Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
5980 |
Yes |
1.575 V |
598 |
185 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
598 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
405 MHz |
185 |
32 mm |
||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
5980 |
Yes |
1.575 V |
598 |
185 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
598 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
275 MHz |
185 |
32 mm |
||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
4608 |
Yes |
1.25 V |
288 |
CMOS |
142 |
1.2 |
1.2,1.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
288 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Also requires 3.3 V supply |
e3 |
402.5 MHz |
134 |
28 mm |
||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
12060 |
Yes |
1.575 V |
1206 |
173 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
1206 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
275 MHz |
173 |
32 mm |
||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Rectangular |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
15408 |
CMOS |
160 |
1.2 |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
15408 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
472.5 MHz |
160 |
32 mm |
||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
6144 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
6144 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8256 |
Yes |
1.25 V |
516 |
CMOS |
138 |
1.2 |
1.2,1.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
516 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Also requires 3.3 V supply |
e3 |
402.5 MHz |
130 |
28 mm |
||||||||
|
Microchip Technology |
FPGA |
Military |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.5 |
Tray |
1.5,1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
24576 CLBS, 1000000 Gates |
-55 °C (-67 °F) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
154 |
245 °C (473 °F) |
28 mm |
||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
24576 |
CMOS |
1000000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
24576 CLBS, 1000000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Military |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.5 |
Tray |
1.5,1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
24576 CLBS, 1000000 Gates |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
154 |
245 °C (473 °F) |
28 mm |
|||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
24576 |
CMOS |
1000000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
24576 CLBS, 1000000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
24576 CLBS, 1000000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
350 MHz |
30 s |
154 |
245 °C (473 °F) |
28 mm |
||||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
6144 CLBS, 250000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Rectangular |
Plastic/Epoxy |
39600 |
Yes |
1.25 V |
39600 |
CMOS |
128 |
1.2 |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
39600 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
472.5 MHz |
128 |
32 mm |
||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Rectangular |
Plastic/Epoxy |
24624 |
Yes |
1.25 V |
24624 |
CMOS |
148 |
1.2 |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
24624 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
472.5 MHz |
148 |
32 mm |
||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
18752 |
Yes |
1.25 V |
1172 |
CMOS |
142 |
1.2 |
1.2,1.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
1172 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Also requires 3.3 V supply |
e3 |
402.5 MHz |
126 |
32 mm |
||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
24576 |
CMOS |
1000000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
24576 CLBS, 1000000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
38400 |
Yes |
1.575 V |
38400 |
CMOS |
147 |
1500000 |
1.5 |
Tray |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
38400 CLBS, 1500000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
30 s |
147 |
245 °C (473 °F) |
28 mm |
||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
6144 CLBS, 250000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8064 |
Yes |
1.26 V |
896 |
CMOS |
141 |
400000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.61 ns |
896 CLBS, 400000 Gates |
0 °C (32 °F) |
Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
630 MHz |
30 s |
141 |
245 °C (473 °F) |
28 mm |
|||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
13824 |
CMOS |
600000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
13824 CLBS, 600000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8000 |
Yes |
1.26 V |
1000 |
CMOS |
146 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.494 ns |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
435 MHz |
40 s |
146 |
245 °C (473 °F) |
28 mm |
|||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5000 |
Yes |
1.26 V |
625 |
CMOS |
146 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.494 ns |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
435 MHz |
40 s |
146 |
245 °C (473 °F) |
28 mm |
|||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
24576 |
CMOS |
1000000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
24576 CLBS, 1000000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Intel |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8256 |
Yes |
1.25 V |
516 |
CMOS |
138 |
1.2 |
1.2,1.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
516 CLBS |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Also requires 3.3 V supply |
e3 |
402.5 MHz |
130 |
28 mm |
|||||||||||
|
Intel |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
4608 |
