HLBGA Field Programmable Gate Arrays (FPGA) 108

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Equivalent Gates	Nominal Supply Voltage (V)	Package Style (Meter)	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Length
XC4052XLA-8BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1936	CMOS	33000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	263 MHz	40 mm
XC4085XLA-8BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	3136	CMOS	55000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm		1 ns	3136 CLBS, 55000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	263 MHz	40 mm
XC40110XV-7BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	4096	CMOS	75000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm	85 °C (185 °F)	0.9 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	250 MHz	40 mm
XC40200XV-9BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	7056	CMOS	130000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm		1.2 ns	7056 CLBS, 130000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	188 MHz	40 mm
XC4036XLA-8BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1296	CMOS	22000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm		1 ns	1296 CLBS, 22000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	263 MHz	40 mm
XC4036XLA-9BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1296	CMOS	22000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm		1.1 ns	1296 CLBS, 22000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	227 MHz	40 mm
XH4044EX-3BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes			CMOS		5	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1		40 mm
XH4036EX-3BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes			CMOS		5	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1		40 mm
XH4436EX-3BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes			CMOS		3.3	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm					Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0		40 mm
XC40110XV-9BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	4096	CMOS	75000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm		1.2 ns	4096 CLBS, 75000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	188 MHz	40 mm
XC40250XV-9BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	8464	CMOS	180000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm		1.2 ns	8464 CLBS, 180000 Gates			Bottom	S-PBGA-B432		1.7 mm	40 mm	No		188 MHz	40 mm
XC4062XLA-8BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	2304	CMOS	40000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm		1 ns	2304 CLBS, 40000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	263 MHz	40 mm
XC4085XLA-9BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	3136	CMOS	55000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	227 MHz	40 mm
XH4052XLBGG432C	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes			CMOS		3.3	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1		40 mm
XC4085XLA-9BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	3136	CMOS	55000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	227 MHz	40 mm
XC4036EX-2BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	5.5 V	1296	CMOS	22000	5	Grid Array, Heat Sink/Slug, Low Profile	4.5 V	1.27 mm			1296 CLBS, 22000 Gates			Bottom	S-PBGA-B432		1.7 mm	40 mm	No		166 MHz	40 mm
XC4085XLA-8BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	3136	CMOS	55000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	263 MHz	40 mm
XC4044XLA-9BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1600	CMOS	27000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	227 MHz	40 mm
XC4044XLA-8BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1600	CMOS	27000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	263 MHz	40 mm
XC40200XV-8BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	7056	CMOS	130000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm		1.1 ns	7056 CLBS, 130000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	217 MHz	40 mm
XC40125XVBG560	Xilinx	FPGA		Ball	560	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	4624	CMOS	80000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm			4624 CLBS, 80000 Gates			Bottom	S-PBGA-B560		1.7 mm	42.5 mm	No			42.5 mm
XC4062XLT-1BG432	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes		2126			3.3	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm			2126 CLBS			Bottom	S-PBGA-B432		1.7 mm	40 mm	No			40 mm
XH4044EX-3BG432C	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes			CMOS		5	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm					Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0		40 mm
XC4044XLA-7BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1600	CMOS	27000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	294 MHz	40 mm
XC4085XLA-8BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	3136	CMOS	55000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm		1 ns	3136 CLBS, 55000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	263 MHz	40 mm
XC40150XV-9BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	5184	CMOS	100000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm		1.2 ns	5184 CLBS, 100000 Gates			Bottom	S-PBGA-B432		1.7 mm	40 mm	No		188 MHz	40 mm
XC4062XLA-7BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	2304	CMOS	40000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	0.9 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	294 MHz	40 mm
XH4436EX-3BGG432C	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes			CMOS		3.3	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1		40 mm
XH4036XLBGG432C	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes			CMOS		3.3	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1		40 mm
XH4044XLBGG432C	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes			CMOS		3.3	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1		40 mm
XC4062XLA-9BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	2304	CMOS	40000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm		1.1 ns	2304 CLBS, 40000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	227 MHz	40 mm
XC4062XLA-8BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	2304	CMOS	40000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	263 MHz	40 mm
XC4036XLA-8BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1296	CMOS	22000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	263 MHz	40 mm
XC40200XV-8BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	7056	CMOS	130000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm		1.1 ns	7056 CLBS, 130000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	217 MHz	40 mm
XH4036XLBG432C	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes			CMOS		3.3	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm					Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0		40 mm
XC40150XV-7BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	5184	CMOS	100000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm	85 °C (185 °F)	0.9 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B432		1.7 mm	40 mm	No		250 MHz	40 mm
XC4036XLA-7BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1296	CMOS	22000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	294 MHz	40 mm
XC4036XLA-9BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1296	CMOS	22000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	227 MHz	40 mm
XC4044XLA-9BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1600	CMOS	27000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm		1.1 ns	1600 CLBS, 27000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	227 MHz	40 mm
XC4085XLA-9BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	3136	CMOS	55000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	227 MHz	40 mm
XC40200XV-8BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	7056	CMOS	130000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	7056 CLBS, 130000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	217 MHz	40 mm
XH4436EX-3BG432C	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes			CMOS		3.3	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm					Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0		40 mm
XC4052XLA-8BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1936	CMOS	33000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm		1 ns	1936 CLBS, 33000 Gates		Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	No	e0	263 MHz	40 mm
XC40110XV-8BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	4096	CMOS	75000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	217 MHz	40 mm
XC40200XV-8BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	7056	CMOS	130000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	7056 CLBS, 130000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	217 MHz	40 mm
XC40250XV-8BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	2.7 V	8464	CMOS	180000	2.5	Grid Array, Heat Sink/Slug, Low Profile	2.3 V	1.27 mm		1.1 ns	8464 CLBS, 180000 Gates			Bottom	S-PBGA-B432		1.7 mm	40 mm	No		217 MHz	40 mm
XC4044XLA-8BGG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes	3.6 V	1600	CMOS	27000	3.3	Grid Array, Heat Sink/Slug, Low Profile	3 V	1.27 mm		1 ns	1600 CLBS, 27000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e1	263 MHz	40 mm
XH4052XLBG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy	Yes			CMOS		3.3	Grid Array, Heat Sink/Slug, Low Profile		1.27 mm					Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0		40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.