Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.25 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
16.38 ns |
1232 CLBS, 8000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
48 MHz |
140 |
39.88 mm |
||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
17.55 ns |
1232 CLBS, 8000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
43 MHz |
140 |
39.88 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
50 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.25 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
16.38 ns |
1232 CLBS, 8000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
48 MHz |
140 |
39.88 mm |
||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.25 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
1232 CLBS, 8000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
65 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
39 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
1232 CLBS, 8000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
60 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
18.72 ns |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
39 MHz |
140 |
39.88 mm |
|||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
50 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
1232 CLBS, 8000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
60 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
17.55 ns |
1232 CLBS, 8000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
43 MHz |
140 |
39.88 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
39 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
50 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
50 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
39 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.25 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
1232 CLBS, 8000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
65 MHz |
140 |
39.88 mm |
|||||||||||
|
Xilinx |
FPGA |
Pin/Peg |
299 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1024 |
No |
1024 |
CMOS |
256 |
18000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA299,20X20 |
Field Programmable Gate Arrays |
2.54 mm |
1024 CLBS, 18000 Gates |
Perpendicular |
S-CPGA-P299 |
4.318 mm |
52.324 mm |
No |
Max usable 28000 Logic gates |
166 MHz |
256 |
52.324 mm |
|||||||||||||||
Xilinx |
FPGA |
Pin/Peg |
223 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
324 |
No |
5.5 V |
324 |
CMOS |
196 |
10000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA223,18X18 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
4.6 ns |
324 CLBS, 10000 Gates |
Perpendicular |
S-CPGA-P223 |
1 |
4.318 mm |
47.244 mm |
No |
MAX available 16000 Logic gates |
83 MHz |
196 |
47.244 mm |
||||||||||||
|
Xilinx |
FPGA |
Pin/Peg |
175 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
320 |
No |
5.5 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA175,16X16 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
5.1 ns |
320 CLBS, 5000 Gates |
Perpendicular |
S-CPGA-P175 |
4.318 mm |
42.164 mm |
No |
Max usable 6000 Logic gates |
113 MHz |
144 |
42.164 mm |
||||||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
175 |
HPGA |
Square |
Plastic/Epoxy |
No |
5.25 V |
320 |
CMOS |
5000 |
5 |
Grid Array, Heat Sink/Slug |
4.75 V |
2.54 mm |
85 °C (185 °F) |
2.7 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Perpendicular |
S-PPGA-P175 |
4.191 mm |
42.164 mm |
No |
Max usable 6000 Logic gates |
270 MHz |
42.164 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Pin/Peg |
299 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1024 |
No |
3.6 V |
1024 |
CMOS |
256 |
18000 |
3.3 |
3.3 V |
Grid Array, Heat Sink/Slug |
PGA299,20X20 |
Field Programmable Gate Arrays |
3 V |
2.54 mm |
1.6 ns |
1024 CLBS, 18000 Gates |
Perpendicular |
S-CPGA-P299 |
4.318 mm |
52.324 mm |
No |
Max usable 28000 Logic gates |
166 MHz |
256 |
52.324 mm |
||||||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
559 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
3136 |
No |
3.6 V |
3136 |
CMOS |
448 |
55000 |
3.3 |
3.3 V |
Grid Array, Heat Sink/Slug |
HSPGA559,43X43 |
Field Programmable Gate Arrays |
3 V |
2.54 mm |
85 °C (185 °F) |
1.3 ns |
3136 CLBS, 55000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P559 |
5.969 mm |
57.404 mm |
No |
Max usable 85000 Logic gates |
200 MHz |
448 |
57.404 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
191 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
784 |
No |
5.25 V |
196 |
CMOS |
148 |
6000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA191M,18X18 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
4.6 ns |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P191 |
4.318 mm |
47.244 mm |
No |
MAX available 10000 Logic gates |
83 MHz |
148 |
47.244 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
191 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
400 |
No |
5.25 V |
400 |
CMOS |
160 |
7000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA191M,18X18 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
