HCGA Field Programmable Gate Arrays (FPGA) 11

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	No. of Outputs	Length
XQVR1000-4CG560M	Xilinx	FPGA	Military	560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS		404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Heat Sink/Slug	CGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-X560	4.9 mm	42.5 mm	No		404	42.5 mm
XQV1000-4CGG560Q	Xilinx	FPGA	Military	560	HCGA	Square		Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q		1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X560	4.9 mm	42.5 mm	No	e3		42.5 mm
XQV1000-4CG560M	Xilinx	FPGA	Military	560	HCGA	Square		Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS	MIL-PRF-38535	404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Heat Sink/Slug	CGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X560	4.9 mm	42.5 mm	No	e0	404	42.5 mm
XQVR1000-4CG560V	Xilinx	FPGA	Military	560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS		404	1124022	2.5	1.5/3.3,2.5 V	Grid Array, Heat Sink/Slug	CGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X560	4.9 mm	42.5 mm	No	e0	404	42.5 mm
XQVR1000-4CGG560V	Xilinx	FPGA	Military	560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	6144	CMOS			1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X560	4.9 mm	42.5 mm	No	e3		42.5 mm
XQVR1000-4CG560Q	Xilinx	FPGA	Military	560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q	404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Heat Sink/Slug	CGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X560	4.9 mm	42.5 mm	No	e0	404	42.5 mm
XQV1000-4CG560Q	Xilinx	FPGA	Military	560	HCGA	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q		1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X560	4.9 mm	42.5 mm	No	e0		42.5 mm
XQVR1000-4CGG560M	Xilinx	FPGA	Military	560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	6144	CMOS			1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X560	4.9 mm	42.5 mm	No	e3		42.5 mm
5962-9957401QXC	Xilinx	FPGA	Military	560	HCGA	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q		1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Gold	Bottom	S-CBGA-X560	4.9 mm	42.5 mm	No	e4		42.5 mm
5962R9957401QXC	Xilinx	FPGA	Military	560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q		1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X560	4.9 mm	42.5 mm	No	e0		42.5 mm
XQVR1000-4CGG560Q	Xilinx	FPGA	Military	560	HCGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	27648	Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class Q		1124022	2.5		Grid Array, Heat Sink/Slug			2.375 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X560	4.9 mm	42.5 mm	No	e3		42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.