Yes |
1.25 V |
288 |
CMOS |
142 |
1.2 |
1.2,1.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
288 CLBS |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Also requires 3.3 V supply |
e3 |
402.5 MHz |
134 |
28 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
13824 |
CMOS |
600000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
13824 CLBS, 600000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
6100 |
Yes |
1.26 V |
768 |
147 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.56 ns |
768 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
420 MHz |
40 s |
147 |
245 °C (473 °F) |
28 mm |
|||||||
|
Intel |
FPGA |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
12060 |
Yes |
1.575 V |
1206 |
173 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
100 °C (212 °F) |
1206 CLBS |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
320 MHz |
173 |
32 mm |
||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
38400 |
Yes |
1.575 V |
38400 |
CMOS |
147 |
1500000 |
1.5 |
Tray |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
38400 CLBS, 1500000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
147 |
245 °C (473 °F) |
28 mm |
|||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
13824 |
Yes |
1.575 V |
CMOS |
154 |
600000 |
1.5 |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
1.425 V |
.5 mm |
100 °C (212 °F) |
600000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
30 s |
154 |
245 °C (473 °F) |
28 mm |
||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
9216 |
CMOS |
400000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
9216 CLBS, 400000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Rectangular |
Plastic/Epoxy |
Yes |
1.25 V |
24624 |
1.2 |
Flatpack, Fine Pitch |
1.15 V |
.5 mm |
85 °C (185 °F) |
24624 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
472.5 MHz |
32 mm |
||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8064 |
Yes |
1.26 V |
896 |
CMOS |
141 |
400000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
0.61 ns |
896 CLBS, 400000 Gates |
Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
630 MHz |
30 s |
141 |
245 °C (473 °F) |
28 mm |
||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
70 °C (158 °F) |
24576 CLBS, 1000000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
154 |
245 °C (473 °F) |
28 mm |
||||||||
Microsemi |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
13824 |
Yes |
1.575 V |
13824 |
CMOS |
147 |
600000 |
1.5 |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
13824 CLBS, 600000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
350 MHz |
147 |
28 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10476 |
Yes |
1.26 V |
1164 |
CMOS |
158 |
500000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
1164 CLBS, 500000 Gates |
0 °C (32 °F) |
Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
572 MHz |
30 s |
126 |
245 °C (473 °F) |
28 mm |
|||||
|
Microchip Technology |
FPGA |
Military |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
56320 |
Yes |
2.7 V |
CMOS |
158 |
1000000 |
2.5 |
Tray |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
125 °C (257 °F) |
1000000 Gates |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
180 MHz |
30 s |
158 |
245 °C (473 °F) |
28 mm |
||||||
Xilinx |
FPGA |
Military |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
1368 |
Yes |
5.5 V |
576 |
CMOS |
MIL-PRF-38535 |
192 |
10000 |
5 |
5 V |
Flatpack, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
125 °C (257 °F) |
2.01 ns |
576 CLBS, 10000 Gates |
-55 °C (-67 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Maximum usable gates = 30000 |
e0 |
125 MHz |
30 s |
192 |
225 °C (437 °F) |
32 mm |
||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
21504 |
Yes |
2.7 V |
CMOS |
158 |
600000 |
2.5 |
Tray |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
85 °C (185 °F) |
600000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
180 MHz |
30 s |
158 |
245 °C (473 °F) |
28 mm |
||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
3072 |
CMOS |
125000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
3072 CLBS, 125000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10476 |
Yes |
1.26 V |
1164 |
CMOS |
158 |
500000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
1164 CLBS, 500000 Gates |
0 °C (32 °F) |
Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
572 MHz |
30 s |
126 |
245 °C (473 °F) |
28 mm |
|||||
|
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
12060 |
Yes |
1.575 V |
1206 |
173 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
1206 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
405 MHz |
173 |
32 mm |
||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
2.625 V |
384 |
176 |
50000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.7 ns |
384 CLBS, 50000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates 50000 |
e3 |
263 MHz |
30 s |
176 |
245 °C (473 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
4320 |
Yes |
1.26 V |
480 |
CMOS |
141 |
200000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.61 ns |
480 CLBS, 200000 Gates |
0 °C (32 °F) |
Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
630 MHz |
30 s |
141 |
245 °C (473 °F) |
28 mm |
|||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
9216 |
CMOS |
400000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
9216 CLBS, 400000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
17000 |
Yes |
1.26 V |
2125 |
CMOS |
146 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.494 ns |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
435 MHz |
40 s |
146 |
245 °C (473 °F) |
28 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.