1.3 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P191 |
4.318 mm |
47.244 mm |
No |
Max usable 10000 Logic gates |
166 MHz |
160 |
47.244 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
411 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1600 |
No |
3.6 V |
1600 |
CMOS |
320 |
27000 |
3.3 |
3.3 V |
Grid Array, Heat Sink/Slug |
SPGA411,39X39 |
Field Programmable Gate Arrays |
3 V |
2.54 mm |
85 °C (185 °F) |
1.6 ns |
1600 CLBS, 27000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P411 |
5.969 mm |
52.324 mm |
No |
Max usable 44000 Logic gates |
166 MHz |
320 |
52.324 mm |
|||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
175 |
HPGA |
Square |
Plastic/Epoxy |
320 |
No |
5.25 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA175,16X16 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
2.7 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-PPGA-P175 |
4.191 mm |
42.164 mm |
No |
Max usable 6000 Logic gates |
e0 |
270 MHz |
144 |
42.164 mm |
||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
175 |
HPGA |
Square |
Plastic/Epoxy |
320 |
No |
5.25 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA175,16X16 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
1.75 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Perpendicular |
S-PPGA-P175 |
4.191 mm |
42.164 mm |
No |
Max usable 6000 Logic gates |
323 MHz |
144 |
42.164 mm |
||||||||||
|
Xilinx |
FPGA |
Pin/Peg |
411 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1600 |
No |
3.6 V |
1600 |
CMOS |
320 |
27000 |
3.3 |
3.3 V |
Grid Array, Heat Sink/Slug |
SPGA411,39X39 |
Field Programmable Gate Arrays |
3 V |
2.54 mm |
1.5 ns |
1600 CLBS, 27000 Gates |
Perpendicular |
S-CPGA-P411 |
5.969 mm |
52.324 mm |
No |
Max usable 44000 Logic gates |
179 MHz |
320 |
52.324 mm |
||||||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
175 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.25 V |
320 |
CMOS |
5000 |
5 |
Grid Array, Heat Sink/Slug |
4.75 V |
2.54 mm |
85 °C (185 °F) |
1.5 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P175 |
42.164 mm |
Max usable 6000 Logic gates |
370 MHz |
42.164 mm |
||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
84 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
144 |
No |
5.25 V |
144 |
CMOS |
74 |
2000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
5.1 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P84 |
5.207 mm |
27.94 mm |
No |
Max usable 3000 Logic gates |
113 MHz |
74 |
27.94 mm |
|||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
175 |
HPGA |
Square |
Plastic/Epoxy |
484 |
No |
5.25 V |
484 |
CMOS |
144 |
6500 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA175,16X16 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
2.2 ns |
484 CLBS, 6500 Gates |
0 °C (32 °F) |
Perpendicular |
S-PPGA-P175 |
1 |
4.191 mm |
42.164 mm |
No |
Max usable 7500 Logic gates |
323 MHz |
144 |
42.164 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
156 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
608 |
No |
5.25 V |
256 |
CMOS |
125 |
4000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA156,16X16 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
2 ns |
256 CLBS, 4000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P156 |
4.318 mm |
42.164 mm |
No |
Max usable 6000 Logic gates |
125 MHz |
125 |
42.164 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
411 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1936 |
No |
3.6 V |
1936 |
CMOS |
352 |
33000 |
3.3 |
3.3 V |
Grid Array, Heat Sink/Slug |
SPGA411,39X39 |
Field Programmable Gate Arrays |
3 V |
2.54 mm |
85 °C (185 °F) |
1.5 ns |
1936 CLBS, 33000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P411 |
5.969 mm |
52.324 mm |
No |
Max usable 52000 Logic gates |
179 MHz |
352 |
52.324 mm |
|||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
223 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
576 |
No |
5.25 V |
576 |
CMOS |
192 |
10000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA223,18X18 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
1.3 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P223 |
1 |
4.318 mm |
47.244 mm |
No |
Max usable 13000 Logic gates |
e0 |
166 MHz |
192 |
47.244 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
299 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1024 |
No |
3.6 V |
1024 |
CMOS |
256 |
18000 |
3.3 |
3.3 V |
Grid Array, Heat Sink/Slug |
PGA299,20X20 |
Field Programmable Gate Arrays |
3 V |
2.54 mm |
85 °C (185 °F) |
1.6 ns |
1024 CLBS, 18000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P299 |
4.318 mm |
52.324 mm |
No |
Max usable 28000 Logic gates |
166 MHz |
256 |
52.324 mm |
|||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
411 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
3078 |
No |
3.6 V |
1296 |
CMOS |
288 |
22000 |
3.3 |
3.3 V |
Grid Array, Heat Sink/Slug |
SPGA411,39X39 |
Field Programmable Gate Arrays |
3 V |
2.54 mm |
85 °C (185 °F) |
1.2 ns |
