HIPGA Field Programmable Gate Arrays (FPGA) 67

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
XH4062XLPG475C	Xilinx	FPGA		Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS				3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch				2.54 mm					Matte Tin	Perpendicular	S-CPGA-P475	5.334 mm	54.864 mm	No		e3			54.864 mm
XC4052XLPG411C	Xilinx	FPGA		Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	1936	CMOS			33000	5		Grid Array, Heat Sink/Slug, Interstitial Pitch			4.75 V	2.54 mm			1936 CLBS, 33000 Gates			Perpendicular	S-CPGA-P411	4.318 mm	52.324 mm	No	Typical gates = 33000-100000				52.324 mm
XC4036XL-08PG411C	Xilinx	FPGA	Other	Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired	1296	No	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	SPGA411,39X39	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P411	5.969 mm	52.324 mm	No	Typical gates = 22000-65000		238 MHz	288	52.324 mm
XC4062XL-09PG475C	Xilinx	FPGA	Other	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired	2304	No	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	SPGA475,41X41	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.2 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P475	5.969 mm	54.864 mm	No	Typical gates = 40000-130000		217 MHz	384	54.864 mm
XC4036XL-3PG411M	Xilinx	FPGA	Military	Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	1296	CMOS			22000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)		1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P411	5.334 mm	52.324 mm	No	Can also use 65000 gates				52.324 mm
XC4044XL-09PG411C	Xilinx	FPGA	Other	Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired	1600	No	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	SPGA411,39X39	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.2 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P411	5.969 mm	52.324 mm	No	Typical gates = 27000-80000		217 MHz	320	52.324 mm
5962-9957501QXC	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P475	5.969 mm	54.864 mm	No		e4	200 MHz		54.864 mm
XQ4085XL-3PG475M	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	3136				55000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	2.9 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P475	5.969 mm	54.864 mm	No	Maximum usable gates 180000	e0	166 MHz		54.864 mm
XC4036EX-1PG411C	Xilinx	FPGA	Other	Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	1296	CMOS			22000	5		Grid Array, Heat Sink/Slug, Interstitial Pitch			4.75 V	2.54 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P411	5.334 mm	52.324 mm	No					52.324 mm
5962-9851001QXX	Xilinx	FPGA	Military	Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q		22000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P411	5.334 mm	52.324 mm	No			166 MHz		52.324 mm
XC40150XV-9PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	5184	CMOS			100000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	1.2 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			188 MHz		57.404 mm
XC40150XV-7PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	5184	CMOS			100000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	0.9 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			250 MHz		57.404 mm
XC4044EX-4PG411C	Xilinx	FPGA		Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	1600	CMOS			27000	5		Grid Array, Heat Sink/Slug, Interstitial Pitch			4.75 V	2.54 mm	85 °C (185 °F)		1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P411	4.318 mm	52.324 mm	No	Typical gates = 27000-80000	e0	111 MHz		52.324 mm
XH4036EX-3PG411C	Xilinx	FPGA		Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array, Heat Sink/Slug, Interstitial Pitch				2.54 mm					Matte Tin	Perpendicular	S-CPGA-P411	5.334 mm	52.324 mm	No		e3			52.324 mm
5962-9851001QXB	Xilinx	FPGA	Military	Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q		22000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P411	5.334 mm	52.324 mm	No		e0	166 MHz		52.324 mm
XC40150XV-07PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	5184	No	2.7 V	5184	CMOS		448	100000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm	85 °C (185 °F)	1 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 300000 gates		296 MHz	448	57.404 mm
XH4044EX-3PG411I	Xilinx	FPGA		Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array, Heat Sink/Slug, Interstitial Pitch				2.54 mm					Matte Tin	Perpendicular	S-CPGA-P411	5.334 mm	52.324 mm	No		e3			52.324 mm
XC40150XV-08PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	5184	No	2.7 V	5184	CMOS		448	100000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm	85 °C (185 °F)	1.1 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P559	5.969 mm	57.404 mm	No	Can also use 300000 gates		258 MHz	448	57.404 mm
XC40250XV-9PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	8464	CMOS			180000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	1.2 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P559	5.334 mm	57.404 mm	No			188 MHz		57.404 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.