

28 mm

M1A3P400-PQG208I

Microchip Technology

FPGA

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.575 V

9216

CMOS

400000

1.5

Tray

Flatpack, Fine Pitch

1.425 V

.5 mm

100 °C (212 °F)

9216 CLBS, 400000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

30 s

245 °C (473 °F)

28 mm

LFXP2-17E-5QN208I

Lattice Semiconductor

FPGA

Gull Wing

208

FQFP

Square

Plastic/Epoxy

17000

Yes

1.26 V

2125

CMOS

146

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.494 ns

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

435 MHz

40 s

146

245 °C (473 °F)

28 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.