1296 CLBS, 22000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P411 |
5.969 mm |
52.324 mm |
No |
Max usable 36000 Logic gates |
217 MHz |
288 |
52.324 mm |
||||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
120 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
100 |
No |
5.25 V |
100 |
CMOS |
80 |
2000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA120,13X13 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
1.6 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P120 |
4.318 mm |
34.544 mm |
No |
Max usable 3000 Logic gates |
125 MHz |
80 |
34.544 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
191 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
324 |
No |
5.25 V |
324 |
CMOS |
144 |
6000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA191M,18X18 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
2 ns |
324 CLBS, 6000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P191 |
4.318 mm |
47.244 mm |
No |
Max usable 8000 Logic gates |
125 MHz |
144 |
47.244 mm |
|||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
175 |
HPGA |
Square |
Plastic/Epoxy |
484 |
No |
5.25 V |
484 |
CMOS |
144 |
6500 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA175,16X16 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
1.5 ns |
484 CLBS, 6500 Gates |
0 °C (32 °F) |
Perpendicular |
S-PPGA-P175 |
1 |
4.191 mm |
42.164 mm |
No |
Max usable 7500 Logic gates |
370 MHz |
144 |
42.164 mm |
|||||||||
|
Xilinx |
FPGA |
Pin/Peg |
156 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
608 |
No |
5.5 V |
256 |
CMOS |
125 |
4000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA156,16X16 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
2 ns |
256 CLBS, 4000 Gates |
Perpendicular |
S-CPGA-P156 |
4.318 mm |
42.164 mm |
No |
Max usable 6000 Logic gates |
125 MHz |
125 |
42.164 mm |
||||||||||||
|
Xilinx |
FPGA |
Pin/Peg |
156 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
64 |
No |
5.5 V |
64 |
CMOS |
84 |
2000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA156,16X16 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
4.6 ns |
64 CLBS, 2000 Gates |
Perpendicular |
S-CPGA-P156 |
4.318 mm |
42.164 mm |
No |
MAX available 3000 Logic gates |
83 MHz |
84 |
42.164 mm |
||||||||||||
|
Xilinx |
FPGA |
Pin/Peg |
411 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1296 |
No |
3.6 V |
1296 |
CMOS |
288 |
22000 |
3.3 |
3.3 V |
Grid Array, Heat Sink/Slug |
SPGA411,39X39 |
Field Programmable Gate Arrays |
3 V |
2.54 mm |
1.3 ns |
1296 CLBS, 22000 Gates |
Perpendicular |
S-CPGA-P411 |
5.969 mm |
52.324 mm |
No |
Max usable 36000 Logic gates |
200 MHz |
288 |
52.324 mm |
||||||||||||
Xilinx |
FPGA |
Pin/Peg |
175 |
HPGA |
Square |
Plastic/Epoxy |
No |
5.5 V |
320 |
CMOS |
5000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
2.2 ns |
320 CLBS, 5000 Gates |
Matte Tin |
Perpendicular |
S-PPGA-P175 |
4.191 mm |
42.164 mm |
No |
Max usable 6000 Logic gates |
e3 |
323 MHz |
42.164 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
411 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
3078 |
No |
3.6 V |
1296 |
CMOS |
288 |
22000 |
3.3 |
3.3 V |
Grid Array, Heat Sink/Slug |
SPGA411,39X39 |
Field Programmable Gate Arrays |
3 V |
2.54 mm |
85 °C (185 °F) |
1.1 ns |
1296 CLBS, 22000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P411 |
5.969 mm |
52.324 mm |
No |
Max usable 36000 Logic gates |
238 MHz |
288 |
52.324 mm |
||||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
191 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
400 |
No |
5.25 V |
400 |
CMOS |
160 |
7000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA191M,18X18 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
1.6 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P191 |
4.318 mm |
47.244 mm |
No |
Max usable 10000 Logic gates |
125 MHz |
160 |
47.244 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
299 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
484 |
No |
5.25 V |
484 |
CMOS |
244 |
15000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA299,20X20 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
3.8 ns |
484 CLBS, 15000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P299 |
4.318 mm |
52.324 mm |
No |
MAX available 23000 Logic gates |
83 MHz |
244 |
52.324 mm |
|||||||||
|
Xilinx |
FPGA |
Pin/Peg |
120 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
100 |
No |
5.5 V |
100 |
CMOS |
80 |
2000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA120,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
1.6 ns |
100 CLBS, 2000 Gates |
Perpendicular |
S-CPGA-P120 |
4.318 mm |
34.544 mm |
No |
Max usable 3000 Logic gates |
125 MHz |
80 |
34.544 mm |
||||||||||||
Xilinx |
FPGA |
Pin/Peg |
175 |
HPGA |
Square |
Plastic/Epoxy |
No |
5.5 V |
320 |
CMOS |
5000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
2.7 ns |
320 CLBS, 5000 Gates |
Perpendicular |
S-PPGA-P175 |
4.191 mm |
42.164 mm |
No |
Max usable 6000 Logic gates |
270 MHz |
42.164 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.