LFBGA Field Programmable Gate Arrays (FPGA) 1,286

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A75T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300	1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		300		10 mm
XC7A12T-3FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		e1	1412 MHz	30 s	150	260 °C (500 °F)	17 mm
XC6SLX25-N3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	226	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	806 MHz	30 s	226	260 °C (500 °F)	15 mm
XC7A50T-2FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		e1	1286 MHz	30 s	250	260 °C (500 °F)	17 mm
XC6SLX16-2CS324I4204	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139		232	1.2		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm			667 MHz		232		15 mm
EP2AGX65HU17I5	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		2530 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX45DU17C5N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP3C16U256I8N	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V		CMOS	168	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm					Tin Silver Copper	Bottom	S-PBGA-B256		1.5 mm	14 mm	No	e1			168		14 mm
5CEFA4U15I7N	Altera	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm						Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP2AGX45DU17C4	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65HU17I3	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		2530 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65CU17	Altera	FPGA		Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm						Bottom	S-PBGA-B358		1.7 mm	17 mm							17 mm
EP3C5U256C7	Altera	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.5 mm	14 mm	No	e0	472.5 MHz	20 s	182	235 °C (455 °F)	14 mm
EP2AGX45HU17I5	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP4CE6U14	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.24 V	47			1.2		Grid Array, Low Profile, Fine Pitch			1.16 V	.8 mm			47 CLBS			Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
EP3C25U256A7	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2	1.2/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm			24624 CLBS			Bottom	S-PBGA-B256		1.5 mm	14 mm	No				156		14 mm
5CEFA2U15I7N	Altera	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm						Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
5CEBA4U15C7	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP3C5U256I6N	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V		CMOS	182	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm					Tin Silver Copper	Bottom	S-PBGA-B256		1.5 mm	14 mm	No	e1			182		14 mm
5CGXBC7B6M15C7N	Altera	FPGA	Other	Ball	484	LFBGA	Square	Plastic/Epoxy	149500	Yes	1.13 V	5648	CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA484,28X28,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		1.25 mm	15 mm	No				240		15 mm
5CEFA4U15C8N	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP3C25U256I7	Altera	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		24624 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.5 mm	14 mm	No	e0	472.5 MHz	20 s	156	235 °C (455 °F)	14 mm
EP2AGX65CU17I3N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		2530 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1			156		17 mm
EP4CE10U14	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.24 V	47			1.2		Grid Array, Low Profile, Fine Pitch			1.16 V	.8 mm			47 CLBS			Bottom	S-PBGA-B256		1.5 mm	14 mm							14 mm
5CEBA2U15C6	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP2AGX45HU17I3N	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		1805 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1			156		17 mm
EP2AGX45FU17C6N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP3C5U256I7	Altera	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		5136 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.5 mm	14 mm	No	e0	472.5 MHz	20 s	182	235 °C (455 °F)	14 mm
EP2AGX65HU17C4N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX65EU17I5	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		2530 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
5CEBA4U15A7	Altera	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP2AGX45EU17C4	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65CU17I3	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	60240	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		2530 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0	500 MHz		156		17 mm
EP3C10U256A7	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2	1.2/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm			10320 CLBS			Bottom	S-PBGA-B256		1.5 mm	14 mm	No				182		14 mm
EP2AGX45CU17I3	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
EP2AGX65HU17C5N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
5CEBA4U15C6N	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP3C16U256I6	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V		CMOS	168	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm					Tin Lead	Bottom	S-PBGA-B256	1	1.5 mm	14 mm	No	e0			168		14 mm
EP2AGX45EU17I3	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
5CEFA2U15I7	Altera	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm						Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP2AGX45HU17C4	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
5CEBA2U15C7	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP2AGX65DU17I3	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		2530 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm		e0			156		17 mm
5CEFA2U15A7N	Altera	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm							15 mm
EP2AGX65HU17C6N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX45EU17C6N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP2AGX65DU17C4N	Altera	FPGA	Other	Ball	358	LFBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Low Profile, Fine Pitch			.87 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B358		1.7 mm	17 mm		e1	500 MHz				17 mm
EP3C16U256I6N	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V		CMOS	168	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm					Tin Silver Copper	Bottom	S-PBGA-B256		1.5 mm	14 mm	No	e1			168		14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.